CN115552259A - 电子器件检查装置 - Google Patents

电子器件检查装置 Download PDF

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Publication number
CN115552259A
CN115552259A CN202080100563.1A CN202080100563A CN115552259A CN 115552259 A CN115552259 A CN 115552259A CN 202080100563 A CN202080100563 A CN 202080100563A CN 115552259 A CN115552259 A CN 115552259A
Authority
CN
China
Prior art keywords
electronic device
contact
electrode
temperature
inspection apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080100563.1A
Other languages
English (en)
Chinese (zh)
Inventor
糸濑和也
深尾哲宏
小柳元良
见上洋平
武田匡史
山内康宽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN115552259A publication Critical patent/CN115552259A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
CN202080100563.1A 2020-05-13 2020-05-13 电子器件检查装置 Pending CN115552259A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/019103 WO2021229714A1 (ja) 2020-05-13 2020-05-13 電子デバイス検査装置

Publications (1)

Publication Number Publication Date
CN115552259A true CN115552259A (zh) 2022-12-30

Family

ID=78525534

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080100563.1A Pending CN115552259A (zh) 2020-05-13 2020-05-13 电子器件检查装置

Country Status (4)

Country Link
US (1) US12123906B2 (https=)
JP (1) JP7203283B2 (https=)
CN (1) CN115552259A (https=)
WO (1) WO2021229714A1 (https=)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190876A (ja) * 1984-03-09 1985-09-28 Sharp Corp 印刷配線基板の検査装置
JPH0233366U (https=) * 1988-08-29 1990-03-02
JPH07193363A (ja) * 1993-12-27 1995-07-28 Mitsubishi Electric Corp 電子装置及び電子装置の電極リード接続方法
JP2000315555A (ja) * 1999-04-28 2000-11-14 Nec Corp 半導体パッケージ用ソケット
JP2002313855A (ja) * 2001-04-10 2002-10-25 Sekisui Chem Co Ltd 電子回路デバイスの検査装置及び検査方法
US6724203B1 (en) * 1997-10-30 2004-04-20 International Business Machines Corporation Full wafer test configuration using memory metals
JP2004164916A (ja) * 2002-11-11 2004-06-10 Sumitomo Wiring Syst Ltd ワイヤーハーネス配線検査用の検査コネクタ
WO2007132739A1 (ja) * 2006-05-15 2007-11-22 Nidec-Read Corporation 基板検査用治具及びこの治具における接続電極部の電極構造
CN101118995A (zh) * 2006-08-03 2008-02-06 阿尔卑斯电气株式会社 防止因热引起劣化的半导体器件用接触件及其制造方法
US20080057600A1 (en) * 2006-09-04 2008-03-06 Alps Electric Co., Ltd. Mounting circuit and method for producing semiconductor-chip-mounting circuit
TW201411136A (zh) * 2012-08-24 2014-03-16 Clover Technology Co Ltd 異方導電性部件
KR101998297B1 (ko) * 2018-01-03 2019-07-09 최진식 형상기억합금을 이용한 전기 커넥터

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2549936Y2 (ja) * 1990-12-28 1997-10-08 明生電子工業株式会社 電子部品検査器における電子部品装着具
JP2739031B2 (ja) * 1992-12-08 1998-04-08 三菱電機株式会社 半導体装置用ソケット
US5510721A (en) * 1994-12-19 1996-04-23 Ford Motor Company Method and adjustment for known good die testing using resilient conductive straps
JP3012528B2 (ja) * 1996-08-29 2000-02-21 九州日本電気株式会社 プローブカード
JP2002231399A (ja) 2001-02-02 2002-08-16 Fujitsu Ltd 半導体装置試験用コンタクタ及びその製造方法
JP2017204532A (ja) * 2016-05-10 2017-11-16 株式会社リコー プローブカード、ウェハ検査装置および測定方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190876A (ja) * 1984-03-09 1985-09-28 Sharp Corp 印刷配線基板の検査装置
JPH0233366U (https=) * 1988-08-29 1990-03-02
JPH07193363A (ja) * 1993-12-27 1995-07-28 Mitsubishi Electric Corp 電子装置及び電子装置の電極リード接続方法
US6724203B1 (en) * 1997-10-30 2004-04-20 International Business Machines Corporation Full wafer test configuration using memory metals
JP2000315555A (ja) * 1999-04-28 2000-11-14 Nec Corp 半導体パッケージ用ソケット
JP2002313855A (ja) * 2001-04-10 2002-10-25 Sekisui Chem Co Ltd 電子回路デバイスの検査装置及び検査方法
JP2004164916A (ja) * 2002-11-11 2004-06-10 Sumitomo Wiring Syst Ltd ワイヤーハーネス配線検査用の検査コネクタ
WO2007132739A1 (ja) * 2006-05-15 2007-11-22 Nidec-Read Corporation 基板検査用治具及びこの治具における接続電極部の電極構造
CN101118995A (zh) * 2006-08-03 2008-02-06 阿尔卑斯电气株式会社 防止因热引起劣化的半导体器件用接触件及其制造方法
US20080057600A1 (en) * 2006-09-04 2008-03-06 Alps Electric Co., Ltd. Mounting circuit and method for producing semiconductor-chip-mounting circuit
TW201411136A (zh) * 2012-08-24 2014-03-16 Clover Technology Co Ltd 異方導電性部件
KR101998297B1 (ko) * 2018-01-03 2019-07-09 최진식 형상기억합금을 이용한 전기 커넥터

Also Published As

Publication number Publication date
US20230131641A1 (en) 2023-04-27
US12123906B2 (en) 2024-10-22
JP7203283B2 (ja) 2023-01-12
JPWO2021229714A1 (https=) 2021-11-18
WO2021229714A1 (ja) 2021-11-18

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Effective date of abandoning: 20250822