CN116090496A - 制造多层芯片卡的方法及多层芯片卡 - Google Patents

制造多层芯片卡的方法及多层芯片卡 Download PDF

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Publication number
CN116090496A
CN116090496A CN202111312786.7A CN202111312786A CN116090496A CN 116090496 A CN116090496 A CN 116090496A CN 202111312786 A CN202111312786 A CN 202111312786A CN 116090496 A CN116090496 A CN 116090496A
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CN
China
Prior art keywords
layer structure
layer
core
chip
label
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111312786.7A
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English (en)
Chinese (zh)
Inventor
汪敦谱
M.尼德恩胡伯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient GmbH
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Giesecke and Devrient GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Giesecke and Devrient GmbH filed Critical Giesecke and Devrient GmbH
Priority to CN202111312786.7A priority Critical patent/CN116090496A/zh
Priority to JP2022178813A priority patent/JP7719761B2/ja
Publication of CN116090496A publication Critical patent/CN116090496A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Credit Cards Or The Like (AREA)
CN202111312786.7A 2021-11-08 2021-11-08 制造多层芯片卡的方法及多层芯片卡 Pending CN116090496A (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202111312786.7A CN116090496A (zh) 2021-11-08 2021-11-08 制造多层芯片卡的方法及多层芯片卡
JP2022178813A JP7719761B2 (ja) 2021-11-08 2022-11-08 多層チップカードを製造する方法および多層チップカード

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111312786.7A CN116090496A (zh) 2021-11-08 2021-11-08 制造多层芯片卡的方法及多层芯片卡

Publications (1)

Publication Number Publication Date
CN116090496A true CN116090496A (zh) 2023-05-09

Family

ID=86187408

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111312786.7A Pending CN116090496A (zh) 2021-11-08 2021-11-08 制造多层芯片卡的方法及多层芯片卡

Country Status (2)

Country Link
JP (1) JP7719761B2 (https=)
CN (1) CN116090496A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250157143A (ko) * 2024-04-26 2025-11-04 엘지이노텍 주식회사 스마트 ic 기판, 스마트 ic 모듈 및 이를 포함하는 ic 카드

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19916781A1 (de) * 1999-04-14 2000-10-26 Austria Card Gmbh Wien Dünn-Transponder-Chip-Karte und Herstellverfahren dazu
CN1467685A (zh) * 2002-06-11 2004-01-14 ����Techwin��ʽ���� Ic卡及其制造方法
CN102007503A (zh) * 2008-04-18 2011-04-06 德国捷德有限公司 芯片卡及其制造方法
JP2014112408A (ja) * 2014-01-21 2014-06-19 Dainippon Printing Co Ltd 非接触ｉｃカード
EP2835768A1 (fr) * 2013-08-06 2015-02-11 Oberthur Technologies Carte à puce et procédé de fabrication d'une telle carte à puce
CN104471593A (zh) * 2012-07-12 2015-03-25 爱莎·艾伯莱有限公司 功能嵌体的制造方法
CN104882416A (zh) * 2013-11-13 2015-09-02 钰桥半导体股份有限公司 具有堆叠式封装能力的半导体封装件及其制作方法
EP2937823A1 (fr) * 2014-04-24 2015-10-28 Linxens Holding Procédé de fabrication d'une structure pour carte à puce et structure de carte à puce obtenue par ce procédé
CN107209870A (zh) * 2014-09-30 2017-09-26 兰克森控股公司 芯片卡制造方法和利用该方法获得的芯片卡
CN108292373A (zh) * 2015-12-04 2018-07-17 黄永生 用于嵌入集成电路倒装芯片的方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3916407B2 (ja) 2001-03-21 2007-05-16 松下電器産業株式会社 積層型電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び電子部品実装済完成品
JP4241148B2 (ja) 2003-04-10 2009-03-18 ソニー株式会社 Ｉｃカード及びその製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19916781A1 (de) * 1999-04-14 2000-10-26 Austria Card Gmbh Wien Dünn-Transponder-Chip-Karte und Herstellverfahren dazu
CN1467685A (zh) * 2002-06-11 2004-01-14 ����Techwin��ʽ���� Ic卡及其制造方法
CN102007503A (zh) * 2008-04-18 2011-04-06 德国捷德有限公司 芯片卡及其制造方法
CN104471593A (zh) * 2012-07-12 2015-03-25 爱莎·艾伯莱有限公司 功能嵌体的制造方法
EP2835768A1 (fr) * 2013-08-06 2015-02-11 Oberthur Technologies Carte à puce et procédé de fabrication d'une telle carte à puce
CN104882416A (zh) * 2013-11-13 2015-09-02 钰桥半导体股份有限公司 具有堆叠式封装能力的半导体封装件及其制作方法
JP2014112408A (ja) * 2014-01-21 2014-06-19 Dainippon Printing Co Ltd 非接触ｉｃカード
EP2937823A1 (fr) * 2014-04-24 2015-10-28 Linxens Holding Procédé de fabrication d'une structure pour carte à puce et structure de carte à puce obtenue par ce procédé
CN107209870A (zh) * 2014-09-30 2017-09-26 兰克森控股公司 芯片卡制造方法和利用该方法获得的芯片卡
CN108292373A (zh) * 2015-12-04 2018-07-17 黄永生 用于嵌入集成电路倒装芯片的方法

Also Published As

Publication number Publication date
JP7719761B2 (ja) 2025-08-06
JP2023070191A (ja) 2023-05-18

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Country or region after: Germany

Address after: Munich, Germany

Applicant after: Jiede Electronic Payment Co.,Ltd.

Address before: Munich, Germany

Applicant before: GIESECKE & DEVRIENT GmbH

Country or region before: Germany