CN117393466A - 芯片贴装装置及半导体器件的制造方法 - Google Patents

芯片贴装装置及半导体器件的制造方法 Download PDF

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Publication number
CN117393466A
CN117393466A CN202311305066.7A CN202311305066A CN117393466A CN 117393466 A CN117393466 A CN 117393466A CN 202311305066 A CN202311305066 A CN 202311305066A CN 117393466 A CN117393466 A CN 117393466A
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CN
China
Prior art keywords
axis direction
waveform
vibration
mounting
bare chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311305066.7A
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English (en)
Chinese (zh)
Inventor
楯充明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fasford Technology Co Ltd
Original Assignee
Fasford Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fasford Technology Co Ltd filed Critical Fasford Technology Co Ltd
Publication of CN117393466A publication Critical patent/CN117393466A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
CN202311305066.7A 2018-09-19 2019-09-18 芯片贴装装置及半导体器件的制造方法 Pending CN117393466A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018174833A JP7128697B2 (ja) 2018-09-19 2018-09-19 ダイボンディング装置および半導体装置の製造方法
JP2018-174833 2018-09-19
CN201910880445.6A CN110931366B (zh) 2018-09-19 2019-09-18 芯片贴装装置及半导体器件的制造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201910880445.6A Division CN110931366B (zh) 2018-09-19 2019-09-18 芯片贴装装置及半导体器件的制造方法

Publications (1)

Publication Number Publication Date
CN117393466A true CN117393466A (zh) 2024-01-12

Family

ID=69848723

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202311305066.7A Pending CN117393466A (zh) 2018-09-19 2019-09-18 芯片贴装装置及半导体器件的制造方法
CN201910880445.6A Active CN110931366B (zh) 2018-09-19 2019-09-18 芯片贴装装置及半导体器件的制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201910880445.6A Active CN110931366B (zh) 2018-09-19 2019-09-18 芯片贴装装置及半导体器件的制造方法

Country Status (4)

Country Link
JP (1) JP7128697B2 (ja)
KR (1) KR102276898B1 (ja)
CN (2) CN117393466A (ja)
TW (1) TWI724495B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115623697B (zh) * 2022-12-06 2023-04-07 常州铭赛机器人科技股份有限公司 芯片贴装机构

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* Cited by examiner, † Cited by third party
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JP2003224143A (ja) * 2002-01-30 2003-08-08 Toray Eng Co Ltd 姿勢制御方法および装置並びにその装置を用いた接合装置
US20040016995A1 (en) * 2002-07-25 2004-01-29 Kuo Shun Meen MEMS control chip integration
US7311004B2 (en) * 2003-03-10 2007-12-25 Capstan Ag Systems, Inc. Flow control and operation monitoring system for individual spray nozzles
US20040204777A1 (en) * 2003-04-14 2004-10-14 Alon Harpaz Precision motion control using feed forward of acceleration
JP2005340780A (ja) * 2004-04-27 2005-12-08 Matsushita Electric Ind Co Ltd 電子部品装着装置および電子部品装着方法
US9802225B2 (en) * 2005-06-27 2017-10-31 General Vibration Corporation Differential haptic guidance for personal navigation
US20070290282A1 (en) * 2006-06-15 2007-12-20 Nanochip, Inc. Bonded chip assembly with a micro-mover for microelectromechanical systems
JP4687791B2 (ja) * 2007-09-19 2011-05-25 株式会社村田製作所 複合センサおよび加速度センサ
JP5652155B2 (ja) * 2010-11-24 2015-01-14 セイコーエプソン株式会社 振動片、センサーユニット、電子機器、振動片の製造方法、および、センサーユニットの製造方法
JP5320420B2 (ja) 2011-02-18 2013-10-23 株式会社日立ハイテクインスツルメンツ モータ制御装置およびモータ制御方法
JP5713787B2 (ja) * 2011-04-28 2015-05-07 芝浦メカトロニクス株式会社 電子部品の実装装置
JP5705052B2 (ja) * 2011-07-26 2015-04-22 株式会社新川 ダイボンディング装置
US9564413B2 (en) * 2011-09-15 2017-02-07 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming semiconductor die with active region responsive to external stimulus
JP6045837B2 (ja) * 2012-07-26 2016-12-14 日東電工株式会社 半導体ウエハのマウント方法および半導体ウエハのマウント装置
US9162880B2 (en) * 2012-09-07 2015-10-20 LuxVue Technology Corporation Mass transfer tool
KR20140118792A (ko) * 2013-03-29 2014-10-08 세이코 엡슨 가부시키가이샤 진동 소자, 진동자, 발진기, 전자 기기, 센서, 및 이동체
US9368423B2 (en) * 2013-06-28 2016-06-14 STATS ChipPAC Pte. Ltd. Semiconductor device and method of using substrate with conductive posts and protective layers to form embedded sensor die package
JP6276545B2 (ja) * 2013-09-18 2018-02-07 ファスフォードテクノロジ株式会社 ダイボンダ
JP6337395B2 (ja) * 2014-05-09 2018-06-06 パナソニックＩｐマネジメント株式会社 入出力操作装置
WO2015112958A1 (en) * 2014-01-27 2015-07-30 Corning Incorporated Articles and methods for controlled bonding of thin sheets with carriers
JP6247965B2 (ja) * 2014-03-12 2017-12-13 ファスフォードテクノロジ株式会社 半導体製造方法及びダイボンダ
US9527723B2 (en) * 2014-03-13 2016-12-27 STATS ChipPAC Pte. Ltd. Semiconductor device and method of forming microelectromechanical systems (MEMS) package
JP6374189B2 (ja) * 2014-03-17 2018-08-15 ファスフォードテクノロジ株式会社 ダイボンダ及びボンディング方法
JP6356458B2 (ja) * 2014-03-31 2018-07-11 日東電工株式会社 ダイボンドフィルム、ダイシングシート付きダイボンドフィルム、半導体装置、及び、半導体装置の製造方法
KR101877503B1 (ko) * 2015-12-24 2018-07-11 주식회사 모다이노칩 복합 소자 및 이를 구비하는 전자기기
CN109564851A (zh) * 2016-08-31 2019-04-02 株式会社半导体能源研究所 半导体装置的制造方法

Also Published As

Publication number Publication date
KR102276898B1 (ko) 2021-07-14
TWI724495B (zh) 2021-04-11
CN110931366A (zh) 2020-03-27
CN110931366B (zh) 2023-10-31
JP2020047760A (ja) 2020-03-26
KR20200033176A (ko) 2020-03-27
TW202025314A (zh) 2020-07-01
JP7128697B2 (ja) 2022-08-31

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