KR102939483B1 - 전자 강판 적층용 접착제 조성물 - Google Patents

전자 강판 적층용 접착제 조성물

Info

Publication number
KR102939483B1
KR102939483B1 KR1020247000153A KR20247000153A KR102939483B1 KR 102939483 B1 KR102939483 B1 KR 102939483B1 KR 1020247000153 A KR1020247000153 A KR 1020247000153A KR 20247000153 A KR20247000153 A KR 20247000153A KR 102939483 B1 KR102939483 B1 KR 102939483B1
Authority
KR
South Korea
Prior art keywords
epoxy resin
electrical steel
steel sheets
adhesive
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020247000153A
Other languages
English (en)
Korean (ko)
Other versions
KR20240017060A (ko
Inventor
가즈노리 이시카와
츠바사 이토
다카시 아라마키
히로시 오이시
Original Assignee
닛폰세이테츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛폰세이테츠 가부시키가이샤 filed Critical 닛폰세이테츠 가부시키가이샤
Publication of KR20240017060A publication Critical patent/KR20240017060A/ko
Application granted granted Critical
Publication of KR102939483B1 publication Critical patent/KR102939483B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/26—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds
    • C08G65/2603—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen
    • C08G65/2606—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups
    • C08G65/2612—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers and other compounds the other compounds containing oxygen containing hydroxyl groups containing aromatic or arylaliphatic hydroxyl groups

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
KR1020247000153A 2021-06-21 2022-04-28 전자 강판 적층용 접착제 조성물 Active KR102939483B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-102360 2021-06-21
JP2021102360 2021-06-21
PCT/JP2022/019251 WO2022270154A1 (ja) 2021-06-21 2022-04-28 電磁鋼板積層用接着剤組成物

Publications (2)

Publication Number Publication Date
KR20240017060A KR20240017060A (ko) 2024-02-06
KR102939483B1 true KR102939483B1 (ko) 2026-03-17

Family

ID=84545648

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247000153A Active KR102939483B1 (ko) 2021-06-21 2022-04-28 전자 강판 적층용 접착제 조성물

Country Status (10)

Country Link
US (1) US20240294812A1 (https=)
EP (1) EP4361230B1 (https=)
JP (1) JP7660675B2 (https=)
KR (1) KR102939483B1 (https=)
CN (1) CN117580925A (https=)
BR (1) BR112023026586A2 (https=)
CA (1) CA3222811A1 (https=)
MX (1) MX2023014947A (https=)
TW (1) TWI824572B (https=)
WO (1) WO2022270154A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7828017B2 (ja) * 2022-07-26 2026-03-11 日本製鉄株式会社 接着樹脂組成物被覆電磁鋼板およびその製造方法
CN119604594A (zh) * 2022-07-26 2025-03-11 日本制铁株式会社 粘接树脂组合物被覆电磁钢板及其制造方法
EP4725697A1 (de) * 2024-10-10 2026-04-15 ThyssenKrupp Steel Europe AG Kontinuierlicher prozess und vorrichtung zur verklebung von elektroband im stanzprozess

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096429A (ja) 2012-11-08 2014-05-22 Kyocera Chemical Corp 積層コアの製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS48100602A (https=) * 1972-04-05 1973-12-19
JP4581228B2 (ja) 2000-11-14 2010-11-17 Ｊｆｅスチール株式会社 加工性に優れる積層電磁鋼板
JP4118096B2 (ja) 2002-07-10 2008-07-16 三井化学株式会社 電気自動車用、電動機または発電機用積層板及び、電動機または発電機
TW200516126A (en) * 2003-06-23 2005-05-16 Toray Industries Adhesive composition for semiconductor devices, coverlay films, adhesive sheets and copper-clad polyimide films using the composition
US20070116961A1 (en) * 2005-11-23 2007-05-24 3M Innovative Properties Company Anisotropic conductive adhesive compositions
JP2009007424A (ja) * 2007-06-27 2009-01-15 Shin Etsu Chem Co Ltd 接着剤組成物、並びにそれを用いた接着シート及びカバーレイフィルム
JP5761639B2 (ja) * 2010-09-30 2015-08-12 日本発條株式会社 接着剤樹脂組成物、その硬化物、及び接着剤フィルム
KR101561280B1 (ko) 2013-11-27 2015-10-16 주식회사 포스코 무방향성 전기 강판 코팅 조성물, 무방향성 전기 강판 제품의 제조 방법 및 무방향성 전기 강판 제품
JP2016039042A (ja) * 2014-08-08 2016-03-22 株式会社日立製作所 絶縁電線、回転電機及び絶縁電線の製造方法
CN108292543A (zh) * 2015-12-04 2018-07-17 古河电气工业株式会社 自热粘性绝缘电线、线圈和电气/电子设备
CN109651988A (zh) * 2018-12-21 2019-04-19 苏州赛伍应用技术股份有限公司 一种粘合剂和包含其的绝缘补强胶带
JP7630779B2 (ja) 2019-04-05 2025-02-18 デュポン帝人アドバンスドペーパー株式会社 環状積層コア材、及び、環状積層コア材の製造方法
JP2021102360A (ja) 2019-12-24 2021-07-15 トヨタ自動車株式会社 ハイブリッド車両の制御装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014096429A (ja) 2012-11-08 2014-05-22 Kyocera Chemical Corp 積層コアの製造方法

