JP7203283B2 - 電子デバイス検査装置 - Google Patents

電子デバイス検査装置 Download PDF

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Publication number
JP7203283B2
JP7203283B2 JP2022522165A JP2022522165A JP7203283B2 JP 7203283 B2 JP7203283 B2 JP 7203283B2 JP 2022522165 A JP2022522165 A JP 2022522165A JP 2022522165 A JP2022522165 A JP 2022522165A JP 7203283 B2 JP7203283 B2 JP 7203283B2
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JP
Japan
Prior art keywords
electronic device
temperature
contactor
contact
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022522165A
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English (en)
Japanese (ja)
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JPWO2021229714A1 (https=
Inventor
和也 糸瀬
哲宏 深尾
元良 小柳
洋平 見上
匡史 武田
康寛 山内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2021229714A1 publication Critical patent/JPWO2021229714A1/ja
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Publication of JP7203283B2 publication Critical patent/JP7203283B2/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
JP2022522165A 2020-05-13 2020-05-13 電子デバイス検査装置 Active JP7203283B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/019103 WO2021229714A1 (ja) 2020-05-13 2020-05-13 電子デバイス検査装置

Publications (2)

Publication Number Publication Date
JPWO2021229714A1 JPWO2021229714A1 (https=) 2021-11-18
JP7203283B2 true JP7203283B2 (ja) 2023-01-12

Family

ID=78525534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022522165A Active JP7203283B2 (ja) 2020-05-13 2020-05-13 電子デバイス検査装置

Country Status (4)

Country Link
US (1) US12123906B2 (https=)
JP (1) JP7203283B2 (https=)
CN (1) CN115552259A (https=)
WO (1) WO2021229714A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315555A (ja) 1999-04-28 2000-11-14 Nec Corp 半導体パッケージ用ソケット
JP2002231399A (ja) 2001-02-02 2002-08-16 Fujitsu Ltd 半導体装置試験用コンタクタ及びその製造方法
JP2017204532A (ja) 2016-05-10 2017-11-16 株式会社リコー プローブカード、ウェハ検査装置および測定方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60190876A (ja) * 1984-03-09 1985-09-28 Sharp Corp 印刷配線基板の検査装置
JPH0233366U (https=) * 1988-08-29 1990-03-02
JP2549936Y2 (ja) * 1990-12-28 1997-10-08 明生電子工業株式会社 電子部品検査器における電子部品装着具
JP2739031B2 (ja) * 1992-12-08 1998-04-08 三菱電機株式会社 半導体装置用ソケット
JPH07193363A (ja) * 1993-12-27 1995-07-28 Mitsubishi Electric Corp 電子装置及び電子装置の電極リード接続方法
US5510721A (en) * 1994-12-19 1996-04-23 Ford Motor Company Method and adjustment for known good die testing using resilient conductive straps
JP3012528B2 (ja) * 1996-08-29 2000-02-21 九州日本電気株式会社 プローブカード
US6724203B1 (en) * 1997-10-30 2004-04-20 International Business Machines Corporation Full wafer test configuration using memory metals
JP2002313855A (ja) 2001-04-10 2002-10-25 Sekisui Chem Co Ltd 電子回路デバイスの検査装置及び検査方法
JP2004164916A (ja) * 2002-11-11 2004-06-10 Sumitomo Wiring Syst Ltd ワイヤーハーネス配線検査用の検査コネクタ
JP4041831B2 (ja) * 2006-05-15 2008-02-06 日本電産リード株式会社 基板検査用治具及びこの治具における接続電極部の電極構造
JP2008039502A (ja) 2006-08-03 2008-02-21 Alps Electric Co Ltd 接触子およびその製造方法
JP2008060510A (ja) * 2006-09-04 2008-03-13 Alps Electric Co Ltd 半導体チップ搭載回路の製造方法および実装回路
JP5156973B1 (ja) * 2012-08-24 2013-03-06 株式会社クローバーテクノロジー 異方導電性部材
KR101998297B1 (ko) * 2018-01-03 2019-07-09 최진식 형상기억합금을 이용한 전기 커넥터

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000315555A (ja) 1999-04-28 2000-11-14 Nec Corp 半導体パッケージ用ソケット
JP2002231399A (ja) 2001-02-02 2002-08-16 Fujitsu Ltd 半導体装置試験用コンタクタ及びその製造方法
JP2017204532A (ja) 2016-05-10 2017-11-16 株式会社リコー プローブカード、ウェハ検査装置および測定方法

Also Published As

Publication number Publication date
US20230131641A1 (en) 2023-04-27
US12123906B2 (en) 2024-10-22
CN115552259A (zh) 2022-12-30
JPWO2021229714A1 (https=) 2021-11-18
WO2021229714A1 (ja) 2021-11-18

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