CN115223912A - 通过空气顶出从胶带分离芯片 - Google Patents

通过空气顶出从胶带分离芯片 Download PDF

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CN115223912A
CN115223912A CN202210314453.6A CN202210314453A CN115223912A CN 115223912 A CN115223912 A CN 115223912A CN 202210314453 A CN202210314453 A CN 202210314453A CN 115223912 A CN115223912 A CN 115223912A
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chip
tape
ejector
collet
peeling
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万艺达
张耀明
齐军
李智勇
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ASMPT Singapore Pte Ltd
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ASM Technology Singapore Pte Ltd
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Abstract

当从胶带拾取芯片时，拾取臂的夹头定位在芯片上方一定距离处，芯片安装在胶带的第一表面上。接下来，在胶带的与第一表面相对的第二表面上产生气流吹动胶带，以将芯片移向夹头的芯片保持表面。此后，在胶带从芯片分离时，芯片保留在夹头的芯片保持表面上。

Description

通过空气顶出从胶带分离芯片
技术领域
本发明涉及一种从胶带拾取芯片的方法和一种用于执行该方法的设 备。
背景技术
在制造过程中，电子产品的制造对质量和可靠性的要求高。特别是， 工艺精度和一致性对于半导体组装和封装设备而言非常重要。一种制造工 艺涉及从胶带上分离芯片，胶带通常用于固定多个贴附在粘合剂上的芯片。 所谓的无针式顶出器工具通常具有顶出帽，以能够通过位于顶出帽的顶部 表面上的孔产生吸力。附着在切割胶带上的单个薄芯片利用吸力保持在顶 出帽上，并且拾取臂上的夹头将芯片保持在适当的位置。无针式顶出工具 包括多个活动板，这些活动板在芯片下方形成支撑表面。这些板通常由布 置在中心板两侧的多对活动板形成。这些板可移动到不同的高度，能够帮 助将芯片从胶带分层。分层发生时，夹头将芯片保持在适当的位置。但是 在芯片从胶带分离时，可能会出现一些问题，比如对芯片造成意外损坏。
相比于现有技术，提供一种用于从胶带拾取芯片的改进方法将会是有 益的。
发明内容
可见，本发明的目的是寻求提供一种克服现有技术中至少一些问题的 方法和设备。
根据本发明的第一方面，提供了一种从胶带拾取芯片的方法，该方法 包括：将拾取臂的夹头定位在芯片上方一定距离处，芯片安装在胶带的第 一表面上；在胶带的与第一表面相对的第二表面上产生气流吹动胶带，以 将芯片移向夹头的芯片保持表面；以及当胶带从芯片分离时，将芯片保留 在夹头的芯片保持表面上。