Also Published As

Publication number Publication date
MX2023014947A (es) 2024-02-16
EP4361230B1 (en) 2026-04-22
BR112023026586A2 (pt) 2024-03-05
WO2022270154A1 (ja) 2022-12-29
US20240294812A1 (en) 2024-09-05
CN117580925A (zh) 2024-02-20
EP4361230A1 (en) 2024-05-01
TWI824572B (zh) 2023-12-01
JPWO2022270154A1 (https=) 2022-12-29
CA3222811A1 (en) 2022-12-29
KR20240017060A (ko) 2024-02-06
EP4361230A4 (en) 2025-06-25
TW202309232A (zh) 2023-03-01
JP7660675B2 (ja) 2025-04-11

Similar Documents

Publication Publication Date Title
KR102939483B1 (ko) 전자 강판 적층용 접착제 조성물
KR102052389B1 (ko) 구조용 접착제 및 이의 접합 용도
TWI746812B (zh) 含有羧酸基之聚酯系黏接劑組成物
TWI738994B (zh) 含有噁唑烷酮環的環氧樹脂組成物、其製造方法、硬化性樹脂組成物、及硬化物
JP2019135280A (ja) 接着剤組成物、熱硬化性接着シート及びプリント配線板
WO2006098329A1 (ja) エポキシ樹脂、エポキシ樹脂組成物、これを用いたプリプレグ及び積層板
CN106832224A (zh) 环氧树脂的硬化剂组合物
CN115403742A (zh) 含有噁唑烷酮环的环氧树脂、其制造方法、环氧树脂组合物与其用途及环氧树脂硬化物
CN103261262B (zh) 高分子量环氧树脂、使用该高分子量环氧树脂的树脂膜、树脂组合物及固化物
CN105377940A (zh) 结构黏合剂组合物
JPH09157498A (ja) 繊維強化複合材料用エポキシ樹脂組成物、プリプレグ及び繊維強化複合材料
JP6380710B1 (ja) カルボン酸基含有高分子化合物およびそれを含有する接着剤組成物
JP2021088649A (ja) 熱硬化性樹脂組成物
CN104072750B (zh) 多羟基聚醚树脂的制造方法，多羟基聚醚树脂，其树脂组合物及其硬化物
RU2858532C2 (ru) Клейкая композиция для ламинирования электромагнитного стального листа
CN114846104A (zh) 粘接剂组合物
JP6659964B2 (ja) 熱硬化性樹脂組成物
CN111032722B (zh) 环氧树脂、环氧树脂组合物及其固化物
JP7450116B2 (ja) フレキシブルデバイス用樹脂組成物、フレキシブルデバイス用フィルム状接着剤、フレキシブルデバイス用接着シート、及びフレキシブルデバイスの製造方法
JP7767727B2 (ja) 積層体及びエポキシ樹脂シートの製造方法
JP7470863B2 (ja) フレキシブルデバイス用基材・接着剤層一体型シート、及びフレキシブルデバイスの製造方法
CN120536093A (zh) 一种膨胀绝缘片的制备方法
KR20090057697A (ko) 반도체　조립용　접착필름　조성물 및　이를 이용한접착필름
JPS6119621A (ja) エポキシ樹脂組成物
JPWO2020116467A1 (ja) 熱硬化性樹脂組成物及びシート

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

F11 Ip right granted following substantive examination

Free format text: ST27 STATUS EVENT CODE: A-2-4-F10-F11-EXM-PR0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

U12 Designation fee paid

Free format text: ST27 STATUS EVENT CODE: A-2-2-U10-U12-OTH-PR1002 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

Q13 Ip right document published

Free format text: ST27 STATUS EVENT CODE: A-4-4-Q10-Q13-NAP-PG1601 (AS PROVIDED BY THE NATIONAL OFFICE)