KR102658584B1 - 공급 탱크, 공급 장치, 공급 시스템 - Google Patents

공급 탱크, 공급 장치, 공급 시스템 Download PDF

Info

Publication number
KR102658584B1
KR102658584B1 KR1020220109876A KR20220109876A KR102658584B1 KR 102658584 B1 KR102658584 B1 KR 102658584B1 KR 1020220109876 A KR1020220109876 A KR 1020220109876A KR 20220109876 A KR20220109876 A KR 20220109876A KR 102658584 B1 KR102658584 B1 KR 102658584B1
Authority
KR
South Korea
Prior art keywords
processing liquid
liquid
region
area
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020220109876A
Other languages
English (en)
Korean (ko)
Other versions
KR20230039532A (ko
Inventor
마사아키 후루야
히로아키 고바야시
히데키 모리
Original Assignee
시바우라 메카트로닉스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 메카트로닉스 가부시끼가이샤 filed Critical 시바우라 메카트로닉스 가부시끼가이샤
Publication of KR20230039532A publication Critical patent/KR20230039532A/ko
Priority to KR1020240047209A priority Critical patent/KR102797838B1/ko
Application granted granted Critical
Publication of KR102658584B1 publication Critical patent/KR102658584B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L21/6708—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H01L21/67103—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Weting (AREA)
  • Coating Apparatus (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
  • Feeding And Watering For Cattle Raising And Animal Husbandry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
KR1020220109876A 2021-09-13 2022-08-31 공급 탱크, 공급 장치, 공급 시스템 Active KR102658584B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020240047209A KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-148834 2021-09-13
JP2021148834A JP7438171B2 (ja) 2021-09-13 2021-09-13 供給タンク、供給装置、供給システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020240047209A Division KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Publications (2)

Publication Number Publication Date
KR20230039532A KR20230039532A (ko) 2023-03-21
KR102658584B1 true KR102658584B1 (ko) 2024-04-17

Family

ID=85479813

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020220109876A Active KR102658584B1 (ko) 2021-09-13 2022-08-31 공급 탱크, 공급 장치, 공급 시스템
KR1020240047209A Active KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020240047209A Active KR102797838B1 (ko) 2021-09-13 2024-04-08 공급 탱크, 공급 장치, 공급 시스템

Country Status (5)

Country Link
US (1) US12347699B2 (https=)
JP (1) JP7438171B2 (https=)
KR (2) KR102658584B1 (https=)
CN (1) CN115810561B (https=)
TW (2) TWI814577B (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム
CN117259313B (zh) * 2022-06-14 2026-03-20 天津市环欧新能源技术有限公司 一种储液槽及设有该储液槽的清洗机

