JP7719761B2 - 多層チップカードを製造する方法および多層チップカード - Google Patents

多層チップカードを製造する方法および多層チップカード

Info

Publication number
JP7719761B2
JP7719761B2 JP2022178813A JP2022178813A JP7719761B2 JP 7719761 B2 JP7719761 B2 JP 7719761B2 JP 2022178813 A JP2022178813 A JP 2022178813A JP 2022178813 A JP2022178813 A JP 2022178813A JP 7719761 B2 JP7719761 B2 JP 7719761B2
Authority
JP
Japan
Prior art keywords
layer structure
chip
core layer
label
contact pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022178813A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023070191A5 (https=
JP2023070191A (ja
Inventor
ワン ドゥンプゥ
ニーダーフーバー ミレーナ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient ePayments GmbH
Original Assignee
Giesecke and Devrient ePayments GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient ePayments GmbH filed Critical Giesecke and Devrient ePayments GmbH
Publication of JP2023070191A publication Critical patent/JP2023070191A/ja
Publication of JP2023070191A5 publication Critical patent/JP2023070191A5/ja
Application granted granted Critical
Publication of JP7719761B2 publication Critical patent/JP7719761B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Credit Cards Or The Like (AREA)
JP2022178813A 2021-11-08 2022-11-08 多層チップカードを製造する方法および多層チップカード Active JP7719761B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202111312786.7A CN116090496A (zh) 2021-11-08 2021-11-08 制造多层芯片卡的方法及多层芯片卡
CN202111312786.7 2021-11-08

Publications (3)

Publication Number Publication Date
JP2023070191A JP2023070191A (ja) 2023-05-18
JP2023070191A5 JP2023070191A5 (https=) 2024-06-28
JP7719761B2 true JP7719761B2 (ja) 2025-08-06

Family

ID=86187408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022178813A Active JP7719761B2 (ja) 2021-11-08 2022-11-08 多層チップカードを製造する方法および多層チップカード

Country Status (2)

Country Link
JP (1) JP7719761B2 (https=)
CN (1) CN116090496A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250157143A (ko) * 2024-04-26 2025-11-04 엘지이노텍 주식회사 스마트 ic 기판, 스마트 ic 모듈 및 이를 포함하는 ic 카드

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280744A (ja) 2001-03-21 2002-09-27 Matsushita Electric Ind Co Ltd 積層型電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び電子部品実装済完成品
JP2004310620A (ja) 2003-04-10 2004-11-04 Sony Corp Ｉｃカード及びその製造方法
JP2019500749A (ja) 2015-12-04 2019-01-10 アン セン ウン 集積回路フリップチップの埋込方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19916781B4 (de) * 1999-04-14 2006-02-16 Austria Card Gmbh Kontaktlose Chip-Karte und Herstellverfahren dazu
KR100910769B1 (ko) * 2002-06-11 2009-08-04 삼성테크윈 주식회사 Ｉｃ 카드 및, 그것의 제조 방법
DE102008019571A1 (de) * 2008-04-18 2009-10-22 Giesecke & Devrient Gmbh Chipkarte und Verfahren zu deren Herstellung
EP2873031B1 (en) * 2012-07-12 2018-08-22 Assa Abloy Ab Method of manufacturing a functional inlay
FR3009636B1 (fr) * 2013-08-06 2015-09-04 Oberthur Technologies Carte a puce et procede de fabrication d'une telle carte a puce
US9318411B2 (en) * 2013-11-13 2016-04-19 Brodge Semiconductor Corporation Semiconductor package with package-on-package stacking capability and method of manufacturing the same
JP2014112408A (ja) * 2014-01-21 2014-06-19 Dainippon Printing Co Ltd 非接触ｉｃカード
FR3020548B1 (fr) * 2014-04-24 2020-02-14 Linxens Holding Procede de fabrication d'une structure pour carte a puce et structure de carte a puce obtenue par ce procede
FR3026529B1 (fr) * 2014-09-30 2017-12-29 Linxens Holding Procede de fabrication de carte a puce et carte a puce obtenue par ce procede.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280744A (ja) 2001-03-21 2002-09-27 Matsushita Electric Ind Co Ltd 積層型電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び電子部品実装済完成品
JP2004310620A (ja) 2003-04-10 2004-11-04 Sony Corp Ｉｃカード及びその製造方法
JP2019500749A (ja) 2015-12-04 2019-01-10 アン セン ウン 集積回路フリップチップの埋込方法

Also Published As

Publication number Publication date
CN116090496A (zh) 2023-05-09
JP2023070191A (ja) 2023-05-18

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