CN1169034A - 电荷耦合器件(ccd)半导体芯片封装 - Google Patents

电荷耦合器件(ccd)半导体芯片封装 Download PDF

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CN1169034A
CN1169034A CN96120825A CN96120825A CN1169034A CN 1169034 A CN1169034 A CN 1169034A CN 96120825 A CN96120825 A CN 96120825A CN 96120825 A CN96120825 A CN 96120825A CN 1169034 A CN1169034 A CN 1169034A
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崔信
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Abstract

电荷耦合器件(CCD)半导体芯片封装包括有形成于其中央的孔的管座，和从管座的内壁向内延伸的凸起。把多根外引线埋于凸起中，并将一平板连接到凸起的上表面上。把一玻璃盖连接到管座的上表面上，以盖住孔上部。一个芯片有一光接受面，和多个焊料球，一底盖填充孔的下部并支撑所述芯片。该CCD封装芯片使用使外引线直接与焊料球连接的直接连接技术，代替需要高温环境的焊线工艺。与用昂贵材料的如陶瓷管座相比，用价廉的塑料管座，可降低制作半导体封装的材料成本。而且可增强封装可靠性。

Description

电荷耦合器件(CCD)半导体芯片封装
本发明涉及一种半导体封装，特别涉及一种电荷耦合器件(此后称之为“CCD”)的半导体芯片封装。
参见图1，常规CCD半导体封装包括：形成于陶瓷管座2的中心部位的凹槽2a，用于安装芯片4；和在陶瓷管座2的每边上的外引线1。芯片4有一在其上表面部分的光束接受部件4a，由粘结剂3将芯片4连接到凹槽2a的底表面上。内引线1a和芯片4通过导线5相连。用粘结剂6把玻璃盖7连接到陶瓷管座2的外表面上，以便盖住凹槽2a。
然而，常规CCD半导体封装有两个缺点，一是管座2是由昂贵的陶瓷形成，另外，当进行管芯和焊线的连接时，高热和超声波振荡会损伤封装材料或使封装材料变形，从而使封装的生产时间和成本增加。
本发明的优点是减少芯片封装的成本。
本发明的另一个优点是减少芯片封装的生产时间。
本发明的再一个优点是提供一种采用塑料管座的CCD封装。
本发明还有一个优点是增强芯片封装的可靠性。
为了实现上述目的，本发明的CCD半导体芯片封装包括：管座，它有上下贯通地形成于其中央的大孔，和从管座的内壁延伸并朝向管座内部形成的凸起；多个埋在凸起中的外引线，每根外引线的一端暴露于凸起的上表面，其另一端从管座的下表面向下深入到一定程度；内引线板，它具有连接于凸起的上表面的平板，以便与多根外引线的每一端部相连，还有多根从平板向内延伸形成的内引线；连接到管座上表面的玻璃盖，用以覆盖大孔的上部；半导体芯片，它具有形成于其表面上的光束接受部件，和形成于其上的每个芯片焊盘上的多个焊料球，所述芯片被嵌在大孔中，以使多个焊料球的每一个与多根内引线的下表面相连；以及底盖，它填充大孔的下部，并支撑半导体芯片。
下面的说明会部分地表现出本发明的其它优点、目的和其它特点，而且本领域的技术人员通过下面的试验或通过实践本发明会更清楚本发明的这些优点、目的和特点。所附权利要求书所特别指出的方案，可以实现本发明的目的和取得本发明的优点。
下面将参照附图详细说明本发明，各附图中相同的标记表示相同的部件。
图1是表示常规CCD半导体芯片封装的剖面图；
图2是本发明CCD半导体芯片封装的剖面图；
图3是本发明的CCD半导体芯片封装的透视部件图；
图4是图2和3所示的内引线板的基本示意图。
如图2和3所示，在管座10的中心部分上下贯通地形成大孔。从管座10的内圆周延伸形成凸起11，使之接近大孔的中轴。多根外引线12夹在凸起11中。每根外引线12的一端从管座10的下部向外伸出，其另一端暴露于凸起11的上表面上。管座10最好是由塑料材料制成。
用粘结剂14连接平板13与凸起11的上表面。如图4所示，平板13的外面部分13a与凸起11的上表面的形状相同，从外面部分13a向内延伸到一定长度形成多个指状物13b。内引线板可由热固性树脂制成。如图4所示，在平板13的下表面上形成导电薄膜图形13c，使导电薄膜图形13c的一端与暴露于凸起11的表面的每根外引线12电连接。如图2所示，其另一端与形成于芯片焊盘上的焊料球17b电连接。结果，使形成在封装芯片17上的芯片焊盘与外引线12电连接。
在把平板13粘结到凸起11的上表面之后，用粘结剂15把玻璃盖16粘结到管座10的上表面上，以盖住大孔。反转管座10，使玻璃盖16的上表面面向下。把封装芯片嵌入形成于塑料管座10中央的大孔中，使芯片焊盘和光接受面17a面向下。于是封装芯片17被安装在从平板13的外面部分13a延伸的指状物13b上。从而使形成于封装芯片17的每个芯片焊盘上的焊料球17b与形成于内引线13b的每个表面上的导电薄膜13c相连。使凸起11的每个侧表面与封装芯片17的每个侧表面紧密吻合，以防止封装芯片17横向运动。
底盖18很合适地嵌在形成于塑料管座10中的大孔之下部，以封闭大孔的下部。同时，使底盖18的上表面支撑封装芯片17的下表面。底盖18还微微推挤封装芯片17的下表面，因此，由于加在封装芯片17上的力，使指状物13b变得向上弯曲。由被推挤的内引线13b的弹性产生的反弹力，使每个焊料球17b和导电薄膜13c彼此紧密接触。
同时，在凸起11的内圆周下部和在底盖18的外圆周上分别形成锯齿状凹槽10a和锯齿状凸起18a，用它们作锁定机构。一旦将底盖18嵌入大孔的下部中，凹槽10a和凸起18a便相互啮合，以防止底盖18在管座10中的垂直运动。底盖18可由热固树脂材料制成。
如上所述，根据本发明的CCD半导体封装芯片可使用外引线与形成于芯片焊盘上的焊料球直接连接的技术，代替需要高温环境的焊线工艺。在制作半导体封装时，与用昂贵的陶瓷管座相比，用塑料管座可以减少材料成本。所以本发明可简化制造工艺步骤、充分降低材料成本和增加封装的可靠性。
上述实施例中仅是例证性的，并不限制本发明。可以把本发明的方案很容易地用于除CCD之外的其它类型的器件。本发明的说明是说明性的，并不限制权利要求书的范围。对本领域的技术人员来说许多替换、改型和变化都是显然的。

