CN120731663A - 伸缩性器件 - Google Patents
伸缩性器件Info
- Publication number
- CN120731663A CN120731663A CN202480011930.9A CN202480011930A CN120731663A CN 120731663 A CN120731663 A CN 120731663A CN 202480011930 A CN202480011930 A CN 202480011930A CN 120731663 A CN120731663 A CN 120731663A
- Authority
- CN
- China
- Prior art keywords
- stretchable
- wiring
- region
- base material
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Springs (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023064412 | 2023-04-11 | ||
| JP2023-064412 | 2023-04-11 | ||
| PCT/JP2024/013133 WO2024214573A1 (ja) | 2023-04-11 | 2024-03-29 | 伸縮性デバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120731663A true CN120731663A (zh) | 2025-09-30 |
Family
ID=93059315
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202480011930.9A Pending CN120731663A (zh) | 2023-04-11 | 2024-03-29 | 伸缩性器件 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250358930A1 (https=) |
| JP (1) | JP7786643B2 (https=) |
| CN (1) | CN120731663A (https=) |
| WO (1) | WO2024214573A1 (https=) |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6482595A (en) * | 1987-09-25 | 1989-03-28 | Meiko Electronics Co Ltd | Printed wiring board |
| JPH11274735A (ja) * | 1998-03-25 | 1999-10-08 | Toshiba Battery Co Ltd | 多層印刷配線板 |
| JP2006179589A (ja) | 2004-12-21 | 2006-07-06 | Matsushita Electric Ind Co Ltd | 多層フレキシブル配線基板、その製造方法および多層フレキシブル配線の回路基板との接続方法 |
| JP5375319B2 (ja) * | 2009-05-08 | 2013-12-25 | 株式会社村田製作所 | 信号線路及びその製造方法 |
| WO2016178409A1 (ja) | 2015-05-01 | 2016-11-10 | 株式会社フジクラ | 配線体、配線基板、及びタッチセンサ |
| JP6823472B2 (ja) | 2016-02-22 | 2021-02-03 | 日本メクトロン株式会社 | 伸縮性配線基板及びその製造方法 |
| JP6721829B2 (ja) * | 2016-07-26 | 2020-07-15 | 富士通株式会社 | 配線基板及び電子機器 |
| CN114666978A (zh) * | 2016-12-27 | 2022-06-24 | 昭和电工材料株式会社 | 带金属箔的伸缩性构件 |
| JP6699805B2 (ja) | 2017-12-26 | 2020-05-27 | 株式会社村田製作所 | インダクタブリッジおよび電子機器 |
| JP7144163B2 (ja) * | 2018-03-19 | 2022-09-29 | 株式会社フジクラ | 伸縮性配線板 |
| JP7001158B2 (ja) | 2018-06-07 | 2022-01-19 | 株式会社村田製作所 | 多層基板、電子機器および多層基板の製造方法 |
| JP7279399B2 (ja) | 2019-02-20 | 2023-05-23 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| JP7160180B2 (ja) | 2019-03-20 | 2022-10-25 | 株式会社村田製作所 | 伝送路基板、および伝送路基板の実装構造 |
| CN113556879B (zh) * | 2020-04-23 | 2023-12-12 | 源秩科技(上海)有限公司 | 电路板制作方法及其线路层加工装置 |
-
2024
- 2024-03-29 JP JP2025513893A patent/JP7786643B2/ja active Active
- 2024-03-29 CN CN202480011930.9A patent/CN120731663A/zh active Pending
- 2024-03-29 WO PCT/JP2024/013133 patent/WO2024214573A1/ja not_active Ceased
-
2025
- 2025-07-29 US US19/283,611 patent/US20250358930A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024214573A1 (https=) | 2024-10-17 |
| US20250358930A1 (en) | 2025-11-20 |
| WO2024214573A1 (ja) | 2024-10-17 |
| JP7786643B2 (ja) | 2025-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |