CN115810561B - 供给罐、供给装置、供给系统 - Google Patents

供给罐、供给装置、供给系统 Download PDF

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Publication number
CN115810561B
CN115810561B CN202211077714.3A CN202211077714A CN115810561B CN 115810561 B CN115810561 B CN 115810561B CN 202211077714 A CN202211077714 A CN 202211077714A CN 115810561 B CN115810561 B CN 115810561B
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China
Prior art keywords
region
processing liquid
liquid
pipe
partition plate
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CN202211077714.3A
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English (en)
Chinese (zh)
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CN115810561A (zh
Inventor
古矢正明
小林浩秋
森秀树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Publication of CN115810561A publication Critical patent/CN115810561A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
  • Feeding And Watering For Cattle Raising And Animal Husbandry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202211077714.3A 2021-09-13 2022-09-05 供给罐、供给装置、供给系统 Active CN115810561B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021148834A JP7438171B2 (ja) 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム
JP2021-148834 2021-09-13

Publications (2)

Publication Number Publication Date
CN115810561A CN115810561A (zh) 2023-03-17
CN115810561B true CN115810561B (zh) 2025-07-08

Family

ID=85479813

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211077714.3A Active CN115810561B (zh) 2021-09-13 2022-09-05 供给罐、供给装置、供给系统

Country Status (5)

Country Link
US (1) US12347699B2 (https=)
JP (1) JP7438171B2 (https=)
KR (2) KR102658584B1 (https=)
CN (1) CN115810561B (https=)
TW (2) TWI814577B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム
CN117259313B (zh) * 2022-06-14 2026-03-20 天津市环欧新能源技术有限公司 一种储液槽及设有该储液槽的清洗机

Citations (2)

* Cited by examiner, † Cited by third party
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CN1981375A (zh) * 2004-07-02 2007-06-13 东京毅力科创株式会社 半导体器件的制造方法
CN107112226A (zh) * 2014-12-16 2017-08-29 东京毅力科创株式会社 基板液处理装置

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JPH0978263A (ja) * 1995-09-12 1997-03-25 Hitachi Ltd Ｃｒエッチング装置
JP2002110588A (ja) * 2000-09-27 2002-04-12 Nec Kansai Ltd チップ製造装置
JP3761457B2 (ja) 2001-12-04 2006-03-29 Ｎｅｃエレクトロニクス株式会社 半導体基板の薬液処理装置
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TWI439571B (zh) * 2007-01-15 2014-06-01 芝浦機械電子裝置股份有限公司 Sulfuric acid electrolysis device, electrolysis method and substrate processing device
JP5148889B2 (ja) * 2007-02-09 2013-02-20 株式会社東芝 洗浄方法及び電子デバイスの製造方法
JP5173500B2 (ja) 2008-03-11 2013-04-03 大日本スクリーン製造株式会社 処理液供給装置およびそれを備えた基板処理装置
CA2634672C (en) * 2008-06-09 2013-03-12 Jerry Hanna Water reaction tank
US20120006790A1 (en) * 2009-03-31 2012-01-12 Kurita Water Industries Ltd. Apparatus and method for treating etching solution
JP5106523B2 (ja) * 2009-12-16 2012-12-26 株式会社東芝 エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置
KR101344915B1 (ko) * 2011-10-31 2013-12-26 세메스 주식회사 기판 처리 장치 및 약액 재생 방법
JP6010457B2 (ja) 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
US10510527B2 (en) * 2013-02-01 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Single wafer cleaning tool with H2SO4 recycling
CN105121376B (zh) * 2013-03-15 2018-02-27 东京毅力科创Fsi公司 用于提供加热的蚀刻溶液的处理系统和方法
JP6302708B2 (ja) * 2013-03-29 2018-03-28 芝浦メカトロニクス株式会社 ウェットエッチング装置
JP6022431B2 (ja) * 2013-10-17 2016-11-09 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP2019192863A (ja) 2018-04-27 2019-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2021034561A (ja) 2019-08-23 2021-03-01 キオクシア株式会社 半導体製造装置
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1981375A (zh) * 2004-07-02 2007-06-13 东京毅力科创株式会社 半导体器件的制造方法
CN107112226A (zh) * 2014-12-16 2017-08-29 东京毅力科创株式会社 基板液处理装置

Also Published As

Publication number Publication date
TWI847816B (zh) 2024-07-01
JP2023041453A (ja) 2023-03-24
US12347699B2 (en) 2025-07-01
JP7438171B2 (ja) 2024-02-26
KR20240049263A (ko) 2024-04-16
TWI814577B (zh) 2023-09-01
TW202312325A (zh) 2023-03-16
KR102658584B1 (ko) 2024-04-17
CN115810561A (zh) 2023-03-17
KR20230039532A (ko) 2023-03-21
TW202349545A (zh) 2023-12-16
KR102797838B1 (ko) 2025-04-17
US20230077617A1 (en) 2023-03-16

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