CN1180463C - 各向异性导电粘接材料及连接方法 - Google Patents

各向异性导电粘接材料及连接方法 Download PDF

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CN1180463C
CN1180463C CNB011190310A CN01119031A CN1180463C CN 1180463 C CN1180463 C CN 1180463C CN B011190310 A CNB011190310 A CN B011190310A CN 01119031 A CN01119031 A CN 01119031A CN 1180463 C CN1180463 C CN 1180463C
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anisotropic conductive
binding material
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须贺保博
武市元秀
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Abstract

本发明提供了一种各向异性导电粘结材料，用该材料将具有突起状电极的裸IC片等电子器件与配线基板的连接焊接点进行各向异性导电连接时，即使使用镍凸起等较硬的凸起作为突起状电极，也可以确保与以往使用金凸起或软钎料凸起的各向异性导电连接同样的连接可靠性。在将导电粒子分散于热固性树脂中而形成的各向异性导电粘结材料中，导电粒子的10%压缩弹性模数(E)与要用该各向异性导电粘结材料连接的电子器件的突起状电极的纵向弹性模数(E’)满足下列关系式(1)：0.02≤E/E’≤0.5。

Description

各向异性导电粘接材料及连接方法
技术领域
本发明是关于各向异性导电粘接材料及连接方法。
背景技术
近年来，作为突起状电极将带有金凸起或软钎料凸起的裸IC片直接倒装片装接在搭载IC用基板的电极焊接点上，或者加工成电路片尺寸组件(CSP)的形态进行安装。在进行这种安装时，通常是在裸IC片的突起状电极与IC搭载用基板之间夹持配合有环氧树脂等热固性树脂和导电性粒子的薄膜状、糊状或液状的各向异性导电粘结材料，然后进行加热加压。
使用金凸起时，材料的成本非常高。另外，使用软钎料凸起时，为了形成微小而均一的凸起，可以采用电镀法制造，但是需要蚀刻工序，而且在进行镀软钎料之前，需要形成基底金属层(Ti/Cu)，然后形成阻挡层金属多层镀层(Cu/Ni/Au)等复杂的电解工序。
因此，人们尝试使用材料成本低、可以采用较简单的电解工序形成的镍凸起。
但是，镍凸起的硬度比金凸起或软钎料凸起要高，各向异性导电粘结材料中的导电粒子被镍凸起压坏而发生塑性变形，裸IC片的镍凸起和搭载IC用基板的电极焊接点不能保持稳定的接触状态，连接可靠性低下。
发明内容
本发明的目的是，解决上述现有技术的问题，提供一种各向异性导电粘接材料，用该粘结材料将带有突起状电极的裸IC片等电子器件与配线基板的连接焊接点进行各向异性导电连接时，即使使用镍凸起等较硬的凸起作为突起状电极，也可以确保与使用金凸起或软钎料凸起的以往的各向异性导电连接同样的连接可靠性。
本发明人发现，各向异性导电连接时的连接可靠性与各向异性导电粘接材料中的导电粒子的10％压缩弹性模数(E)和电子器件的突起状电极的纵向弹性模数(E’)密切相关，通过将(E)与(E’)之比调整为特定的范围，可以提高连接可靠性，从而完成了本发明。
因此，本发明提供了一种连接方法，其特征在于，将各向异性导电粘结材料在电子器件的突起状电极与配线基板的连接焊接点之间，所述各向异性导电粘结材料是将导电粒子分散于热固性树脂中而形成的，通过对所述各向异性导电粘结材料加热加压，确保电子器件与配线基板的导通连接，所使用的各向异性导电粘结材料的导电性粒子的10％压缩弹性模数E和电子器件的突起状电极的纵向弹性模数E’满足下列关系式(1)：
