CN115428160A - 显示基板、其制作方法及显示装置 - Google Patents

显示基板、其制作方法及显示装置 Download PDF

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CN115428160A
CN115428160A CN202180000491.8A CN202180000491A CN115428160A CN 115428160 A CN115428160 A CN 115428160A CN 202180000491 A CN202180000491 A CN 202180000491A CN 115428160 A CN115428160 A CN 115428160A
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layer
isolation
display
substrate
region
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CN202180000491.8A
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CN115428160B (zh
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李大利
张则瑞
胡勇
王子峰
朴叙俊
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/60—OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
    • H10K59/65—OLEDs integrated with inorganic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates

Abstract

本公开提供的显示基板、其制作方法及显示装置，包括：衬底基板，具有开孔区、位于开孔区周围的显示区、以及位于显示区与开孔区之间的隔离区；其中，开孔区被配置为安装取光模组；至少一圈阻挡墙，在隔离区内环绕开孔区设置；封装层，位于阻挡墙所在层背离衬底基板的一侧，且封装层在衬底基板上的正投影完全覆盖显示区；第一保护层，位于封装层背离衬底基板的一侧，且第一保护层至少完全覆盖至少一圈阻挡墙；填充层，位于第一保护层背离衬底基板的一侧，且填充层位于隔离区，填充层完全覆盖至少一圈阻挡墙且与封装层至少部分重叠。

Description

PCT国内申请，说明书已公开。

Claims (40)

  1. PCT国内申请，权利要求书已公开。
CN202180000491.8A 2021-03-15 2021-03-15 显示基板、其制作方法及显示装置 Active CN115428160B (zh)

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PCT/CN2021/080752 WO2022193058A1 (zh) 2021-03-15 2021-03-15 显示基板、其制作方法及显示装置

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US20190181373A1 (en) * 2017-12-13 2019-06-13 Lg Display Co., Ltd. Display Apparatus
CN110265583A (zh) * 2019-07-26 2019-09-20 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN110854304A (zh) * 2019-11-20 2020-02-28 云谷（固安）科技有限公司 显示面板的制备方法
CN111384069A (zh) * 2020-03-25 2020-07-07 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板
CN111463236A (zh) * 2019-01-21 2020-07-28 三星显示有限公司 显示设备
CN111725257A (zh) * 2019-03-21 2020-09-29 三星显示有限公司 显示面板
US20200411629A1 (en) * 2019-06-25 2020-12-31 Lg Display Co., Ltd. Electroluminescent display device
CN112349867A (zh) * 2020-10-27 2021-02-09 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置

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CN201516729U (zh) * 2009-09-12 2010-06-30 孙荣华 用弹性胶体件固定的墨盒
KR102601207B1 (ko) * 2016-07-29 2023-11-13 삼성디스플레이 주식회사 표시장치
KR102431808B1 (ko) * 2017-12-11 2022-08-10 엘지디스플레이 주식회사 터치 스크린 일체형 표시장치
CN210516729U (zh) * 2019-10-31 2020-05-12 云谷（固安）科技有限公司 显示面板及显示装置
CN111162195B (zh) * 2020-01-02 2022-10-04 合肥维信诺科技有限公司 显示面板和显示装置
CN111244112B (zh) * 2020-01-20 2022-11-01 京东方科技集团股份有限公司 显示面板、显示装置和显示面板的制作方法
CN111525044A (zh) * 2020-04-27 2020-08-11 京东方科技集团股份有限公司 一种显示面板、显示装置和显示装置的制作方法
CN111740028B (zh) * 2020-06-29 2024-01-02 京东方科技集团股份有限公司 显示面板及其制作方法
CN112271199B (zh) * 2020-10-23 2024-02-27 京东方科技集团股份有限公司 显示装置及其显示面板、显示面板的制作方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190181373A1 (en) * 2017-12-13 2019-06-13 Lg Display Co., Ltd. Display Apparatus
CN111463236A (zh) * 2019-01-21 2020-07-28 三星显示有限公司 显示设备
CN111725257A (zh) * 2019-03-21 2020-09-29 三星显示有限公司 显示面板
US20200411629A1 (en) * 2019-06-25 2020-12-31 Lg Display Co., Ltd. Electroluminescent display device
CN110265583A (zh) * 2019-07-26 2019-09-20 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置
CN110854304A (zh) * 2019-11-20 2020-02-28 云谷（固安）科技有限公司 显示面板的制备方法
CN111384069A (zh) * 2020-03-25 2020-07-07 京东方科技集团股份有限公司 显示基板及其制备方法、显示面板
CN112349867A (zh) * 2020-10-27 2021-02-09 京东方科技集团股份有限公司 一种显示面板及其制备方法、显示装置

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CN115349183A (zh) 2022-11-15
GB2610500A (en) 2023-03-08
GB202216389D0 (en) 2022-12-21
WO2022193332A1 (zh) 2022-09-22
WO2022193058A1 (zh) 2022-09-22
CN115428160B (zh) 2024-04-05

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