JP7806026B2 - 光半導体装置及びその製造方法、固体撮像装置、並びに電子機器 - Google Patents

光半導体装置及びその製造方法、固体撮像装置、並びに電子機器

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Publication number
JP7806026B2
JP7806026B2 JP2023511434A JP2023511434A JP7806026B2 JP 7806026 B2 JP7806026 B2 JP 7806026B2 JP 2023511434 A JP2023511434 A JP 2023511434A JP 2023511434 A JP2023511434 A JP 2023511434A JP 7806026 B2 JP7806026 B2 JP 7806026B2
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JP
Japan
Prior art keywords
adhesive layer
semiconductor device
optical semiconductor
group
photosensitive composition
Prior art date
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Active
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JP2023511434A
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English (en)
Japanese (ja)
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JPWO2022210798A5 (https=
JPWO2022210798A1 (https=
Inventor
大希 木下
悠太 齋藤
健太 黒田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaneka Corp
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Kaneka Corp
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Publication of JPWO2022210798A5 publication Critical patent/JPWO2022210798A5/ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/38—Interconnections, e.g. terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/60—Organic compounds having low molecular weight
    • H10K85/649—Aromatic compounds comprising a hetero atom
    • H10K85/654—Aromatic compounds comprising a hetero atom comprising only nitrogen as heteroatom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2023511434A 2021-03-29 2022-03-29 光半導体装置及びその製造方法、固体撮像装置、並びに電子機器 Active JP7806026B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021054899 2021-03-29
JP2021054899 2021-03-29
PCT/JP2022/015715 WO2022210798A1 (ja) 2021-03-29 2022-03-29 光半導体装置及びその製造方法、固体撮像装置、並びに電子機器

Publications (3)

Publication Number Publication Date
JPWO2022210798A1 JPWO2022210798A1 (https=) 2022-10-06
JPWO2022210798A5 JPWO2022210798A5 (https=) 2024-01-04
JP7806026B2 true JP7806026B2 (ja) 2026-01-26

Family

ID=83456403

Family Applications (1)

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JP2023511434A Active JP7806026B2 (ja) 2021-03-29 2022-03-29 光半導体装置及びその製造方法、固体撮像装置、並びに電子機器

Country Status (4)

Country Link
US (1) US20240206322A1 (https=)
JP (1) JP7806026B2 (https=)
CN (1) CN117121184A (https=)
WO (1) WO2022210798A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024039630A (ja) * 2022-09-09 2024-03-22 株式会社カネカ 固体撮像素子パッケージ製造方法および固体撮像素子パッケージ

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296453A (ja) 2003-02-06 2004-10-21 Sharp Corp 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
JP2006041183A (ja) 2004-07-27 2006-02-09 Fujitsu Ltd 撮像装置
JP2012186434A (ja) 2011-02-18 2012-09-27 Sony Corp 固体撮像装置
JP2017003947A (ja) 2015-06-16 2017-01-05 株式会社フジクラ 光学素子パッケージ、光スイッチ、及び光学素子パッケージの製造方法
WO2020246293A1 (ja) 2019-06-06 2020-12-10 ソニーセミコンダクタソリューションズ株式会社 撮像装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4403035B2 (ja) * 2004-07-28 2010-01-20 株式会社リコー 偏光分離素子、光ピックアップ、光ディスク装置、及び偏光分離素子の製造方法
JP4091969B1 (ja) * 2007-07-12 2008-05-28 住友ベークライト株式会社 受光装置および受光装置の製造方法
KR101595455B1 (ko) * 2009-08-10 2016-02-19 엘지디스플레이 주식회사 유기 발광 표시 소자 및 이의 제조 방법
JP2015089951A (ja) * 2013-11-05 2015-05-11 キヤノン・コンポーネンツ株式会社 金属皮膜付物品及びその製造方法並びに配線板
JP2015170638A (ja) * 2014-03-05 2015-09-28 株式会社リコー 撮像素子パッケージ及び撮像装置
JP2018036290A (ja) * 2016-08-29 2018-03-08 株式会社ジャパンディスプレイ 表示装置
JP2020024984A (ja) * 2018-08-06 2020-02-13 株式会社カネカ チップ接着用ポジ型感光性ダイボンド剤、近紫外線硬化性の基板接着剤及びそれを用いたチップの製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296453A (ja) 2003-02-06 2004-10-21 Sharp Corp 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法
JP2006041183A (ja) 2004-07-27 2006-02-09 Fujitsu Ltd 撮像装置
JP2012186434A (ja) 2011-02-18 2012-09-27 Sony Corp 固体撮像装置
JP2017003947A (ja) 2015-06-16 2017-01-05 株式会社フジクラ 光学素子パッケージ、光スイッチ、及び光学素子パッケージの製造方法
WO2020246293A1 (ja) 2019-06-06 2020-12-10 ソニーセミコンダクタソリューションズ株式会社 撮像装置

Also Published As

Publication number Publication date
US20240206322A1 (en) 2024-06-20
CN117121184A (zh) 2023-11-24
JPWO2022210798A1 (https=) 2022-10-06
WO2022210798A1 (ja) 2022-10-06

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