JPWO2024214573A1 - - Google Patents

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Publication number
JPWO2024214573A1
JPWO2024214573A1 JP2025513893A JP2025513893A JPWO2024214573A1 JP WO2024214573 A1 JPWO2024214573 A1 JP WO2024214573A1 JP 2025513893 A JP2025513893 A JP 2025513893A JP 2025513893 A JP2025513893 A JP 2025513893A JP WO2024214573 A1 JPWO2024214573 A1 JP WO2024214573A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2025513893A
Other languages
Japanese (ja)
Other versions
JPWO2024214573A5 (https=
JP7786643B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024214573A1 publication Critical patent/JPWO2024214573A1/ja
Publication of JPWO2024214573A5 publication Critical patent/JPWO2024214573A5/ja
Application granted granted Critical
Publication of JP7786643B2 publication Critical patent/JP7786643B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Springs (AREA)
JP2025513893A 2023-04-11 2024-03-29 伸縮性デバイス Active JP7786643B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023064412 2023-04-11
JP2023064412 2023-04-11
PCT/JP2024/013133 WO2024214573A1 (ja) 2023-04-11 2024-03-29 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024214573A1 true JPWO2024214573A1 (https=) 2024-10-17
JPWO2024214573A5 JPWO2024214573A5 (https=) 2025-09-03
JP7786643B2 JP7786643B2 (ja) 2025-12-16

Family

ID=93059315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025513893A Active JP7786643B2 (ja) 2023-04-11 2024-03-29 伸縮性デバイス

Country Status (4)

Country Link
US (1) US20250358930A1 (https=)
JP (1) JP7786643B2 (https=)
CN (1) CN120731663A (https=)
WO (1) WO2024214573A1 (https=)

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482595A (en) * 1987-09-25 1989-03-28 Meiko Electronics Co Ltd Printed wiring board
JPH11274735A (ja) * 1998-03-25 1999-10-08 Toshiba Battery Co Ltd 多層印刷配線板
JP2006179589A (ja) * 2004-12-21 2006-07-06 Matsushita Electric Ind Co Ltd 多層フレキシブル配線基板、その製造方法および多層フレキシブル配線の回路基板との接続方法
WO2016178409A1 (ja) * 2015-05-01 2016-11-10 株式会社フジクラ 配線体、配線基板、及びタッチセンサ
JP2017152687A (ja) * 2016-02-22 2017-08-31 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
WO2019131581A1 (ja) * 2017-12-26 2019-07-04 株式会社村田製作所 インダクタブリッジおよび電子機器
JP2019165049A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板
WO2019235558A1 (ja) * 2018-06-07 2019-12-12 株式会社村田製作所 多層基板、電子機器および多層基板の製造方法
JP2020136512A (ja) * 2019-02-20 2020-08-31 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2020189699A1 (ja) * 2019-03-20 2020-09-24 株式会社村田製作所 伝送路基板、および伝送路基板の実装構造
CN113556879A (zh) * 2020-04-23 2021-10-26 源秩科技（上海）有限公司 电路板制作方法及其线路层加工装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5375319B2 (ja) * 2009-05-08 2013-12-25 株式会社村田製作所 信号線路及びその製造方法
JP6721829B2 (ja) * 2016-07-26 2020-07-15 富士通株式会社 配線基板及び電子機器
CN114666978A (zh) * 2016-12-27 2022-06-24 昭和电工材料株式会社 带金属箔的伸缩性构件

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6482595A (en) * 1987-09-25 1989-03-28 Meiko Electronics Co Ltd Printed wiring board
JPH11274735A (ja) * 1998-03-25 1999-10-08 Toshiba Battery Co Ltd 多層印刷配線板
JP2006179589A (ja) * 2004-12-21 2006-07-06 Matsushita Electric Ind Co Ltd 多層フレキシブル配線基板、その製造方法および多層フレキシブル配線の回路基板との接続方法
WO2016178409A1 (ja) * 2015-05-01 2016-11-10 株式会社フジクラ 配線体、配線基板、及びタッチセンサ
JP2017152687A (ja) * 2016-02-22 2017-08-31 日本メクトロン株式会社 伸縮性配線基板及びその製造方法
WO2019131581A1 (ja) * 2017-12-26 2019-07-04 株式会社村田製作所 インダクタブリッジおよび電子機器
JP2019165049A (ja) * 2018-03-19 2019-09-26 株式会社フジクラ 伸縮性配線板
WO2019235558A1 (ja) * 2018-06-07 2019-12-12 株式会社村田製作所 多層基板、電子機器および多層基板の製造方法
JP2020136512A (ja) * 2019-02-20 2020-08-31 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2020189699A1 (ja) * 2019-03-20 2020-09-24 株式会社村田製作所 伝送路基板、および伝送路基板の実装構造
CN113556879A (zh) * 2020-04-23 2021-10-26 源秩科技（上海）有限公司 电路板制作方法及其线路层加工装置

Also Published As

Publication number Publication date
US20250358930A1 (en) 2025-11-20
CN120731663A (zh) 2025-09-30
WO2024214573A1 (ja) 2024-10-17
JP7786643B2 (ja) 2025-12-16

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