JPWO2021229714A1 - - Google Patents

Info

Publication number
JPWO2021229714A1
JPWO2021229714A1 JP2022522165A JP2022522165A JPWO2021229714A1 JP WO2021229714 A1 JPWO2021229714 A1 JP WO2021229714A1 JP 2022522165 A JP2022522165 A JP 2022522165A JP 2022522165 A JP2022522165 A JP 2022522165A JP WO2021229714 A1 JPWO2021229714 A1 JP WO2021229714A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022522165A
Other versions
JP7203283B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021229714A1 publication Critical patent/JPWO2021229714A1/ja
Application granted granted Critical
Publication of JP7203283B2 publication Critical patent/JP7203283B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
JP2022522165A 2020-05-13 2020-05-13 電子デバイス検査装置 Active JP7203283B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/019103 WO2021229714A1 (ja) 2020-05-13 2020-05-13 電子デバイス検査装置

Publications (2)

Publication Number Publication Date
JPWO2021229714A1 true JPWO2021229714A1 (ja) 2021-11-18
JP7203283B2 JP7203283B2 (ja) 2023-01-12

Family

ID=78525534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022522165A Active JP7203283B2 (ja) 2020-05-13 2020-05-13 電子デバイス検査装置

Country Status (4)

Country Link
US (1) US20230131641A1 (ja)
JP (1) JP7203283B2 (ja)
CN (1) CN115552259A (ja)
WO (1) WO2021229714A1 (ja)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233366U (ja) * 1988-08-29 1990-03-02
JPH0494576U (ja) * 1990-12-28 1992-08-17
JPH06231845A (ja) * 1992-12-08 1994-08-19 Mitsubishi Electric Corp 半導体装置用ソケット
JPH1073616A (ja) * 1996-08-29 1998-03-17 Nec Kyushu Ltd プローブカード
JPH10510923A (ja) * 1994-12-19 1998-10-20 フォード モーター カンパニー 半導体のダイをテストする方法および装置
JP2000315555A (ja) * 1999-04-28 2000-11-14 Nec Corp 半導体パッケージ用ソケット
JP2002231399A (ja) * 2001-02-02 2002-08-16 Fujitsu Ltd 半導体装置試験用コンタクタ及びその製造方法
JP2008039502A (ja) * 2006-08-03 2008-02-21 Alps Electric Co Ltd 接触子およびその製造方法
JP2017204532A (ja) * 2016-05-10 2017-11-16 株式会社リコー プローブカード、ウェハ検査装置および測定方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6231845B2 (ja) 2013-10-15 2017-11-15 シャープ株式会社 帯電装置およびそれを備えた画像形成装置

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0233366U (ja) * 1988-08-29 1990-03-02
JPH0494576U (ja) * 1990-12-28 1992-08-17
JPH06231845A (ja) * 1992-12-08 1994-08-19 Mitsubishi Electric Corp 半導体装置用ソケット
JPH10510923A (ja) * 1994-12-19 1998-10-20 フォード モーター カンパニー 半導体のダイをテストする方法および装置
JPH1073616A (ja) * 1996-08-29 1998-03-17 Nec Kyushu Ltd プローブカード
JP2000315555A (ja) * 1999-04-28 2000-11-14 Nec Corp 半導体パッケージ用ソケット
JP2002231399A (ja) * 2001-02-02 2002-08-16 Fujitsu Ltd 半導体装置試験用コンタクタ及びその製造方法
JP2008039502A (ja) * 2006-08-03 2008-02-21 Alps Electric Co Ltd 接触子およびその製造方法
JP2017204532A (ja) * 2016-05-10 2017-11-16 株式会社リコー プローブカード、ウェハ検査装置および測定方法

Also Published As

Publication number Publication date
US20230131641A1 (en) 2023-04-27
CN115552259A (zh) 2022-12-30
JP7203283B2 (ja) 2023-01-12
WO2021229714A1 (ja) 2021-11-18

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