JPWO2021229714A1 - - Google Patents
Info
- Publication number
- JPWO2021229714A1 JPWO2021229714A1 JP2022522165A JP2022522165A JPWO2021229714A1 JP WO2021229714 A1 JPWO2021229714 A1 JP WO2021229714A1 JP 2022522165 A JP2022522165 A JP 2022522165A JP 2022522165 A JP2022522165 A JP 2022522165A JP WO2021229714 A1 JPWO2021229714 A1 JP WO2021229714A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/019103 WO2021229714A1 (ja) | 2020-05-13 | 2020-05-13 | 電子デバイス検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021229714A1 true JPWO2021229714A1 (https=) | 2021-11-18 |
| JP7203283B2 JP7203283B2 (ja) | 2023-01-12 |
Family
ID=78525534
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022522165A Active JP7203283B2 (ja) | 2020-05-13 | 2020-05-13 | 電子デバイス検査装置 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12123906B2 (https=) |
| JP (1) | JP7203283B2 (https=) |
| CN (1) | CN115552259A (https=) |
| WO (1) | WO2021229714A1 (https=) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233366U (https=) * | 1988-08-29 | 1990-03-02 | ||
| JPH0494576U (https=) * | 1990-12-28 | 1992-08-17 | ||
| JPH06231845A (ja) * | 1992-12-08 | 1994-08-19 | Mitsubishi Electric Corp | 半導体装置用ソケット |
| JPH1073616A (ja) * | 1996-08-29 | 1998-03-17 | Nec Kyushu Ltd | プローブカード |
| JPH10510923A (ja) * | 1994-12-19 | 1998-10-20 | フォード モーター カンパニー | 半導体のダイをテストする方法および装置 |
| JP2000315555A (ja) * | 1999-04-28 | 2000-11-14 | Nec Corp | 半導体パッケージ用ソケット |
| JP2002231399A (ja) * | 2001-02-02 | 2002-08-16 | Fujitsu Ltd | 半導体装置試験用コンタクタ及びその製造方法 |
| JP2008039502A (ja) * | 2006-08-03 | 2008-02-21 | Alps Electric Co Ltd | 接触子およびその製造方法 |
| JP2017204532A (ja) * | 2016-05-10 | 2017-11-16 | 株式会社リコー | プローブカード、ウェハ検査装置および測定方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190876A (ja) * | 1984-03-09 | 1985-09-28 | Sharp Corp | 印刷配線基板の検査装置 |
| JPH07193363A (ja) * | 1993-12-27 | 1995-07-28 | Mitsubishi Electric Corp | 電子装置及び電子装置の電極リード接続方法 |
| US6724203B1 (en) * | 1997-10-30 | 2004-04-20 | International Business Machines Corporation | Full wafer test configuration using memory metals |
| JP2002313855A (ja) | 2001-04-10 | 2002-10-25 | Sekisui Chem Co Ltd | 電子回路デバイスの検査装置及び検査方法 |
| JP2004164916A (ja) * | 2002-11-11 | 2004-06-10 | Sumitomo Wiring Syst Ltd | ワイヤーハーネス配線検査用の検査コネクタ |
| JP4041831B2 (ja) * | 2006-05-15 | 2008-02-06 | 日本電産リード株式会社 | 基板検査用治具及びこの治具における接続電極部の電極構造 |
| JP2008060510A (ja) * | 2006-09-04 | 2008-03-13 | Alps Electric Co Ltd | 半導体チップ搭載回路の製造方法および実装回路 |
| JP5156973B1 (ja) * | 2012-08-24 | 2013-03-06 | 株式会社クローバーテクノロジー | 異方導電性部材 |
| KR101998297B1 (ko) * | 2018-01-03 | 2019-07-09 | 최진식 | 형상기억합금을 이용한 전기 커넥터 |
-
2020
- 2020-05-13 JP JP2022522165A patent/JP7203283B2/ja active Active
- 2020-05-13 US US17/907,639 patent/US12123906B2/en active Active
- 2020-05-13 WO PCT/JP2020/019103 patent/WO2021229714A1/ja not_active Ceased
- 2020-05-13 CN CN202080100563.1A patent/CN115552259A/zh active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0233366U (https=) * | 1988-08-29 | 1990-03-02 | ||
| JPH0494576U (https=) * | 1990-12-28 | 1992-08-17 | ||
| JPH06231845A (ja) * | 1992-12-08 | 1994-08-19 | Mitsubishi Electric Corp | 半導体装置用ソケット |
| JPH10510923A (ja) * | 1994-12-19 | 1998-10-20 | フォード モーター カンパニー | 半導体のダイをテストする方法および装置 |
| JPH1073616A (ja) * | 1996-08-29 | 1998-03-17 | Nec Kyushu Ltd | プローブカード |
| JP2000315555A (ja) * | 1999-04-28 | 2000-11-14 | Nec Corp | 半導体パッケージ用ソケット |
| JP2002231399A (ja) * | 2001-02-02 | 2002-08-16 | Fujitsu Ltd | 半導体装置試験用コンタクタ及びその製造方法 |
| JP2008039502A (ja) * | 2006-08-03 | 2008-02-21 | Alps Electric Co Ltd | 接触子およびその製造方法 |
| JP2017204532A (ja) * | 2016-05-10 | 2017-11-16 | 株式会社リコー | プローブカード、ウェハ検査装置および測定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230131641A1 (en) | 2023-04-27 |
| US12123906B2 (en) | 2024-10-22 |
| JP7203283B2 (ja) | 2023-01-12 |
| CN115552259A (zh) | 2022-12-30 |
| WO2021229714A1 (ja) | 2021-11-18 |
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