第一方面认识到现有布置的问题是，在分层工艺期间，拾取臂的夹头 与顶出帽或其它支撑件上的芯片之间的接触会对芯片造成损坏。因此提供 了一种可用于从胶带上分层并拾取芯片的方法。该方法可包括将拾取臂的 夹头或接收表面定位或设置在芯片上方或远离芯片一定距离处。芯片可以 安装、粘附或贴附在胶带的第一表面上。该方法可以包括在胶带的第二表 面上产生或引起气流。胶带的第二表面可以与第一表面相对或相反。产生 气流可用于吹动胶带，以将芯片移向夹头的保持表面。该方法可以包括在 胶带与芯片分离时将芯片保留或保持在夹头的保持表面上。这样，夹头可 以远离芯片定位，但可以将芯片推动到夹头的保持表面上，以将胶带从芯 片分离或分层。这显著降低了芯片上的力，并有助于防止损坏。
可以通过具有胶带保持吸附表面的顶出帽将胶带的第二表面保留或保 持在适当的位置。吹动可包括从顶出帽产生气流，以吹动或推动胶带离开 保留位置而朝向夹头的保持表面。因此，顶出帽可用于将胶带移向夹头。
将胶带从芯片分离可以进一步包括使通过胶带保持吸附表面的气流反 向而从所述顶出帽产生吸力。这使得将力施加在胶带上，以将胶带从由夹 头的芯片保持表面保持的芯片分层。
定位可以包括将拾取臂定位在芯片上方相对固定的位置处，以使拾取 臂的夹头和芯片之间维持空间间隙。这再次防止了施加到芯片上的力以其 他方式在夹头和顶出帽之间挤压芯片，可能对芯片造成损坏。
该方法可以包括在将夹头定位在芯片上方之前，通过提升芯片和胶带 进行预剥离，以施加剥离力来促进或启动芯片与胶带之间的分层(尤其是 胶带从芯片外边缘的分层)。这允许拾取臂在预剥离发生时用于其他操作。
预剥离可以包括在将胶带保留在顶出帽上的保留位置的同时反复升降 芯片，以使胶带从芯片的外边缘分层。
预剥离还可以包括通过胶带保持吸附表面交替施加吹力和吸力而反复 升降胶带，以使胶带从芯片的外边缘分层。因此，在将芯片的其余部分保 持在适当位置的同时，可以将胶带的边缘剥离，以促进分层。
芯片可以利用内置在顶出帽中的顶出板可释放地被支撑，并且顶出板 可相对于胶带保持吸附表面移动，用于将芯片升离胶带保持吸附表面。
预剥离可以包括利用顶出板提升芯片，或者进一步地，在将胶带保留 在顶出帽上的保留位置的同时，可以利用顶出板反复升降芯片，以使胶带 从芯片的外边缘分层。在利用顶出板反复升降芯片的同时，可以将超出芯 片外边缘的胶带保持在保留位置，以使胶带从芯片的外边缘分层。因此， 在芯片移动时，超出芯片外边缘的胶带可以保持在适当位置，以促进分层。
芯片的升降可以包括相对于或关于顶出帽交替地升降顶出板。通常， 这种升降将是朝向并远离夹头所在的位置。
预剥离可包括在将顶出板偏压在胶带上的同时，通过胶带保持吸附表 面交替产生吹力和吸力来提升芯片。
预剥离可包括在顶出板偏压在胶带上的同时反复升降超出芯片的外边 缘的胶带，从而使得胶带从芯片的外边缘分层。
顶出板可以包括与芯片的外边缘相邻的最外面的顶出板，及与芯片的 中心相邻的至少一个最里面的顶出板，并且该方法可以包括在预剥离之后， 通过依次降低最外面升高的顶出板进行剥离，在胶带和芯片之间施加剥离 力，以使胶带从芯片的外边缘逐渐向芯片的中心分层。
剥离可以包括依次降低除了该至少一个最里面的顶出板之外的所有最 外面的顶出板，以使胶带从芯片的外边缘逐渐向该至少一个最里面的顶出 板分层。
该方法可以包括在预剥离期间对芯片进行成像，以检测胶带从芯片分 层的程度。芯片上方不存在拾取臂会有助于这种成像。
成像可通过在施加剥离力之后或由于施加了剥离力导致的芯片的图像 弯曲程度来检测分层程度。成像可通过检测由于施加了预剥离力导致的芯 片的主要表面图像的一致性来检测分层程度。
成像可以通过检测在施加了预剥离力之后背离顶出帽的芯片的主表面 的图像的不一致性来检测出不成功的分层。
