ATE376254T1 - Integrierte schaltungsanordnung, elektronisches modul für chipkarte, das die anordnung benutzt, und verfahren zu deren herstellung - Google Patents

Integrierte schaltungsanordnung, elektronisches modul für chipkarte, das die anordnung benutzt, und verfahren zu deren herstellung

Info

Publication number
ATE376254T1
ATE376254T1 AT00900602T AT00900602T ATE376254T1 AT E376254 T1 ATE376254 T1 AT E376254T1 AT 00900602 T AT00900602 T AT 00900602T AT 00900602 T AT00900602 T AT 00900602T AT E376254 T1 ATE376254 T1 AT E376254T1
Authority
AT
Austria
Prior art keywords
face
arrangement
integrated circuit
producing
same
Prior art date
Application number
AT00900602T
Other languages
German (de)
English (en)
Inventor
Yves Reignoux
Eric Daniel
Original Assignee
Axalto Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Axalto Sa filed Critical Axalto Sa
Application granted granted Critical
Publication of ATE376254T1 publication Critical patent/ATE376254T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5445—Dispositions of bond wires being orthogonal to a side surface of the chip, e.g. parallel arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AT00900602T 1999-01-27 2000-01-18 Integrierte schaltungsanordnung, elektronisches modul für chipkarte, das die anordnung benutzt, und verfahren zu deren herstellung ATE376254T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9900858A FR2788882A1 (fr) 1999-01-27 1999-01-27 Dispositif a circuits integres, module electronique pour carte a puce utilisant le dispositif et procede de fabrication dudit dispositif

Publications (1)

Publication Number Publication Date
ATE376254T1 true ATE376254T1 (de) 2007-11-15

Family

ID=9541247

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00900602T ATE376254T1 (de) 1999-01-27 2000-01-18 Integrierte schaltungsanordnung, elektronisches modul für chipkarte, das die anordnung benutzt, und verfahren zu deren herstellung

Country Status (9)

Country Link
US (1) US7208822B1 (https=)
EP (1) EP1147557B1 (https=)
JP (1) JP2002536733A (https=)
CN (1) CN1207782C (https=)
AT (1) ATE376254T1 (https=)
DE (1) DE60036784T2 (https=)
ES (1) ES2293891T3 (https=)
FR (1) FR2788882A1 (https=)
WO (1) WO2000045434A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10111028A1 (de) * 2001-03-07 2002-09-19 Infineon Technologies Ag Chipkartenmodul
US7449780B2 (en) * 2003-03-31 2008-11-11 Intel Corporation Apparatus to minimize thermal impedance using copper on die backside
JP4058637B2 (ja) * 2003-10-27 2008-03-12 セイコーエプソン株式会社 半導体チップ、半導体装置、回路基板及び電子機器
US20060270106A1 (en) * 2005-05-31 2006-11-30 Tz-Cheng Chiu System and method for polymer encapsulated solder lid attach
USD707682S1 (en) * 2012-12-05 2014-06-24 Logomotion, S.R.O. Memory card
CN104347536B (zh) * 2013-07-24 2018-11-16 精材科技股份有限公司 晶片封装体及其制造方法
US9117721B1 (en) * 2014-03-20 2015-08-25 Excelitas Canada, Inc. Reduced thickness and reduced footprint semiconductor packaging

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3029667A1 (de) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
JPS6091489A (ja) * 1983-10-24 1985-05-22 Nippon Telegr & Teleph Corp <Ntt> 静電対策ｉｃカ−ド
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
JPH022095A (ja) * 1988-06-10 1990-01-08 Ricoh Co Ltd Ｉｃモジュールの製造方法及びｉｃモジュール用基材
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
US4975761A (en) * 1989-09-05 1990-12-04 Advanced Micro Devices, Inc. High performance plastic encapsulated package for integrated circuit die
JPH04207061A (ja) * 1990-11-30 1992-07-29 Shinko Electric Ind Co Ltd 半導体装置
US5173764A (en) * 1991-04-08 1992-12-22 Motorola, Inc. Semiconductor device having a particular lid means and encapsulant to reduce die stress
JPH04341896A (ja) * 1991-05-20 1992-11-27 Hitachi Ltd 半導体装置及びメモリーカード
US5422435A (en) * 1992-05-22 1995-06-06 National Semiconductor Corporation Stacked multi-chip modules and method of manufacturing
KR100209782B1 (ko) * 1994-08-30 1999-07-15 가나이 쓰도무 반도체 장치
US6002181A (en) * 1994-11-08 1999-12-14 Oki Electric Industry Co., Ltd. Structure of resin molded type semiconductor device with embedded thermal dissipator
DE4443767A1 (de) * 1994-12-08 1996-06-13 Giesecke & Devrient Gmbh Elektronisches Modul und Datenträger mit elektrischem Modul
JP3487524B2 (ja) * 1994-12-20 2004-01-19 株式会社ルネサステクノロジ 半導体装置及びその製造方法
US5648684A (en) * 1995-07-26 1997-07-15 International Business Machines Corporation Endcap chip with conductive, monolithic L-connect for multichip stack
FR2738077B1 (fr) * 1995-08-23 1997-09-19 Schlumberger Ind Sa Micro-boitier electronique pour carte a memoire electronique et procede de realisation

Also Published As

Publication number Publication date
EP1147557A1 (fr) 2001-10-24
CN1340212A (zh) 2002-03-13
EP1147557B1 (fr) 2007-10-17
FR2788882A1 (fr) 2000-07-28
ES2293891T3 (es) 2008-04-01
DE60036784T2 (de) 2008-07-24
DE60036784D1 (de) 2007-11-29
CN1207782C (zh) 2005-06-22
JP2002536733A (ja) 2002-10-29
WO2000045434A1 (fr) 2000-08-03
US7208822B1 (en) 2007-04-24

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