CN116042142A - 粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法以及制造方法 - Google Patents

粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法以及制造方法 Download PDF

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Publication number
CN116042142A
CN116042142A CN202310111955.3A CN202310111955A CN116042142A CN 116042142 A CN116042142 A CN 116042142A CN 202310111955 A CN202310111955 A CN 202310111955A CN 116042142 A CN116042142 A CN 116042142A
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China
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weight
meth
adhesive composition
acrylate
acrylic copolymer
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Pending
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CN202310111955.3A
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English (en)
Chinese (zh)
Inventor
足立绚
内田德之
渡边重一
绪方雄大
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN116042142A publication Critical patent/CN116042142A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062—Copolymers with monomers not covered by C09J133/06
    • C09J133/066—Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1807—C7-(meth)acrylate, e.g. heptyl (meth)acrylate or benzyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
    • C08L93/04—Rosin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/354—Applications of adhesives in processes or use of adhesives in the form of films or foils for automotive applications
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
CN202310111955.3A 2019-12-18 2020-12-17 粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法以及制造方法 Pending CN116042142A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2019228410 2019-12-18
JP2019-228410 2019-12-18
PCT/JP2020/047202 WO2021125278A1 (ja) 2019-12-18 2020-12-17 粘着剤組成物、粘着テープ、電子機器部品又は車載部品の固定方法、及び、電子機器部品又は車載部品の製造方法
CN202080079568.0A CN114729249B (zh) 2019-12-18 2020-12-17 粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法、以及电子设备部件或车载部件的制造方法

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CN202310111955.3A Pending CN116042142A (zh) 2019-12-18 2020-12-17 粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法以及制造方法
CN202310111953.4A Pending CN116102996A (zh) 2019-12-18 2020-12-17 粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法以及制造方法
CN202080079568.0A Active CN114729249B (zh) 2019-12-18 2020-12-17 粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法、以及电子设备部件或车载部件的制造方法

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CN202080079568.0A Active CN114729249B (zh) 2019-12-18 2020-12-17 粘合剂组合物、粘合带、电子设备部件或车载部件的固定方法、以及电子设备部件或车载部件的制造方法

Country Status (7)

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US (1) US20230047920A1 (enExample)
EP (1) EP4079823A4 (enExample)
JP (5) JP7132429B2 (enExample)
KR (3) KR20250127171A (enExample)
CN (3) CN116042142A (enExample)
TW (2) TWI807236B (enExample)
WO (1) WO2021125278A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7536181B2 (ja) * 2020-08-14 2024-08-19 テーザ・ソシエタス・ヨーロピア 感圧接着剤組成物
CN118119682A (zh) * 2021-10-25 2024-05-31 日东电工株式会社 粘合剂组合物、粘合剂、粘合片以及表面保护膜
JP7311695B1 (ja) * 2022-03-29 2023-07-19 日東電工株式会社 粘着シート
JP7321328B1 (ja) * 2022-07-04 2023-08-04 日東電工株式会社 粘着シート
JP7387824B1 (ja) 2022-07-04 2023-11-28 日東電工株式会社 粘着シート
JP7321342B1 (ja) 2022-09-13 2023-08-04 日東電工株式会社 剥離ライナー付き両面粘着シート
JP7321343B1 (ja) 2022-09-13 2023-08-04 日東電工株式会社 両面粘着シート
JP7308342B1 (ja) 2022-09-13 2023-07-13 日東電工株式会社 粘着シート
JP7321344B1 (ja) 2022-09-13 2023-08-04 日東電工株式会社 粘着シート
DE102022134275A1 (de) * 2022-12-21 2024-06-27 Tesa Se Nachhaltiges Haftklebeband
TW202509091A (zh) * 2023-08-16 2025-03-01 德商巴斯夫歐洲公司 適合作為水性塗料組成物中之黏合劑之共聚物之含水聚合物乳膠

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846236B2 (ja) * 1980-03-05 1983-10-14 日東電工株式会社 感圧性接着剤組成物
JPH0770534A (ja) * 1993-09-01 1995-03-14 Showa Denko Kk 水溶性粘着剤用樹脂
CN1764679A (zh) * 2004-01-20 2006-04-26 Lg化学株式会社 用于偏振膜的丙烯酸系压敏粘合剂组合物
CN101517026A (zh) * 2006-10-13 2009-08-26 3M创新有限公司 (甲基)丙烯酸2-辛酯粘合剂组合物
CN103620742A (zh) * 2011-07-01 2014-03-05 古河电气工业株式会社 粘接膜、切割芯片接合膜及使用该切割芯片接合膜的半导体加工方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6337128B1 (en) * 1997-12-16 2002-01-08 Nitto Denko Corporation Pressure-sensitive adhesion sheets for silicone oxide-containing material
JP2001335757A (ja) * 2000-05-29 2001-12-04 Sekisui Chem Co Ltd 粘着テープ
JP2008050563A (ja) * 2006-07-27 2008-03-06 Yasuhara Chemical Co Ltd アクリル系粘着剤組成物および該組成物を用いた粘着シート又は粘着テープ
JP5146824B2 (ja) * 2008-06-09 2013-02-20 株式会社リコー 粘着転写用液体現像剤
KR101082447B1 (ko) * 2008-07-16 2011-11-11 주식회사 엘지화학 점착제 조성물, 편광판 및 액정표시장치
JP5539630B2 (ja) * 2008-08-04 2014-07-02 日東電工株式会社 両面粘着シート、発泡体の固定方法および積層体
PL219947B1 (pl) * 2010-10-07 2015-08-31 Univ West Pomeranian Szczecin Tech Sposób wytwarzania bezrozpuszczalnikowego poliakrylanowego kleju samoprzylepnego
RU2620384C2 (ru) 2013-02-18 2017-05-25 3М Инновейтив Пропертиз Компани Самоклеящаяся клейкая лента и изделия из нее
JP5700466B2 (ja) * 2013-07-19 2015-04-15 日東電工株式会社 再剥離粘着剤組成物、粘着シート及びテープ
JP2015021067A (ja) 2013-07-19 2015-02-02 Dic株式会社 熱伝導性粘着テープ、物品及び画像表示装置
JP6100654B2 (ja) 2013-09-06 2017-03-22 帝人株式会社 耐熱性粘着テープ用基材及びそれからなる耐熱性粘着テープ
JP6367598B2 (ja) 2013-11-22 2018-08-01 日東電工株式会社 両面粘着シート
JP6364224B2 (ja) * 2014-05-02 2018-07-25 積水化学工業株式会社 光学フィルム固定用両面粘着テープ
KR102266186B1 (ko) * 2015-12-28 2021-06-17 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 점착제용 조성물, 점착제층 및 점착 시트
DE102016202479A1 (de) * 2016-02-18 2017-08-24 Tesa Se Haftklebestreifen
KR102036463B1 (ko) * 2016-11-21 2019-10-24 닛토덴코 가부시키가이샤 점착 시트
JP7065655B2 (ja) * 2017-03-16 2022-05-12 積水化学工業株式会社 粘着テープ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5846236B2 (ja) * 1980-03-05 1983-10-14 日東電工株式会社 感圧性接着剤組成物
JPH0770534A (ja) * 1993-09-01 1995-03-14 Showa Denko Kk 水溶性粘着剤用樹脂
CN1764679A (zh) * 2004-01-20 2006-04-26 Lg化学株式会社 用于偏振膜的丙烯酸系压敏粘合剂组合物
CN101517026A (zh) * 2006-10-13 2009-08-26 3M创新有限公司 (甲基)丙烯酸2-辛酯粘合剂组合物
CN103620742A (zh) * 2011-07-01 2014-03-05 古河电气工业株式会社 粘接膜、切割芯片接合膜及使用该切割芯片接合膜的半导体加工方法

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CN116004155A (zh) 2023-04-25
CN114729249B (zh) 2023-03-07
CN114729249A (zh) 2022-07-08
KR20250127171A (ko) 2025-08-26
JP7197662B2 (ja) 2022-12-27
US20230047920A1 (en) 2023-02-16
JP2022003154A (ja) 2022-01-11
JP7770975B2 (ja) 2025-11-17
KR102561874B1 (ko) 2023-07-31
JPWO2021125278A1 (ja) 2021-12-23
JP7084539B2 (ja) 2022-06-14
TWI890068B (zh) 2025-07-11
EP4079823A4 (en) 2023-08-02
TW202132521A (zh) 2021-09-01
CN116102996A (zh) 2023-05-12
JP2022082805A (ja) 2022-06-02
KR102847464B1 (ko) 2025-08-18
KR20220114523A (ko) 2022-08-17
KR20230114759A (ko) 2023-08-01
JP7132452B2 (ja) 2022-09-06
WO2021125278A1 (ja) 2021-06-24
JP7132429B2 (ja) 2022-09-06
EP4079823A1 (en) 2022-10-26
JP2022003155A (ja) 2022-01-11
JP2022105090A (ja) 2022-07-12
TW202336200A (zh) 2023-09-16
TWI807236B (zh) 2023-07-01

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