Claims (18)

1.一种半导体芯片封装，包括：
管座，它有形成于其中央的大孔，和从所述管座的内壁向内延伸的凸起；
多根埋在所述凸起中的外引线，每根外引线的一端暴露于所述凸起的上表面，其另一端从管座的下表面向下深入到一定程度；
平板，它具有连接于所述凸起的上表面的外面部分，以便与多根外引线的每一端部相连，还有多个从所述平板向内延伸形成的指状物；
玻璃盖，它与管座上表面连接，用以覆盖所述孔的上部；
半导体芯片，它具有形成于其表面上的光束接受面，和形成于其上的每个芯片焊盘上的多个焊料球，所述芯片被嵌在所述孔中，使多个焊料球的每一个与多个指状物的下表面相连；以及
底盖，它填充所述孔的下部，并支撑所述半导体芯片。
2.如权利要求1所述的半导体芯片封装，其特征在于：所述平板由热固树脂制成。
3.如权利要求1所述的芯片封装，其特征在于：多个导电薄膜图形形成于所述平板的下表面上，以使每个薄膜图形的一端与每根外引线相连，其另一端与每个焊料球相连。
4.如权利要求1所述的芯片封装，其特征在于：所述管座由塑料材料制成。
5.如权利要求1所述的芯片封装，其特征在于：所述底盖由塑料材料制成。
6.如权利要求1所述的芯片封装，其特征在于：锯齿状凹槽和凸起分别形成于所述管座的内圆周下部和所述底盖的外圆周上。
7.一种芯片封装，包括；
集成芯片，它有多个导电介质；
管座，它带有其中埋有多根引线的凸起，所述凸起限定了安装所述半导体芯片的空间，所述多根引线的端部暴露于所述凸起的表面上；
平板，它有安装于所述凸起表面上的部分、从该部分伸出的多个指状延伸物、和多个导电薄膜，每个导电薄膜从所述指状延伸物延伸到所述部分，以便在把所述平板安装于所述凸起的表面上时，使所述多个导电薄膜与所述多根引线的端部接触；以及
安装于所述管座上的第一盖，其特征在于：
所述集成芯片嵌在所述空间内，使相应的导电介质与相应的电连接所述引线的导电薄膜接触。
8.如权利要求7所述的封装，还包括嵌在所述空间内的第二盖。
9.如权利要求8所述的封装，还包括把所述第二盖锁室在由所述凸起限定的空间内的装置。
10.如权利要求9所述的封装，其特征在于：所述锁定装置包括形成于所述凸起上的锯齿状凹槽和形成于所述第二盖上的锯齿状凸起，以使所述凹槽和所述凸起彼此牢固地锁定。
11.如权利要求8所述的封装，其特征在于：当所述第二盖嵌在所述开口中时，所述多个指状延伸物向所述第一盖的方向弹性弯曲。
12.如权利要求7所述的封装，其特征在于：所述集成芯片是有光接受面的电荷耦合器件，所述第一盖允许光进入封装，以便由光接受面接受光。
13.如权利要求7所述的封装，其特征在于：所述第一盖为透光盖。
14.如权利要求7所述的封装，其特征在于：所述多根引线延伸到管座下表面之外。
15.如权利要求7所述的封装，其特征在于：所述平板由热固树脂制成。
16.如权利要求7所述的封装，其特征在于：所述管座由塑料材料制成。
17.如权利要求8所述的封装，其特征在于：所述第二盖由塑料材料制成。
18.如权利要求7所述的封装，其特征在于：所述多个导电介质是多个焊料球。
CN96120825A 1996-06-14 1996-11-25 电荷耦合器件(ccd)半导体芯片封装 Pending CN1169034A (zh)

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