CN1157758C - 等离子体蚀刻设备 - Google Patents
等离子体蚀刻设备 Download PDFInfo
- Publication number
- CN1157758C CN1157758C CNB991180909A CN99118090A CN1157758C CN 1157758 C CN1157758 C CN 1157758C CN B991180909 A CNB991180909 A CN B991180909A CN 99118090 A CN99118090 A CN 99118090A CN 1157758 C CN1157758 C CN 1157758C
- Authority
- CN
- China
- Prior art keywords
- cathode electrode
- lcd glass
- female substrate
- plasma
- plasma etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32559—Protection means, e.g. coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR34587/1998 | 1998-08-26 | ||
KR34587/98 | 1998-08-26 | ||
KR1019980034587A KR100275671B1 (ko) | 1998-08-26 | 1998-08-26 | 플라즈마 식각 설비 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1246724A CN1246724A (zh) | 2000-03-08 |
CN1157758C true CN1157758C (zh) | 2004-07-14 |
Family
ID=19548300
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB991180909A Expired - Fee Related CN1157758C (zh) | 1998-08-26 | 1999-08-25 | 等离子体蚀刻设备 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4487026B2 (ko) |
KR (1) | KR100275671B1 (ko) |
CN (1) | CN1157758C (ko) |
TW (1) | TW472320B (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001127041A (ja) * | 1999-10-26 | 2001-05-11 | Matsushita Electric Ind Co Ltd | 基板のプラズマ処理装置およびプラズマ処理方法 |
TW510008B (en) * | 2000-10-23 | 2002-11-11 | Applied Materials Inc | Monitoring substrate processing using reflected radiation |
CN102969361B (zh) * | 2011-09-01 | 2015-09-23 | 中国科学院微电子研究所 | 光照稳定性非晶态金属氧化物tft器件以及显示器件 |
KR101384980B1 (ko) * | 2012-06-25 | 2014-04-14 | 주식회사 테스 | 플라즈마 발생장치 및 이를 포함하는 박막증착장치 |
CN105225989B (zh) * | 2015-10-13 | 2018-12-28 | 京东方科技集团股份有限公司 | 等离子刻蚀机 |
CN108711546B (zh) * | 2018-04-28 | 2019-07-23 | 武汉华星光电技术有限公司 | 下电极及干蚀刻机 |
CN111970838B (zh) * | 2020-08-24 | 2021-09-21 | 泉州市创智工业设计服务有限公司 | 一种用于生产电路板的蚀刻机 |
-
1998
- 1998-08-26 KR KR1019980034587A patent/KR100275671B1/ko not_active IP Right Cessation
-
1999
- 1999-08-19 TW TW088114171A patent/TW472320B/zh not_active IP Right Cessation
- 1999-08-25 CN CNB991180909A patent/CN1157758C/zh not_active Expired - Fee Related
- 1999-08-25 JP JP23852699A patent/JP4487026B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW472320B (en) | 2002-01-11 |
KR100275671B1 (ko) | 2001-02-01 |
KR20000014935A (ko) | 2000-03-15 |
CN1246724A (zh) | 2000-03-08 |
JP2000091328A (ja) | 2000-03-31 |
JP4487026B2 (ja) | 2010-06-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SAMSUNG DISPLAY CO., LTD. Free format text: FORMER OWNER: SAMSUNG ELECTRONICS CO., LTD. Effective date: 20121102 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20121102 Address after: Gyeonggi Do, South Korea Patentee after: Samsung Display Co., Ltd. Address before: Gyeonggi Do, South Korea Patentee before: Samsung Electronics Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040714 Termination date: 20180825 |