JPWO2022210798A1 - - Google Patents
Info
- Publication number
- JPWO2022210798A1 JPWO2022210798A1 JP2023511434A JP2023511434A JPWO2022210798A1 JP WO2022210798 A1 JPWO2022210798 A1 JP WO2022210798A1 JP 2023511434 A JP2023511434 A JP 2023511434A JP 2023511434 A JP2023511434 A JP 2023511434A JP WO2022210798 A1 JPWO2022210798 A1 JP WO2022210798A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/38—Interconnections, e.g. terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
- H10K39/30—Devices controlled by radiation
- H10K39/32—Organic image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/649—Aromatic compounds comprising a hetero atom
- H10K85/654—Aromatic compounds comprising a hetero atom comprising only nitrogen as heteroatom
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021054899 | 2021-03-29 | ||
| JP2021054899 | 2021-03-29 | ||
| PCT/JP2022/015715 WO2022210798A1 (ja) | 2021-03-29 | 2022-03-29 | 光半導体装置及びその製造方法、固体撮像装置、並びに電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022210798A1 true JPWO2022210798A1 (https=) | 2022-10-06 |
| JPWO2022210798A5 JPWO2022210798A5 (https=) | 2024-01-04 |
| JP7806026B2 JP7806026B2 (ja) | 2026-01-26 |
Family
ID=83456403
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023511434A Active JP7806026B2 (ja) | 2021-03-29 | 2022-03-29 | 光半導体装置及びその製造方法、固体撮像装置、並びに電子機器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20240206322A1 (https=) |
| JP (1) | JP7806026B2 (https=) |
| CN (1) | CN117121184A (https=) |
| WO (1) | WO2022210798A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024039630A (ja) * | 2022-09-09 | 2024-03-22 | 株式会社カネカ | 固体撮像素子パッケージ製造方法および固体撮像素子パッケージ |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| JP2006041183A (ja) * | 2004-07-27 | 2006-02-09 | Fujitsu Ltd | 撮像装置 |
| JP2012186434A (ja) * | 2011-02-18 | 2012-09-27 | Sony Corp | 固体撮像装置 |
| JP2017003947A (ja) * | 2015-06-16 | 2017-01-05 | 株式会社フジクラ | 光学素子パッケージ、光スイッチ、及び光学素子パッケージの製造方法 |
| WO2020246293A1 (ja) * | 2019-06-06 | 2020-12-10 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4403035B2 (ja) * | 2004-07-28 | 2010-01-20 | 株式会社リコー | 偏光分離素子、光ピックアップ、光ディスク装置、及び偏光分離素子の製造方法 |
| JP4091969B1 (ja) * | 2007-07-12 | 2008-05-28 | 住友ベークライト株式会社 | 受光装置および受光装置の製造方法 |
| KR101595455B1 (ko) * | 2009-08-10 | 2016-02-19 | 엘지디스플레이 주식회사 | 유기 발광 표시 소자 및 이의 제조 방법 |
| JP2015089951A (ja) * | 2013-11-05 | 2015-05-11 | キヤノン・コンポーネンツ株式会社 | 金属皮膜付物品及びその製造方法並びに配線板 |
| JP2015170638A (ja) * | 2014-03-05 | 2015-09-28 | 株式会社リコー | 撮像素子パッケージ及び撮像装置 |
| JP2018036290A (ja) * | 2016-08-29 | 2018-03-08 | 株式会社ジャパンディスプレイ | 表示装置 |
| JP2020024984A (ja) * | 2018-08-06 | 2020-02-13 | 株式会社カネカ | チップ接着用ポジ型感光性ダイボンド剤、近紫外線硬化性の基板接着剤及びそれを用いたチップの製造方法 |
-
2022
- 2022-03-29 US US18/283,682 patent/US20240206322A1/en active Pending
- 2022-03-29 WO PCT/JP2022/015715 patent/WO2022210798A1/ja not_active Ceased
- 2022-03-29 CN CN202280024516.2A patent/CN117121184A/zh active Pending
- 2022-03-29 JP JP2023511434A patent/JP7806026B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004296453A (ja) * | 2003-02-06 | 2004-10-21 | Sharp Corp | 固体撮像装置、半導体ウエハ、光学装置用モジュール、固体撮像装置の製造方法及び光学装置用モジュールの製造方法 |
| JP2006041183A (ja) * | 2004-07-27 | 2006-02-09 | Fujitsu Ltd | 撮像装置 |
| JP2012186434A (ja) * | 2011-02-18 | 2012-09-27 | Sony Corp | 固体撮像装置 |
| JP2017003947A (ja) * | 2015-06-16 | 2017-01-05 | 株式会社フジクラ | 光学素子パッケージ、光スイッチ、及び光学素子パッケージの製造方法 |
| WO2020246293A1 (ja) * | 2019-06-06 | 2020-12-10 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20240206322A1 (en) | 2024-06-20 |
| CN117121184A (zh) | 2023-11-24 |
| JP7806026B2 (ja) | 2026-01-26 |
| WO2022210798A1 (ja) | 2022-10-06 |
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