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218405A (ja) 2008-03-11 2009-09-24 Dainippon Screen Mfg Co Ltd 処理液供給装置およびそれを備えた基板処理装置
JP2015079884A (ja) 2013-10-17 2015-04-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2019192863A (ja) 2018-04-27 2019-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2021034561A (ja) 2019-08-23 2021-03-01 キオクシア株式会社 半導体製造装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0978263A (ja) * 1995-09-12 1997-03-25 Hitachi Ltd Ｃｒエッチング装置
JP2002110588A (ja) * 2000-09-27 2002-04-12 Nec Kansai Ltd チップ製造装置
JP3761457B2 (ja) 2001-12-04 2006-03-29 Ｎｅｃエレクトロニクス株式会社 半導体基板の薬液処理装置
JP2004228467A (ja) * 2003-01-27 2004-08-12 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
CN1981375A (zh) * 2004-07-02 2007-06-13 东京毅力科创株式会社 半导体器件的制造方法
JP2007258462A (ja) 2006-03-23 2007-10-04 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
TWI439571B (zh) * 2007-01-15 2014-06-01 芝浦機械電子裝置股份有限公司 Sulfuric acid electrolysis device, electrolysis method and substrate processing device
JP5148889B2 (ja) * 2007-02-09 2013-02-20 株式会社東芝 洗浄方法及び電子デバイスの製造方法
CA2634672C (en) * 2008-06-09 2013-03-12 Jerry Hanna Water reaction tank
US20120006790A1 (en) * 2009-03-31 2012-01-12 Kurita Water Industries Ltd. Apparatus and method for treating etching solution
JP5106523B2 (ja) * 2009-12-16 2012-12-26 株式会社東芝 エッチング処理方法、微細構造体の製造方法、およびエッチング処理装置
KR101344915B1 (ko) * 2011-10-31 2013-12-26 세메스 주식회사 기판 처리 장치 및 약액 재생 방법
JP6010457B2 (ja) 2012-12-28 2016-10-19 東京エレクトロン株式会社 液処理装置および薬液回収方法
US10510527B2 (en) * 2013-02-01 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Single wafer cleaning tool with H2SO4 recycling
CN105121376B (zh) * 2013-03-15 2018-02-27 东京毅力科创Fsi公司 用于提供加热的蚀刻溶液的处理系统和方法
JP6302708B2 (ja) * 2013-03-29 2018-03-28 芝浦メカトロニクス株式会社 ウェットエッチング装置
JP6454629B2 (ja) * 2014-12-16 2019-01-16 東京エレクトロン株式会社 基板液処理装置
JP2018056469A (ja) * 2016-09-30 2018-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7438171B2 (ja) * 2021-09-13 2024-02-26 芝浦メカトロニクス株式会社 供給タンク、供給装置、供給システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009218405A (ja) 2008-03-11 2009-09-24 Dainippon Screen Mfg Co Ltd 処理液供給装置およびそれを備えた基板処理装置
JP2015079884A (ja) 2013-10-17 2015-04-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法
JP2019192863A (ja) 2018-04-27 2019-10-31 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP2021034561A (ja) 2019-08-23 2021-03-01 キオクシア株式会社 半導体製造装置

Also Published As

Publication number Publication date
TWI847816B (zh) 2024-07-01
JP2023041453A (ja) 2023-03-24
CN115810561B (zh) 2025-07-08
US12347699B2 (en) 2025-07-01
JP7438171B2 (ja) 2024-02-26
KR20240049263A (ko) 2024-04-16
TWI814577B (zh) 2023-09-01
TW202312325A (zh) 2023-03-16
CN115810561A (zh) 2023-03-17
KR20230039532A (ko) 2023-03-21
TW202349545A (zh) 2023-12-16
KR102797838B1 (ko) 2025-04-17
US20230077617A1 (en) 2023-03-16

Similar Documents

Publication Publication Date Title
KR102797838B1 (ko) 공급 탱크, 공급 장치, 공급 시스템
CN107644824B (zh) 基板液处理装置、基板液处理方法以及存储介质
CN107017160B (zh) 基板液处理装置和基板液处理方法
KR102134949B1 (ko) 처리액 공급 장치, 기판 처리 장치, 및 처리액 공급 방법
CN101546696B (zh) 基板处理装置及基板处理方法
US11373886B2 (en) Substrate processing apparatus and substrate processing method
KR20120033250A (ko) 기판처리장치 및 기판처리방법
CN108987309B (zh) 基片液处理装置、处理液供给方法和存储介质
TWI632634B (zh) 基板液體處理裝置
KR20190045858A (ko) 기판 처리 장치
KR102718065B1 (ko) 공급 장치, 공급 시스템
TWI766921B (zh) 液體處理裝置及液體處理方法
JP2018098452A (ja) 洗浄薬液供給装置、洗浄ユニット、及びプログラムを格納した記憶媒体
KR101987810B1 (ko) 기판 처리 장치
KR102696327B1 (ko) 처리액 공급 장치, 기판 처리 장치 및 처리액 공급 방법
JP2025058751A (ja) 基板処理装置
TW202522649A (zh) 處理液供給裝置、基板處理裝置及處理液供給方法
CN117718276A (zh) 清洗装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

A107 Divisional application of patent
PA0107 Divisional application

St.27 status event code: A-0-1-A10-A18-div-PA0107

St.27 status event code: A-0-1-A10-A16-div-PA0107

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000