CN116324045B - 基板保持器、镀覆装置以及镀覆装置的制造方法 - Google Patents
基板保持器、镀覆装置以及镀覆装置的制造方法 Download PDFInfo
- Publication number
- CN116324045B CN116324045B CN202180064554.6A CN202180064554A CN116324045B CN 116324045 B CN116324045 B CN 116324045B CN 202180064554 A CN202180064554 A CN 202180064554A CN 116324045 B CN116324045 B CN 116324045B
- Authority
- CN
- China
- Prior art keywords
- seal
- opening
- substrate
- plating
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 193
- 238000007747 plating Methods 0.000 title claims abstract description 162
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 7
- 230000002093 peripheral effect Effects 0.000 claims abstract description 8
- 238000003825 pressing Methods 0.000 claims description 4
- 238000013459 approach Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 9
- 238000012546 transfer Methods 0.000 description 27
- 238000004088 simulation Methods 0.000 description 17
- 238000004140 cleaning Methods 0.000 description 13
- 230000005684 electric field Effects 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- 230000000694 effects Effects 0.000 description 11
- 238000009826 distribution Methods 0.000 description 8
- 238000009736 wetting Methods 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000012856 packing Methods 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000032258 transport Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000009545 invasion Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/004—Sealing devices
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/008102 WO2022185435A1 (ja) | 2021-03-03 | 2021-03-03 | 基板ホルダ、めっき装置、及びめっき装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116324045A CN116324045A (zh) | 2023-06-23 |
| CN116324045B true CN116324045B (zh) | 2023-12-08 |
Family
ID=83154003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202180064554.6A Active CN116324045B (zh) | 2021-03-03 | 2021-03-03 | 基板保持器、镀覆装置以及镀覆装置的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230383431A1 (ja) |
| JP (1) | JP7192132B1 (ja) |
| KR (1) | KR102553048B1 (ja) |
| CN (1) | CN116324045B (ja) |
| WO (1) | WO2022185435A1 (ja) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002294495A (ja) * | 2001-03-29 | 2002-10-09 | Tokyo Electron Ltd | 液処理装置 |
| JP2008184692A (ja) * | 2008-04-25 | 2008-08-14 | Ebara Corp | 基板めっき用治具、基板めっき装置 |
| CN105525333A (zh) * | 2014-10-16 | 2016-04-27 | 株式会社荏原制作所 | 基板支架和电镀装置 |
| CN106480480A (zh) * | 2015-08-28 | 2017-03-08 | 株式会社荏原制作所 | 镀覆装置、镀覆方法、及基板保持器 |
| JP2017137519A (ja) * | 2016-02-01 | 2017-08-10 | 株式会社荏原製作所 | めっき装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6159354A (en) | 1997-11-13 | 2000-12-12 | Novellus Systems, Inc. | Electric potential shaping method for electroplating |
| JP5782398B2 (ja) * | 2012-03-27 | 2015-09-24 | 株式会社荏原製作所 | めっき方法及びめっき装置 |
| JP6659467B2 (ja) * | 2016-06-03 | 2020-03-04 | 株式会社荏原製作所 | めっき装置、基板ホルダ、めっき装置の制御方法、及び、めっき装置の制御方法をコンピュータに実行させるためのプログラムを格納した記憶媒体 |
| JP2020105576A (ja) * | 2018-12-27 | 2020-07-09 | 株式会社荏原製作所 | 基板ホルダおよびめっき装置 |
-
2021
- 2021-03-03 KR KR1020237008184A patent/KR102553048B1/ko active IP Right Grant
- 2021-03-03 US US18/027,588 patent/US20230383431A1/en active Pending
- 2021-03-03 CN CN202180064554.6A patent/CN116324045B/zh active Active
- 2021-03-03 JP JP2021539016A patent/JP7192132B1/ja active Active
- 2021-03-03 WO PCT/JP2021/008102 patent/WO2022185435A1/ja active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002294495A (ja) * | 2001-03-29 | 2002-10-09 | Tokyo Electron Ltd | 液処理装置 |
| JP2008184692A (ja) * | 2008-04-25 | 2008-08-14 | Ebara Corp | 基板めっき用治具、基板めっき装置 |
| CN105525333A (zh) * | 2014-10-16 | 2016-04-27 | 株式会社荏原制作所 | 基板支架和电镀装置 |
| CN106480480A (zh) * | 2015-08-28 | 2017-03-08 | 株式会社荏原制作所 | 镀覆装置、镀覆方法、及基板保持器 |
| JP2017137519A (ja) * | 2016-02-01 | 2017-08-10 | 株式会社荏原製作所 | めっき装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022185435A1 (ja) | 2022-09-09 |
| KR20230038606A (ko) | 2023-03-20 |
| KR102553048B1 (ko) | 2023-07-10 |
| JP7192132B1 (ja) | 2022-12-19 |
| US20230383431A1 (en) | 2023-11-30 |
| CN116324045A (zh) | 2023-06-23 |
| JPWO2022185435A1 (ja) | 2022-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6576110B2 (en) | Coated anode apparatus and associated method | |
| US6197182B1 (en) | Apparatus and method for plating wafers, substrates and other articles | |
| JP4766579B2 (ja) | 電気化学堆積装置 | |
| US9376758B2 (en) | Electroplating method | |
| US20050082163A1 (en) | Plating apparatus and method | |
| US6551484B2 (en) | Reverse voltage bias for electro-chemical plating system and method | |
| JPWO2004009879A1 (ja) | めっき装置 | |
| CN114916234B (zh) | 镀覆装置以及镀覆处理方法 | |
| CN115135618A (zh) | 镀覆方法及镀覆装置 | |
| WO2022157852A1 (ja) | めっき装置及び基板の膜厚測定方法 | |
| CN116324045B (zh) | 基板保持器、镀覆装置以及镀覆装置的制造方法 | |
| CN117500960A (zh) | 镀覆装置 | |
| JP7093187B2 (ja) | 半導体基板を電気化学的に処理するための装置 | |
| US20040020780A1 (en) | Immersion bias for use in electro-chemical plating system | |
| TW202235693A (zh) | 基板固持器、鍍覆裝置、及鍍覆裝置之製造方法 | |
| CN114787428B (zh) | 调整镀覆模块的方法 | |
| JP7128385B1 (ja) | めっき装置、及びめっき装置の製造方法 | |
| CN116897226B (zh) | 镀覆装置以及镀覆方法 | |
| WO2022264353A1 (ja) | 抵抗体、及び、めっき装置 | |
| TWI837780B (zh) | 鍍覆裝置及鍍覆方法 | |
| WO2023148950A1 (ja) | めっき装置 | |
| US20230167571A1 (en) | Lipseal edge exclusion engineering to maintain material integrity at wafer edge | |
| WO2023157105A1 (ja) | めっき装置、及びめっき方法 | |
| TW202409358A (zh) | 鍍覆裝置及鍍覆方法 | |
| CN115210413A (zh) | 镀覆装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |