CN1207782C - 集成电路器件、用于智能卡的电子部件及制造该器件的方法 - Google Patents

集成电路器件、用于智能卡的电子部件及制造该器件的方法 Download PDF

Info

Publication number
CN1207782C
CN1207782C CNB008036047A CN00803604A CN1207782C CN 1207782 C CN1207782 C CN 1207782C CN B008036047 A CNB008036047 A CN B008036047A CN 00803604 A CN00803604 A CN 00803604A CN 1207782 C CN1207782 C CN 1207782C
Authority
CN
China
Prior art keywords
extra play
active
thickness
chip
active chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB008036047A
Other languages
English (en)
Chinese (zh)
Other versions
CN1340212A (zh
Inventor
伊维斯·赖格诺克斯
埃里克·丹尼尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Axalto SA
Original Assignee
Schlumberger Systemes SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Systemes SA filed Critical Schlumberger Systemes SA
Publication of CN1340212A publication Critical patent/CN1340212A/zh
Application granted granted Critical
Publication of CN1207782C publication Critical patent/CN1207782C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CNB008036047A 1999-01-27 2000-01-18 集成电路器件、用于智能卡的电子部件及制造该器件的方法 Expired - Fee Related CN1207782C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR9900858A FR2788882A1 (fr) 1999-01-27 1999-01-27 Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif
FR99/00858 1999-01-27

Publications (2)

Publication Number Publication Date
CN1340212A CN1340212A (zh) 2002-03-13
CN1207782C true CN1207782C (zh) 2005-06-22

Family

ID=9541247

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008036047A Expired - Fee Related CN1207782C (zh) 1999-01-27 2000-01-18 集成电路器件、用于智能卡的电子部件及制造该器件的方法

Country Status (9)

Country Link
US (1) US7208822B1 (https=)
EP (1) EP1147557B1 (https=)
JP (1) JP2002536733A (https=)
CN (1) CN1207782C (https=)
AT (1) ATE376254T1 (https=)
DE (1) DE60036784T2 (https=)
ES (1) ES2293891T3 (https=)
FR (1) FR2788882A1 (https=)
WO (1) WO2000045434A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10111028A1 (de) * 2001-03-07 2002-09-19 Infineon Technologies Ag Chipkartenmodul
US7449780B2 (en) * 2003-03-31 2008-11-11 Intel Corporation Apparatus to minimize thermal impedance using copper on die backside
JP4058637B2 (ja) * 2003-10-27 2008-03-12 セイコーエプソン株式会社 半導体チップ、半導体装置、回路基板及び電子機器
US20060270106A1 (en) * 2005-05-31 2006-11-30 Tz-Cheng Chiu System and method for polymer encapsulated solder lid attach
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
CN104347536B (zh) * 2013-07-24 2018-11-16 精材科技股份有限公司 晶片封装体及其制造方法
US9117721B1 (en) * 2014-03-20 2015-08-25 Excelitas Canada, Inc. Reduced thickness and reduced footprint semiconductor packaging

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
JPS6091489A (ja) * 1983-10-24 1985-05-22 Nippon Telegr & Teleph Corp <Ntt> 静電対策ｉｃカ−ド
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
JPH022095A (ja) * 1988-06-10 1990-01-08 Ricoh Co Ltd Ｉｃモジュールの製造方法及びｉｃモジュール用基材
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
JPH04207061A (ja) * 1990-11-30 1992-07-29 Shinko Electric Ind Co Ltd 半導体装置
US5173764A (en) * 1991-04-08 1992-12-22 Motorola, Inc. Semiconductor device having a particular lid means and encapsulant to reduce die stress
JPH04341896A (ja) * 1991-05-20 1992-11-27 Hitachi Ltd 半導体装置及びメモリーカード
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
KR100209782B1 (ko) * 1994-08-30 1999-07-15 가나이 쓰도무 반도체 장치
US6002181A (en) * 1994-11-08 1999-12-14 Oki Electric Industry Co., Ltd. Structure of resin molded type semiconductor device with embedded thermal dissipator
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
JP3487524B2 (ja) * 1994-12-20 2004-01-19 株式会社ルネサステクノロジ 半導体装置及びその製造方法
US5648684A (en) * 1995-07-26 1997-07-15 International Business Machines Corporation Endcap chip with conductive, monolithic L-connect for multichip stack
FR2738077B1 (fr) * 1995-08-23 1997-09-19 Schlumberger Ind Sa Micro-boitier electronique pour carte a memoire electronique et procede de realisation

Also Published As

Publication number Publication date
EP1147557A1 (fr) 2001-10-24
CN1340212A (zh) 2002-03-13
EP1147557B1 (fr) 2007-10-17
FR2788882A1 (fr) 2000-07-28
ES2293891T3 (es) 2008-04-01
DE60036784T2 (de) 2008-07-24
DE60036784D1 (de) 2007-11-29
JP2002536733A (ja) 2002-10-29
WO2000045434A1 (fr) 2000-08-03
ATE376254T1 (de) 2007-11-15
US7208822B1 (en) 2007-04-24

Similar Documents

Publication Publication Date Title
CN1146983C (zh) 芯片卡和用在芯片卡中的半导体芯片
CN1206726C (zh) 半导体器件的制造方法
CN100456428C (zh) 半导体装置的制造方法
CN1295645C (zh) 非接触式数据载体的制造方法
JP2842355B2 (ja) パッケージ
CN1215921A (zh) 模压球栅阵列型半导体器件及其制造方法
US7750443B2 (en) Semiconductor device package
EP0810656A2 (en) Semiconductor device substrate and method of manufacturing the same
CN1499622A (zh) 引线框及制造方法以及树脂密封型半导体器件及制造方法
CN1458691A (zh) 形成多引线框半导体器件的结构和方法
CN1577816A (zh) 形成包封器件和结构的方法
CN1423315A (zh) 半导体模块及其生产方法以及用于ic卡等的模块
US20060071351A1 (en) Mold compound interlocking feature to improve semiconductor package strength
CN1555576A (zh) 电子标签及其制造方法
CN1207782C (zh) 集成电路器件、用于智能卡的电子部件及制造该器件的方法
WO2007148782A1 (ja) 樹脂封止型半導体装置とその製造方法、半導体装置用基材および積層型樹脂封止型半導体装置
KR100366111B1 (ko) 수지봉합형 반도체장치의 구조
JPH09289269A (ja) 半導体装置
US20190006219A1 (en) Method of packaging chip and chip package structure
US20160315027A1 (en) Semiconductor package and method of manufacturing the same
US6339024B1 (en) Reinforced integrated circuits
JP2007250703A (ja) 半導体装置及びその製造方法
JPH0786340A (ja) 半導体素子の接続方法
EP1544914A2 (en) Semiconductor device and method of manufacturing thereof
CN112820654A (zh) 一种智能功率芯片结构及其制造方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: AXALTO CO., LTD.

Free format text: FORMER NAME OR ADDRESS: SCHLUMBERGER SYSTEMS

CP01 Change in the name or title of a patent holder

Address after: Monte Carlo, France

Patentee after: Axalto S. A.

Address before: Monte Carlo, France

Patentee before: Schlumberger Industries

C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee