CN117580925A - 电磁钢板层叠用粘接剂组合物 - Google Patents

电磁钢板层叠用粘接剂组合物 Download PDF

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Publication number
CN117580925A
CN117580925A CN202280044158.1A CN202280044158A CN117580925A CN 117580925 A CN117580925 A CN 117580925A CN 202280044158 A CN202280044158 A CN 202280044158A CN 117580925 A CN117580925 A CN 117580925A
Authority
CN
China
Prior art keywords
epoxy resin
electromagnetic steel
adhesive
resin
adhesive composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280044158.1A
Other languages
English (en)
Chinese (zh)
Inventor
石川和宪
伊藤翼
荒牧高志
大石浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel Corp
Sika Japan Ltd
Original Assignee
Nippon Steel and Sumitomo Metal Corp
Sika Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel and Sumitomo Metal Corp, Sika Japan Ltd filed Critical Nippon Steel and Sumitomo Metal Corp
Publication of CN117580925A publication Critical patent/CN117580925A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
    • C08G65/2612—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aromatic or arylaliphatic hydroxyl groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
CN202280044158.1A 2021-06-21 2022-04-28 电磁钢板层叠用粘接剂组合物 Pending CN117580925A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-102360 2021-06-21
JP2021102360 2021-06-21
PCT/JP2022/019251 WO2022270154A1 (ja) 2021-06-21 2022-04-28 電磁鋼板積層用接着剤組成物

Publications (1)

Publication Number Publication Date
CN117580925A true CN117580925A (zh) 2024-02-20

Family

ID=84545648

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280044158.1A Pending CN117580925A (zh) 2021-06-21 2022-04-28 电磁钢板层叠用粘接剂组合物

Country Status (10)

Country Link
US (1) US20240294812A1 (https=)
EP (1) EP4361230B1 (https=)
JP (1) JP7660675B2 (https=)
KR (1) KR102939483B1 (https=)
CN (1) CN117580925A (https=)
BR (1) BR112023026586A2 (https=)
CA (1) CA3222811A1 (https=)
MX (1) MX2023014947A (https=)
TW (1) TWI824572B (https=)
WO (1) WO2022270154A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7828017B2 (ja) * 2022-07-26 2026-03-11 日本製鉄株式会社 接着樹脂組成物被覆電磁鋼板およびその製造方法
CN119604594A (zh) * 2022-07-26 2025-03-11 日本制铁株式会社 粘接树脂组合物被覆电磁钢板及其制造方法
EP4725697A1 (de) * 2024-10-10 2026-04-15 ThyssenKrupp Steel Europe AG Kontinuierlicher prozess und vorrichtung zur verklebung von elektroband im stanzprozess

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080131639A1 (en) * 2003-06-23 2008-06-05 Tetsuya Yamamoto Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same
JP2009007424A (ja) * 2007-06-27 2009-01-15 Shin Etsu Chem Co Ltd 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム
CN102559113A (zh) * 2010-09-30 2012-07-11 新日铁化学株式会社 粘接剂树脂组合物、其固化物以及粘接剂膜
JP2014096429A (ja) * 2012-11-08 2014-05-22 Kyocera Chemical Corp 積層コアの製造方法
US20160042836A1 (en) * 2014-08-08 2016-02-11 Hitachi, Ltd. Insulated Wire, Rotary Electric Machine, and Method for Manufacturing Insulated Wire
CN108292543A (zh) * 2015-12-04 2018-07-17 古河电气工业株式会社 自热粘性绝缘电线、线圈和电气/电子设备

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48100602A (https=) * 1972-04-05 1973-12-19
JP4581228B2 (ja) 2000-11-14 2010-11-17 Ｊｆｅスチール株式会社 加工性に優れる積層電磁鋼板
JP4118096B2 (ja) 2002-07-10 2008-07-16 三井化学株式会社 電気自動車用、電動機または発電機用積層板及び、電動機または発電機
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
KR101561280B1 (ko) 2013-11-27 2015-10-16 주식회사 포스코 무방향성 전기 강판 코팅 조성물, 무방향성 전기 강판 제품의 제조 방법 및 무방향성 전기 강판 제품
CN109651988A (zh) * 2018-12-21 2019-04-19 苏州赛伍应用技术股份有限公司 一种粘合剂和包含其的绝缘补强胶带
JP7630779B2 (ja) 2019-04-05 2025-02-18 デュポン帝人アドバンスドペーパー株式会社 環状積層コア材、及び、環状積層コア材の製造方法
JP2021102360A (ja) 2019-12-24 2021-07-15 トヨタ自動車株式会社 ハイブリッド車両の制御装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080131639A1 (en) * 2003-06-23 2008-06-05 Tetsuya Yamamoto Adhesive Composition for Semiconductor Device and Cover Lay Film, Adhesive Sheet, and Copper-Clad Polymide Film Made With the Same
JP2009007424A (ja) * 2007-06-27 2009-01-15 Shin Etsu Chem Co Ltd 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム
CN102559113A (zh) * 2010-09-30 2012-07-11 新日铁化学株式会社 粘接剂树脂组合物、其固化物以及粘接剂膜
JP2014096429A (ja) * 2012-11-08 2014-05-22 Kyocera Chemical Corp 積層コアの製造方法
US20160042836A1 (en) * 2014-08-08 2016-02-11 Hitachi, Ltd. Insulated Wire, Rotary Electric Machine, and Method for Manufacturing Insulated Wire
CN108292543A (zh) * 2015-12-04 2018-07-17 古河电气工业株式会社 自热粘性绝缘电线、线圈和电气/电子设备

Also Published As

Publication number Publication date
MX2023014947A (es) 2024-02-16
EP4361230B1 (en) 2026-04-22
BR112023026586A2 (pt) 2024-03-05
WO2022270154A1 (ja) 2022-12-29
US20240294812A1 (en) 2024-09-05
EP4361230A1 (en) 2024-05-01
TWI824572B (zh) 2023-12-01
JPWO2022270154A1 (https=) 2022-12-29
CA3222811A1 (en) 2022-12-29
KR20240017060A (ko) 2024-02-06
EP4361230A4 (en) 2025-06-25
KR102939483B1 (ko) 2026-03-17
TW202309232A (zh) 2023-03-01
JP7660675B2 (ja) 2025-04-11

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