成像可以利用成像装置捕捉在施加预剥离力之后或者由于施加了预剥 离力导致的芯片的侧视图来检测出分层程度。
成像装置可以通过检测由于施加了预剥离力导致的芯片在侧视图中是 弯曲的来检测出不成功的分层。
该方法可以包括重复预剥离，直到从芯片的成像中检测到成功的分层。
该方法可以包括延迟降低下一个最外面升高的顶出板，直到在前一个 最外面升高的顶出板降低之后检测到成功的分层。
该方法可以包括在夹头没有定位在芯片上方的情况下进行预剥离。
该方法可以包括在预剥离和/或剥离期间将拾取臂用于有关另一个芯片 的键合和拾取操作中的至少一项。
根据本发明的第二个方面，提供了一种从胶带拾取芯片的装置，包括： 拾取臂的夹头，具有配置成定位在芯片上方一定距离处的芯片保持表面， 芯片安装在胶带的第一表面上；以及气流发生器，配置成在胶带的与第一 表面相对的第二表面上产生气流吹动胶带，以将芯片移向夹头的芯片保持 表面，从而在胶带从芯片分离时，将芯片保留在夹头的芯片保持表面上。
根据本发明的第三个方面，提供了一种配置成执行根据本发明的第一 方面所述的方法的设备。
结合说明书部分、所附权利要求书以及附图，将更好地理解以上这些 以及其它的特征、方面和优势。
附图说明
下面结合附图，对本发明的实施例进行描述，仅以示例的方式进行说 明，其中：
图1示出了根据一种实施例的拾取设备的主要部件；
图2A是示出顶出帽的顶出板的布局的平面图；
图2B是示出顶出帽的顶出板的替代布局的平面图；
图3A-图3E示出了拾取设备的运行；
图4A示出了利用光学传感器检测不成功的剥离；
图4B示出了利用光学传感器检测成功的剥离；
图5示出了根据一种实施例的剥离增强；
图6示出了根据另一种实施例的剥离增强；
图7A示出了利用光学传感器检测剥离；
图7B示出了不成功的剥离；
图7C示出了成功的剥离；以及
图8示出了拾取设备执行的示例性流程。
在附图中，相同的部件用相同的附图标记表示。
具体实施方式
在对实施例进行任何更详细的讨论之前，首先提供如下概述。一些实 施例提供了一种利用气流将胶带上的芯片推动至拾取臂上然后再将芯片与 胶带分层的布置。预剥离工艺通常在不存在拾取臂的情况下，在芯片被传 送到拾取臂上之前发生，胶带在拾取臂中开始从芯片的边缘分层。可以通 过令芯片相对于胶带往复运动来促进该预剥离工艺。可以在预剥离过程中 利用光学传感器检测到成功的分层，由于不存在拾取臂，光学传感器可以畅通无阻地看到芯片。这种途径比现有技术中利用拾取臂的真空泄漏检测 更可靠，这是因为拾取臂上的真空孔可能未与芯片的边缘对准。剥离工艺 通常在不存在拾取臂的情况下在芯片被传送到拾取臂上之前发生，胶带在 拾取臂中从芯片的边缘向其中心进一步分层。该剥离工艺通常涉及相对于 胶带的分层部分移动芯片。可以在预剥离过程中利用光学传感器检测到成 功的分层，其中由于持续地不存在拾取臂，光学传感器可以畅通无阻地看到芯片。由于在预剥离和剥离过程中不需要存在拾取臂，因此可以将其布 置在其它地方，从而提高拾取设备的吞吐量。
拾取装置
图1示出了根据一种实施例的拾取设备10的主要部件。拾取设备10 包括拾取臂30的夹头20，布置成相对于顶出帽40沿X、Y和Z轴移动。 拾取臂30设有力检测器50，用于检测沿Z轴作用于夹头20上的力(通常 由于其吸附面70与芯片110接触)。夹头20设有多个抽吸孔60，用于抽吸 空气以将芯片保留在吸附面70上。