0.02≤E/E’≤0.5               (1)。
本发明还提供了按照上述方法形成的将各向异性导电粘结材料夹在电子器件的突起状电极与配线基板的连接焊接点之间的结构。
附图说明
图1A是载荷与压缩位移的关系；
图1B是压缩应变与K值的关系。
具体实施方式
下面详细说明本发明。
本发明的各向异性导电粘接材料，是将导电粒子分散于热固性树脂中而形成的薄膜状、糊状或液状的粘结材料，导电粒子的10％压缩弹性模数E和要用该各向异性导电粘结材料连接的电子器件的突起状电极的纵向弹性模数E’满足下列关系式(1)
           0.02≤E/E’≤0.5               (1)
这是因为，E/E’低于0.02时，导电性粒子的复原力较小，不能确保足够的连接可靠性，反之，超过0.5时，导电粒子被压坏，同样不能充分确保连接可靠性。
突起状电极的纵向弹性模数E’可以按JIS Z2241中规定的试验方法测定。另外，导电粒子的10％压缩弹性模数E与Landau-Liefschitz理论物理学教程“弹性理论”(东京图书1972年发行)42页中定义的K值对应。该K值的含义如下。
使半径分别为R和R’的两个弹性球体以压缩状态接触时，由下列①式和②式给出h：
h＝F2/3[D2(1/R+1/R’)]1/3                   ①
D＝(3/4)[(1-σ2)/E＝(1-σ’2)/E’]           ②
式中，h表示R+R’与两球中心间距离之差，F表示压缩力，E和E’表示二个弹性球的弹性模数，σ和σ’表示弹性球的泊松比。
另一方面，将球换成刚体的板，由两侧压缩时，设R’→∞、E＞＞E’，可以近似得到下列③式。
F＝(21/2/3)(S3/2)(E·R1/2)(1-σ2)      ③
式中，S表示压缩变形量。如果按④式定义K值，K值可以由⑤式表示。
K＝E/(1-σ2)                              ④
K＝(3/√2)·F·S-3/2·R-1/2              ⑤
该K值是普遍和定量表示球体的硬度的值。使用这一K值(即10％压缩弹性模数E)，可以定量并且单义地表示微球体或隔离物(以下称为隔离物等)的适宜的硬度。K值的具体测定方法将在本发明书的实施例中详细说明。
导电粒子的10％压缩弹性模数E本身的数值过小时，在连接可靠性试验中出现连接不良的可能性较高，反之，该数值过大时，在初期连接有不导通的危险性，或者在突起状电极以外的电路上有可能产生损伤，因而一般规定为3-30Gpa。另外，电子器件的突起状电极的纵向弹性模数E’本身的数值过小时，连接时导电粒子有可能滑入突起状电极中，造成连接不良，反之，其数值过大时，在连接时压力较高的场合，有可能破坏基板一侧的电路电极，因而通常设定为40-200Gpa。
本发明的各向异性导电粘结材料具有以上所述的特征，至于其它构成，可以与以往的各向异性导电粘结材料相同。
例如，热固性树脂可以举出环氧树脂、聚氨酯树脂、不饱和聚酯树脂等。另外，热固性树脂还可以具有丙烯酸酯残基或甲基丙烯酸酯残基等光反应性官能基。其中，优先选用常温下为固形的环氧树脂。在这种场合，也可以并用常温下为液状的环氧树脂。常温下为液状的环氧树脂与常温下为固形的环氧树脂的配合比例可以根据对于薄膜状的各向异性导电粘结材料的性能要求适当确定。另外，在进一步提高上述由固形或液状的环氧树脂构成的薄膜的挠性程度，从而进一步提高各向异性导电粘结材料的剥离强度的场合，最好是在这些环氧树脂基础上并用挠性环氧树脂。此时，在本发明的各向异性导电粘结材料中所使用的挠性环氧树脂的含量过少时，挠性环氧树脂的添加效果不明显，其含量过多时，耐热性降低，因而其含量在5-35％(重量)为宜，优选的是5-25％(重量)。
本发明中使用的导电性粒子，可以从以往的各向异性导电粘结材料中所使用的该类材料中适当选择，使之满足上述的关系式(1)。例如，可以使用软钎料粒子、镍粒子等金属粒子，或者在苯乙烯树脂等树脂芯部表面上形成金属镀膜而得到的树脂芯部被覆金属的粒子，或者在树脂芯部周围附着二氧化硅等无机粉末、然后用金属镀膜被覆而得到的复合粒子。
导电粒子的平均粒径可以根据连接对象的金属器件的凸起材料和凸起高度等适当确定，在以高密度倒装片装接裸IC片的场合，最好是1-10μm大小。
导电性微粒子的配合量可以根据连接对象的电子器件的凸起面积和配线基板的连接焊接点面积等适当确定，其配合量过少时，上下电极之间可能没有夹入导电粒子，致使导通不良，反之，配合量过多时，由于导电粒子聚集，引起邻接的电极之间短路，因此，通常相对于100份(重量)本发明的各向异性导电粘结材料的树脂固形分，导电粒子的配合量在3-30份(重量)为宜。
在本发明的各向异性导电粘结材料中，根据需要可以添加在以往的各向异性导电粘结材料中配合的公知的添加剂，例如异氰酸酯系交联剂、环氧硅烷化合物等偶联剂、环氧改性硅树脂、或者苯氧基树脂等热固性的绝缘性树脂。
本发明的各向异性导电粘结材料，可以通过根据需要将上述热固性树脂和导电粒子在甲苯等溶剂中均匀混合来制备。可以以液状或糊状的形式直接使用，也可以制成膜，作为热固性各向异性导电粘结薄膜使用。
本发明的各向异性导电粘结材料可以适合用于下述的各向异性导电连接方法，即在电子器件的突起状电极与配线基板的连接焊接点之间夹持将导电粒子分散于热固性树脂中而形成的各向异性导电粘结材料，通过对其加热加压，确保电子器件与配线基板的导通连接。
本发明中的电子器件是以具有突起状电极的器件为对象，例如裸IC片、LSI片等。所述的突起状电极例如可以举出金凸起、软钎料凸起等，其中优先选用硬度高而材料成本相对较低的镍凸起。
下面通过实施例更具体地说明本发明。
导电粒子的10％压缩弹性模数(E)(即K值)按以下所述测定。
<导电粒子的10％压缩弹性模数(E)(即K值)的测定方法>
将导电粒子散布在具有平滑表面的钢板上，从中选择1个导电性粒子。使用粉末压缩试验机(PCT-200型、岛津制作所制造)，用金刚石制的直径50μm的圆柱的平滑端面压导电粒子(试验载荷＝0.0098N(10grf)，压缩速度(恒定负荷速度压缩方式)＝2.6×10-3N(0.27grf)/秒，测定温度＝20℃)。此时，以电气的方式作为电磁力测出压缩载荷，以电气方式通过作动变压器的偏移测出压缩位移，求出图1(a)所示的压缩位移-载荷的关系。根据该图分别求出导电粒子的10％压缩变形时的载荷值和压缩位移，根据这些数值和⑤式，按图1(b)所示，求出压缩应变和K值(10％压缩弹性模数(E))。但是，压缩应变是以％表示用导电粒子的粒径除以压缩位移而得到的值。
实施例1
将环氧树脂(Epikote1009、油化壳牌(株)制造)50份(重量)和潜在性固化剂(HX3721、旭化成(株)制造)45份(重量)混合，在所得到的热固性绝缘性粘结剂中均匀分散在球状的镍粒子上施以镀金的导电性粒子(日本化学工业(株)制造、平均粒径6μm、10％压缩弹性模数(E)＝41.6GPa)5份(重量)，将其成膜，得到35μm厚的各向异性导电粘结薄膜。
将该各向异性导电粘结薄膜夹在半导体晶片(凸起材质＝Ni、凸起高度＝20μm、凸起面积＝10000μm2、纵向弹性模数(E’)＝98Gpa、E/E’＝0.42、外形6.3mm见方)与环氧玻璃印刷电路板(配线材质＝Cu、镀Ni/Au、配线厚度18μm)之间，在180℃、147N(15kgf)、20秒的条件下熟压，将二者连接。所得到的连接体的每1端子的初期导通电阻是5-10mΩ，连接状态良好。另外，对连接体进行100小时的加压蒸煮试验(PCT)(121℃、0.213Mpa(2.1atm)、饱和湿度环境)，PCT后的导通电阻值与初期导通电阻值之间没有大的变动。
实施例2
在球状的苯胍胺树脂粒子上施以镀金，将所得到的导电粒子(日本化学工业(株)制造、平均粒径5μm、10％压缩弹性模数E＝4.7GPa、E/E’＝0.048)5份(重量)均匀分散于实施例1制备的热固性绝缘性粘结剂中，将其成膜，得到35μm厚的各向异性导电粘结薄膜。使用该各向异性导电粘结薄膜，与实施例1同样操作，将半导体晶片与环氧玻璃印刷电路板连接，得到连接体。所得到的连接体的每1端子的初期导通电阻是5-10mΩ，连接状态良好。另外，对连接体进行100小时的加压蒸煮试验(PCT)(121℃、0.213Mpa(2.1atm)、饱和湿度环境)，PCT后的导通电阻值与初期导通电阻值之间没有大的变动。
实施例3
用二氧化硅被覆球状的苯胍胺树脂，在其外侧施以镀金，将所得到的导电粒子(日本化学工业(株)制造、平均粒径7μm、10％压缩弹性模数(E)＝21.6GPa、E/E’＝0.22)5份(重量)均匀分散于实施例1制备的热固性绝缘性粘结剂中，将其成膜，得到35μm厚的各向异性导电粘结薄膜。使用该各向异性导电粘结薄膜，与实施例1同样操作，将半导体晶片与环氧玻璃印刷电路板连接，得到连接体。所得到的连接体的每1端子的初期导通电阻是5-10mΩ，连接状态良好。另外，对连接体进行100小时的加压蒸煮试验(PCT)(121℃、0.213Mpa(2.1atm)、饱和湿度环境)，PCT后的导通电阻值与初期导通电阻值之间没有大的变动。
比较例1
在球状的苯胍胺树脂上施以镀金，将所得的导电粒子(日本化学工业(株)制造、平均粒径5μm、10％压缩弹性模数(E)＝1.5GPa、E/E’＝0.015)5份(重量)均匀分散于实施例1制备的热固性绝缘性粘结剂中，将其成膜，得到35μm厚的各向异性导电粘结薄膜。使用该各向异性导电粘结薄膜，与实施例1同样操作，将半导体晶片与环氧玻璃印刷电路板连接时，电极之间夹着的导电粒子被压坏(即导电粒子处于破坏的状态)，所得到的连接体的每1端子的初期导通电阻是5-10mΩ。但是，对连接体进行100小时的加压蒸煮试验(PCT)(121℃、0.213Mpa(2.1atm)、饱和湿度环境)时，PCT后的导通电阻由初期导通电阻值大幅度上升，连接可靠性大大降低。
比较例2
将实施例1中制备的各向异性导电粘结薄膜夹在半导体晶片(凸起材质＝Au、凸起高度＝20μm、凸起面积＝10000μm2、纵向弹性模数(E’)＝76.4Gpa、E/E’＝0.54、外形6.3mm见方)与环氧玻璃印刷电路板(配线材质＝Cu、镀Ni/Au、配线厚度18μm)之间，在180℃、147N(15kgf)、20秒的条件下热压，将二者连接。所得到的连接体的每1端子的初期导通电阻是5-10mΩ，连接状态良好。但是，对连接体进行100小时的加压蒸煮试验(PCT)(121℃、0.213Mpa(2.1atm)、饱和湿度环境)时，PCT后的导通电阻由初期导通电阻值大幅度上升，连接可靠性大大降低。
使用本发明的各向异性导电粘结材料将具有突起状电极的裸IC片等电子器件与配线基板的连接焊接点进行各向异性导电连接时，即使使用镍凸起等较硬的凸起作为突起状电极，也可以确保与以往使用金凸起或软钎料凸起的各向异性导电连接同样的连接可靠性。

Claims (2)

1.一种连接方法，其特征在于，将各向异性导电粘结材料在电子器件的突起状电极与配线基板的连接焊接点之间，所述各向异性导电粘结材料是将导电粒子分散于热固性树脂中而形成的，通过对所述各向异性导电粘结材料加热加压，确保电子器件与配线基板的导通连接，所使用的各向异性导电粘结材料的导电性粒子的10％压缩弹性模数E和电子器件的突起状电极的纵向弹性模数E’满足下列关系式(1)：
0.02≤E/E’≤0.5              (1)。
2.一种按照权利要求1的方法形成的将导电粒子分散于热固性树脂中而形成的各向异性导电粘结材料夹在电子器件的突起状电极与配线基板的连接焊接点之间的结构。
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