CN116762170A - 功率半导体装置及其制造方法以及电力转换装置 - Google Patents

功率半导体装置及其制造方法以及电力转换装置 Download PDF

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Publication number
CN116762170A
CN116762170A CN202280009644.XA CN202280009644A CN116762170A CN 116762170 A CN116762170 A CN 116762170A CN 202280009644 A CN202280009644 A CN 202280009644A CN 116762170 A CN116762170 A CN 116762170A
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CN
China
Prior art keywords
concave
base
convex portion
module
radiator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280009644.XA
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English (en)
Chinese (zh)
Inventor
三田泰之
后藤正喜
寺田隼人
六分一穗隆
多田晴菜
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN116762170A publication Critical patent/CN116762170A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/01—Manufacture or treatment
    • H10W40/03—Manufacture or treatment of arrangements for cooling
    • H10W40/037—Assembling together parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
    • H10W70/027—Mechanical treatments, e.g. deforming, punching or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN202280009644.XA 2021-01-22 2022-01-14 功率半导体装置及其制造方法以及电力转换装置 Pending CN116762170A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-008385 2021-01-22
JP2021008385 2021-01-22
PCT/JP2022/001154 WO2022158392A1 (ja) 2021-01-22 2022-01-14 パワー半導体装置およびその製造方法ならびに電力変換装置

Publications (1)

Publication Number Publication Date
CN116762170A true CN116762170A (zh) 2023-09-15

Family

ID=82548896

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280009644.XA Pending CN116762170A (zh) 2021-01-22 2022-01-14 功率半导体装置及其制造方法以及电力转换装置

Country Status (4)

Country Link
US (1) US12477704B2 (https=)
JP (1) JP7433480B2 (https=)
CN (1) CN116762170A (https=)
WO (1) WO2022158392A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM630490U (zh) * 2022-05-06 2022-08-01 藍天電腦股份有限公司 散熱模組
CN119183607A (zh) * 2022-05-16 2024-12-24 三菱电机株式会社 功率模块、功率模块的制造方法及电力变换装置
CN120981919A (zh) * 2023-04-11 2025-11-18 三菱电机株式会社 半导体装置及其制造方法以及电力转换装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH065750A (ja) 1992-06-19 1994-01-14 Hitachi Ltd 半導体素子の冷却機構
JP3552047B2 (ja) * 2000-10-25 2004-08-11 古河電気工業株式会社 ヒートシンク、その製造方法、および、押圧治具
TW200707676A (en) * 2005-08-09 2007-02-16 Chipmos Technologies Inc Thin IC package for improving heat dissipation from chip backside
WO2011061779A1 (ja) 2009-11-17 2011-05-26 三菱電機株式会社 放熱機器及び放熱機器の製造方法
JP2011155118A (ja) 2010-01-27 2011-08-11 Hitachi Ltd ヒートシンク取付体およびヒートシンク取付け方法
JP5373688B2 (ja) 2010-04-06 2013-12-18 三菱電機株式会社 ヒートシンク及びヒートシンク一体型パワーモジュール
JP5432085B2 (ja) 2010-08-24 2014-03-05 三菱電機株式会社 電力半導体装置
WO2013114647A1 (ja) * 2012-01-31 2013-08-08 三菱電機株式会社 半導体装置とその製造方法
JP5831273B2 (ja) * 2012-02-09 2015-12-09 三菱電機株式会社 半導体装置およびその製造方法
JP6009209B2 (ja) 2012-04-26 2016-10-19 三菱電機株式会社 ヒートシンクの製造方法およびヒートシンク一体型半導体モジュールの製造方法
DE102012105110A1 (de) * 2012-06-13 2013-12-19 Osram Opto Semiconductors Gmbh Montageträger und Verfahren zur Montage eines Montageträgers auf einem Anschlussträger
CN103703562B (zh) 2012-07-31 2015-08-26 三菱电机株式会社 功率半导体装置
JP5975909B2 (ja) * 2013-03-14 2016-08-23 三菱電機株式会社 半導体装置
US9892992B2 (en) * 2013-09-27 2018-02-13 Mitsubishi Electric Corporation Swaged heat sink and heat sink integrated power module
DE112013007667T5 (de) * 2013-12-05 2016-08-25 Mitsubishi Electric Corporation Leistungshalbleitervorrichtung
JP6503224B2 (ja) * 2015-05-19 2019-04-17 Ａｐｓジャパン株式会社 ヒートシンク
CN109891579B (zh) * 2016-10-31 2023-06-20 三菱电机株式会社 半导体装置及其制造方法
US11152280B2 (en) * 2016-11-24 2021-10-19 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
WO2020261730A1 (ja) 2019-06-25 2020-12-30 Ｎｇｋエレクトロデバイス株式会社 パッケージ、および、パワー半導体モジュールの製造方法

Also Published As

Publication number Publication date
JPWO2022158392A1 (https=) 2022-07-28
US12477704B2 (en) 2025-11-18
US20240074122A1 (en) 2024-02-29
WO2022158392A1 (ja) 2022-07-28
JP7433480B2 (ja) 2024-02-19

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