顶出帽40包括多个顶出板80。顶出板80位于顶出帽40的开口内。顶 出板80可沿Z轴移动。通常，多个顶出板可同时成对移动，从最外面的一 对L1、R1开始，接着是下一最外面的一对L2、R2，依此类推，直到至少 一个最里面的板或中心板C发生位移，这一点将在下文进行更详细地解释。 气流装置(未示出)运行，以在顶出帽40的增压室90内产生正气压或负 气压，这一点将在下文进行更详细地解释。承载多个半导体芯片110的胶 带100被接收在顶出帽40的接收表面上方。通常，每个半导体芯片110的 厚度不超过50微米，致使芯片110易碎且非常容易受到损坏。
顶出板
图1示出了顶出板80的侧视图，同时，图2A示出了顶出板80的布局 的俯视图。图2B示出了顶出板80’的替代实施例，其中，中心板C’由阶 段2板同心地包围，而阶段2板又被阶段1板同心地包围。在该布置中， 首先降低阶段1板，然后降低阶段2板，然后参考图2A的描述以类似的方 式降低中心板。
图3A至图3E示出了根据一种实施例的拾取设备的运行示意图。拾取 设备执行的流程参考图8的进一步的描述。
对准
在开始拾取流程之前，顶出板80全部在备用水平A处对准，该备用水 平A通常与顶出帽40的顶部胶带保持表面齐平。这确保了顶出板80不会 从顶出帽40的表面突出。在步骤S10，利用俯视对准光学传感器120(见 图4A)，将待拾取的芯片110定位并设置在芯片110的中心与顶出帽40的 中心对准的位置处。芯片110的角方向也与顶出帽40的角方向对准。可以 理解为，为了确保芯片110可靠地从胶带100剥离，在顶出帽中的顶出板 80的外边界与芯片110的四个边缘之间需要有适当的悬臂长度。换言之， 芯片110延伸超出由顶出板80提供的支撑板。
预剥离
一旦已经实现对准，在步骤S20，向增压室90施加真空吸力，并且在 步骤S30，将顶出板80通过提升高度H到预剥离水平B。增压室90中的 真空通过顶出帽40的顶表面上的孔和槽提供真空抽吸，以将胶带100拉动 并压在顶出帽40的顶表面和顶出板80上。应当理解的是，步骤S20和S30 可以颠倒或同时执行。
在给定的顶出板高度H处，胶带100上的芯片110将由突出的顶出板 80向上推离顶出帽40的顶表面。由于芯片110的边缘和顶出板80的外边 界之间有悬臂或悬空，因此在顶出帽40的真空抽吸下，芯片110和胶带100 被一起拉下。如果芯片110保持附接至胶带100而其边缘周围没有分层， 则由于胶带100上的真空抽吸，芯片110将沿其边缘弯曲。沿着芯片边缘 的弯曲将在芯片110和围绕其边缘的胶带100之间产生剥离强度。如果沿 芯片边缘的剥离强度大到足以克服芯片110和胶带100之间的粘附力，芯 片110将会从芯片110边缘周围的区域开始从胶带100分层。因此，芯片 110的边缘将会打开，芯片110和胶带100之间的分层将在芯片边缘开始并 向内传播，直到在下一最外面升高的顶出板(在本实施例中，L1、R1)限 定的边界停止。
在步骤S40，如果芯片110周围的所有边缘都被打开(意味着胶带100 已经开始沿着所有这些边缘从芯片110剥离)，则将认为预剥离工艺是成功 的。可能需要适当的延迟，从而通过留出分层发生的时间来确保成功的预 剥离。如图3A所示，可以看出，在预剥离工艺期间以及在随后的分层工艺 期间，不需要将拾取臂20定位在被拾取芯片110的上方。
鉴于预剥离和随后的分层工艺都不需要拾取臂30的存在，这意味着芯 片110上方的光路没有被阻挡。这使得光学传感器120能够用于对芯片110 进行成像，以在步骤S40检查预剥离工艺是否已经成功。可以从图4A看出， 当预剥离工艺不成功时，芯片110的至少一些边缘弯曲，这可以被光学传 感器120检测到。通过对芯片110成像并将其与相邻芯片的图像进行比较 和/或通过检测芯片图像的一致性或预剥离前后芯片图像的相关性，可以很容易用光学传感器120检测到是否存在弯曲。这些图像之间的差异能够表 明芯片110存在弯曲。如果预剥离工艺没有被确定为是成功的，如图4A所 示，则可以执行如图5和图6所示的预剥离增强工艺。如果预剥离工艺被 确定为是成功的，如图4B所示，则可以省略预剥离增强工艺。
