CN117121184A - 光半导体装置和其制造方法、固体摄像装置、以及电子设备 - Google Patents

光半导体装置和其制造方法、固体摄像装置、以及电子设备 Download PDF

Info

Publication number
CN117121184A
CN117121184A CN202280024516.2A CN202280024516A CN117121184A CN 117121184 A CN117121184 A CN 117121184A CN 202280024516 A CN202280024516 A CN 202280024516A CN 117121184 A CN117121184 A CN 117121184A
Authority
CN
China
Prior art keywords
adhesive layer
semiconductor device
optical semiconductor
group
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280024516.2A
Other languages
English (en)
Chinese (zh)
Inventor
木下大希
斋藤悠太
黑田健太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
Original Assignee
Kaneka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka Corp filed Critical Kaneka Corp
Publication of CN117121184A publication Critical patent/CN117121184A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/38—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/649—Aromatic compounds comprising a hetero atom
    • H10K85/654—Aromatic compounds comprising a hetero atom comprising only nitrogen as heteroatom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN202280024516.2A 2021-03-29 2022-03-29 光半导体装置和其制造方法、固体摄像装置、以及电子设备 Pending CN117121184A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021054899 2021-03-29
JP2021-054899 2021-03-29
PCT/JP2022/015715 WO2022210798A1 (ja) 2021-03-29 2022-03-29 光半導体装置及びその製造方法、固体撮像装置、並びに電子機器

Publications (1)

Publication Number Publication Date
CN117121184A true CN117121184A (zh) 2023-11-24

Family

ID=83456403

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280024516.2A Pending CN117121184A (zh) 2021-03-29 2022-03-29 光半导体装置和其制造方法、固体摄像装置、以及电子设备

Country Status (4)

Country Link
US (1) US20240206322A1 (https=)
JP (1) JP7806026B2 (https=)
CN (1) CN117121184A (https=)
WO (1) WO2022210798A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024039630A (ja) * 2022-09-09 2024-03-22 株式会社カネカ 固体撮像素子パッケージ製造方法および固体撮像素子パッケージ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296453A (ja) * 2003-02-06 2004-10-21 Sharp Corp 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
JP4365743B2 (ja) 2004-07-27 2009-11-18 富士通マイクロエレクトロニクス株式会社 撮像装置
JP4403035B2 (ja) * 2004-07-28 2010-01-20 株式会社リコー 偏光分離素子、光ピックアップ、光ディスク装置、及び偏光分離素子の製造方法
JP4091969B1 (ja) * 2007-07-12 2008-05-28 住友ベークライト株式会社 受光装置および受光装置の製造方法
KR101595455B1 (ko) * 2009-08-10 2016-02-19 엘지디스플레이 주식회사 유기 발광 표시 소자 및 이의 제조 방법
JP5930263B2 (ja) 2011-02-18 2016-06-08 ソニー株式会社 固体撮像装置
JP2015089951A (ja) * 2013-11-05 2015-05-11 キヤノン・コンポーネンツ株式会社 金属皮膜付物品及びその製造方法並びに配線板
JP2015170638A (ja) * 2014-03-05 2015-09-28 株式会社リコー 撮像素子パッケージ及び撮像装置
JP2017003947A (ja) 2015-06-16 2017-01-05 株式会社フジクラ 光学素子パッケージ、光スイッチ、及び光学素子パッケージの製造方法
JP2018036290A (ja) * 2016-08-29 2018-03-08 株式会社ジャパンディスプレイ 表示装置
JP2020024984A (ja) * 2018-08-06 2020-02-13 株式会社カネカ チップ接着用ポジ型感光性ダイボンド剤、近紫外線硬化性の基板接着剤及びそれを用いたチップの製造方法
US12189085B2 (en) 2019-06-06 2025-01-07 Sony Semiconductor Solutions Corporation Imaging device

Also Published As

Publication number Publication date
US20240206322A1 (en) 2024-06-20
JP7806026B2 (ja) 2026-01-26
JPWO2022210798A1 (https=) 2022-10-06
WO2022210798A1 (ja) 2022-10-06

Similar Documents

Publication Publication Date Title
US10854661B2 (en) Solid-state imaging device, infrared-absorbing composition, and flattened-film-forming curable composition
TWI873933B (zh) 遮光膜、遮光膜之製造方法、光學元件、固體攝像元件、頭燈單元
TWI798453B (zh) 遮光性樹脂組成物、硬化膜、濾色器、遮光膜、固體攝像元件、圖像顯示裝置
US10947326B2 (en) Adhesive composition, cured article, semiconductor device, and production method for same
KR20150072428A (ko) 경화성 수지 조성물, 이것을 사용한 이미지 센서칩의 제조 방법 및 이미지 센서칩
KR20170099845A (ko) 적외선 차폐성 조성물, 경화막 및 고체 촬상 장치
TW201943778A (zh) 導熱層、感光層、感光性組成物、導熱層之製造方法以及積層體及半導體器件
JPWO2018180477A1 (ja) 着色膜及びその製造方法、固体撮像素子
TW201915068A (zh) 硬化膜之製造方法、固體攝像元件之製造方法、圖像顯示裝置之製造方法
JPWO2014126033A1 (ja) 硬化膜の製造方法、硬化膜、液晶表示装置、有機ｅｌ表示装置、及び、タッチパネル表示装置
JP7806026B2 (ja) 光半導体装置及びその製造方法、固体撮像装置、並びに電子機器
TW202312510A (zh) 附肋基板及光半導體裝置
TWI795461B (zh) 固體攝像裝置、有機層形成用組成物
JP2024138806A (ja) 感光性樹脂組成物、感光性フィルム、硬化物、及びこれらを用いた電子部品
US20240290804A1 (en) Optical semiconductor device
WO2022210799A1 (ja) 基板積層体、イメージセンサ、及び基板積層体の製造方法
JP2018165780A (ja) 収容体、収容体の製造方法、及び、硬化膜の製造方法
JP2023049863A (ja) 組成物、遮光膜、固体撮像素子、画像表示装置、硬化膜の製造方法
WO2022210797A1 (ja) ネガ型感光性組成物、光半導体装置、固体撮像装置、及び電子機器
JP5533465B2 (ja) 感光性樹脂組成物及びこれを用いた感光性エレメント
WO2023190837A1 (ja) 固体撮像装置及びその製造方法
JP7192249B2 (ja) 樹脂組成物、硬化物、半導体装置及びその製造方法
WO2023008534A1 (ja) 基板積層体、イメージセンサ、及び基板積層体の製造方法
JP7119578B2 (ja) 樹脂組成物、硬化物、半導体装置及びその製造方法
JP2024142092A (ja) 感光性樹脂組成物、枠状部材付き透明基板および半導体装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination