CN117043220A - 酚树脂混合物、硬化性树脂组合物及其硬化物 - Google Patents

酚树脂混合物、硬化性树脂组合物及其硬化物 Download PDF

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Publication number
CN117043220A
CN117043220A CN202280023933.5A CN202280023933A CN117043220A CN 117043220 A CN117043220 A CN 117043220A CN 202280023933 A CN202280023933 A CN 202280023933A CN 117043220 A CN117043220 A CN 117043220A
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CN
China
Prior art keywords
group
phenol resin
resin composition
present application
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280023933.5A
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English (en)
Chinese (zh)
Inventor
长谷川笃彦
中西政隆
井上一真
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Publication of CN117043220A publication Critical patent/CN117043220A/zh
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62Alcohols or phenols
    • C08G59/621Phenols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
CN202280023933.5A 2021-03-23 2022-03-09 酚树脂混合物、硬化性树脂组合物及其硬化物 Pending CN117043220A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-048213 2021-03-23
JP2021048213 2021-03-23
PCT/JP2022/010370 WO2022202335A1 (ja) 2021-03-23 2022-03-09 フェノール樹脂混合物、硬化性樹脂組成物及びその硬化物

Publications (1)

Publication Number Publication Date
CN117043220A true CN117043220A (zh) 2023-11-10

Family

ID=83394930

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280023933.5A Pending CN117043220A (zh) 2021-03-23 2022-03-09 酚树脂混合物、硬化性树脂组合物及其硬化物

Country Status (5)

Country Link
JP (1) JP7160512B1 (ja)
KR (1) KR20230158502A (ja)
CN (1) CN117043220A (ja)
TW (1) TW202248276A (ja)
WO (1) WO2022202335A1 (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003041096A (ja) 2001-07-31 2003-02-13 Sumitomo Bakelite Co Ltd エポキシ樹脂成形材料の製造方法及び半導体装置
JP2013006328A (ja) * 2011-06-23 2013-01-10 Sumitomo Bakelite Co Ltd 積層板、回路基板、および半導体パッケージ
JP5899498B2 (ja) 2011-10-13 2016-04-06 パナソニックIpマネジメント株式会社 半導体封止用エポキシ樹脂組成物とその製造方法および半導体装置
JP6120363B2 (ja) * 2013-04-19 2017-04-26 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
JP2015067615A (ja) * 2013-09-26 2015-04-13 日本化薬株式会社 エポキシ樹脂混合物、硬化性樹脂組成物、およびその硬化物
JP2020070303A (ja) * 2017-03-07 2020-05-07 日本化薬株式会社 硬化性樹脂組成物及びその硬化物

Also Published As

Publication number Publication date
TW202248276A (zh) 2022-12-16
JP7160512B1 (ja) 2022-10-25
JPWO2022202335A1 (ja) 2022-09-29
WO2022202335A1 (ja) 2022-09-29
KR20230158502A (ko) 2023-11-20

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