CN111970838B - 一种用于生产电路板的蚀刻机 - Google Patents
一种用于生产电路板的蚀刻机 Download PDFInfo
- Publication number
- CN111970838B CN111970838B CN202010856543.9A CN202010856543A CN111970838B CN 111970838 B CN111970838 B CN 111970838B CN 202010856543 A CN202010856543 A CN 202010856543A CN 111970838 B CN111970838 B CN 111970838B
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- Prior art keywords
- cavity
- plate
- pipe
- water
- etching machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005530 etching Methods 0.000 title claims abstract description 37
- 238000001816 cooling Methods 0.000 claims abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 63
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010856543.9A CN111970838B (zh) | 2020-08-24 | 2020-08-24 | 一种用于生产电路板的蚀刻机 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010856543.9A CN111970838B (zh) | 2020-08-24 | 2020-08-24 | 一种用于生产电路板的蚀刻机 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111970838A CN111970838A (zh) | 2020-11-20 |
CN111970838B true CN111970838B (zh) | 2021-09-21 |
Family
ID=73390090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010856543.9A Active CN111970838B (zh) | 2020-08-24 | 2020-08-24 | 一种用于生产电路板的蚀刻机 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111970838B (zh) |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5993881A (ja) * | 1982-11-17 | 1984-05-30 | Hitachi Chem Co Ltd | エツチング装置 |
US4957583A (en) * | 1989-04-28 | 1990-09-18 | Analog Devices, Inc. | Apparatus for etching patterned substrates |
JPH07212048A (ja) * | 1994-01-18 | 1995-08-11 | Mitsubishi Plastics Ind Ltd | 金属多層基板の製造方法 |
CN1246724A (zh) * | 1998-08-26 | 2000-03-08 | 三星电子株式会社 | 等离子体蚀刻设备和用这种设备制造的液晶显示模块 |
CN101162703A (zh) * | 2006-10-12 | 2008-04-16 | 株式会社半导体能源研究所 | 显示装置的制造方法以及蚀刻设备 |
CN203352962U (zh) * | 2013-08-01 | 2013-12-18 | 常熟泓淋电子有限公司 | Pcb用的自动贴背胶机 |
CN105555048A (zh) * | 2016-02-22 | 2016-05-04 | 苏州市亿利华电子有限公司 | 一种pcb板自动蚀刻装置 |
CN107333398A (zh) * | 2017-08-30 | 2017-11-07 | 深圳市博敏兴电子有限公司 | 大尺寸线路板蚀刻方法及设备 |
CN206728386U (zh) * | 2017-05-16 | 2017-12-08 | 大丰市天曌机械科技有限公司 | 一种电子电路板蚀刻用定位装置 |
CN108034946A (zh) * | 2017-11-20 | 2018-05-15 | 西安交通大学 | 喷淋蚀刻系统 |
CN207757086U (zh) * | 2017-12-31 | 2018-08-24 | 东莞市旗和数控科技有限公司 | 一种替代化学腐蚀的激光蚀刻机 |
CN109005644A (zh) * | 2018-07-25 | 2018-12-14 | 广东大上科电子科技有限公司 | 一种电路板自动印制装置 |
CN209982853U (zh) * | 2019-04-30 | 2020-01-21 | 东莞市博永凯电子科技有限公司 | 一种用于显影或蚀刻生产线的水洗组件 |
CN210780454U (zh) * | 2019-11-15 | 2020-06-16 | 乐清市天力电机有限公司 | 一种直流电机定子磁极装配装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8858808B2 (en) * | 2012-04-17 | 2014-10-14 | Kinsus Interconnect Technology Corp. | Method of thin printed circuit board wet process consistency on the same carrier |
-
2020
- 2020-08-24 CN CN202010856543.9A patent/CN111970838B/zh active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5993881A (ja) * | 1982-11-17 | 1984-05-30 | Hitachi Chem Co Ltd | エツチング装置 |
US4957583A (en) * | 1989-04-28 | 1990-09-18 | Analog Devices, Inc. | Apparatus for etching patterned substrates |
JPH07212048A (ja) * | 1994-01-18 | 1995-08-11 | Mitsubishi Plastics Ind Ltd | 金属多層基板の製造方法 |
CN1246724A (zh) * | 1998-08-26 | 2000-03-08 | 三星电子株式会社 | 等离子体蚀刻设备和用这种设备制造的液晶显示模块 |
CN101162703A (zh) * | 2006-10-12 | 2008-04-16 | 株式会社半导体能源研究所 | 显示装置的制造方法以及蚀刻设备 |
CN203352962U (zh) * | 2013-08-01 | 2013-12-18 | 常熟泓淋电子有限公司 | Pcb用的自动贴背胶机 |
CN105555048A (zh) * | 2016-02-22 | 2016-05-04 | 苏州市亿利华电子有限公司 | 一种pcb板自动蚀刻装置 |
CN206728386U (zh) * | 2017-05-16 | 2017-12-08 | 大丰市天曌机械科技有限公司 | 一种电子电路板蚀刻用定位装置 |
CN107333398A (zh) * | 2017-08-30 | 2017-11-07 | 深圳市博敏兴电子有限公司 | 大尺寸线路板蚀刻方法及设备 |
CN108034946A (zh) * | 2017-11-20 | 2018-05-15 | 西安交通大学 | 喷淋蚀刻系统 |
CN207757086U (zh) * | 2017-12-31 | 2018-08-24 | 东莞市旗和数控科技有限公司 | 一种替代化学腐蚀的激光蚀刻机 |
CN109005644A (zh) * | 2018-07-25 | 2018-12-14 | 广东大上科电子科技有限公司 | 一种电路板自动印制装置 |
CN209982853U (zh) * | 2019-04-30 | 2020-01-21 | 东莞市博永凯电子科技有限公司 | 一种用于显影或蚀刻生产线的水洗组件 |
CN210780454U (zh) * | 2019-11-15 | 2020-06-16 | 乐清市天力电机有限公司 | 一种直流电机定子磁极装配装置 |
Also Published As
Publication number | Publication date |
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CN111970838A (zh) | 2020-11-20 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right | ||
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Effective date of registration: 20210903 Address after: 362100 building d11-2b, junhetiandi, No. 626, Jianshe North Street, Luocheng Town, Hui'an County, Quanzhou City, Fujian Province Applicant after: Quanzhou Chuangzhi Industrial Design Service Co.,Ltd. Address before: 362000 504, building 4, Qingyuan Jiangbin Huayuan, Fengze District, Quanzhou City, Fujian Province Applicant before: Fengze Quanyu software design center |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20221221 Address after: 528400 Zone B-2, Second Floor, Zone B, No. 8, East Jinsan Avenue, Sanjiao Town, Zhongshan City, Guangdong Province Patentee after: Guangdong Yibang Electronic Technology Co.,Ltd. Address before: 362100 building d11-2b, junhetiandi, No. 626, Jianshe North Street, Luocheng Town, Hui'an County, Quanzhou City, Fujian Province Patentee before: Quanzhou Chuangzhi Industrial Design Service Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: An etching machine for producing circuit boards Granted publication date: 20210921 Pledgee: Zhongshan Rural Commercial Bank Co.,Ltd. Minmin Branch Pledgor: Guangdong Yibang Electronic Technology Co.,Ltd. Registration number: Y2024980014476 |