预剥离增强
在步骤S50，如果预剥离工艺没有被确定为是成功的，则执行预剥离增 强。在高塑性应变下的重复循环负载下，可以实现粘合接头的蠕变破坏。 由于循环剪切应变对粘合剂的累积效应，粘合剂接头失效可能在相对少量 的周期内发生，并且这种效应在低频循环负载下更为显著。
如图5所示，一种途径是，增压室90中的气流产生真空吸力将胶带100 拉向顶出帽40的顶表面或上表面。在施加真空吸力的情况下，顶出板80 在备用水平A和升高的预剥离水平B之间以距离H反复升降，以在胶带100 的粘合剂上提供高应变循环负载。距离H通常约为几百微米，并且这种升 降的频率可以在约1Hz到100Hz的范围内。取决于振动幅度(通常约为300 微米)和芯片110伸出顶出板80的悬空长度(通常约为300微米)，持续 约5至10个之间的往复循环的振动操作应足以减少粘合剂的粘合力，使预 剥离工艺获得成功。
一种替代途径是，如图6所示，反复打开和关闭增压室90内的真空吸 力，以在胶带100的粘合剂上提供高应变循环负载。再次，将板从其备用 水平A升高高度H到升高的预剥离水平B，并且板保持在这个升高的位置 B处。以高速反复打开和关闭增压室90内的真空抽吸。通常，增压室90 应该尽可能小以便于快速切换。从真空到大气压的吸入流之间的切换速率 可能在10到50Hz左右。当施加真空抽吸时，增压室90中的真空度通常在 -70至-100kPa左右。当释放增压室90中的真空抽吸时，增压室90中的真 空度在约0到-10kPa之间。此外，取决于顶出板80的高度H(通常约为300 微米)和芯片110的悬空长度(也约为300微米)，约5到10个之间的真 空开关循环操作应足以降低粘合剂的粘合力，使预剥离工艺获得成功，如 图6(a)所示。
图7A-图7C示出了确定预剥离是否成功的另一项技术。在此布置中， 利用侧面成像光学传感器130确定芯片110是弯曲的(如图7B所示(因此 还没有完全预剥离))还是大致平坦的(如图7C所示)，由此确定哪一个的 预剥离已经成功。
预剥离工艺的成功启动很重要。如果预剥离工艺没有做好并且芯片边 缘无法从胶带100剥离(即芯片边缘没有打开)，那么后续的分层工艺就难 以成功。顶出板的下降速率不应快于胶带100的界面分层传播速度，以保 证后续的分层沿芯片110和胶带100之间的界面传播，使胶带100在下一 对板降低之前从芯片110的悬空部分完全分离。界面分层工艺的继续是由 外侧成对的板以及随后的内侧成对的板和/或中心板的依次下降驱动。
剥离
一旦确定预剥离已经成功，则如图3B所示，在步骤S60开始进行剥离， 其中最外面的顶出板L1、R1以预定速度向下移动到位于顶出帽40的表面 下的下方位置E。因此，随着顶出板80的边界向内移动至下一对外侧板L2、 R2，芯片110的有效悬臂长度增加顶出板L1、R1的宽度。这使得芯片110 和胶带100之间的分层传播逐渐深入到芯片110的内部，如图3B所示。借 助于延伸的悬臂长度，芯片边缘周围的悬空增大。在步骤S65，通过将升高 的顶出板(在这种情况下为L2、R2、C)提升到升高的位置B之上的一定 高度，可以增强所引起的剥离强度。
如果该增大的部分没有完全发生分层，则由于顶出帽40对胶带100的 真空吸力而引起的胶带100的拖拽力，可将芯片110边缘周围的区域弯曲 并拉下。可选地，光学传感器120、130将会确定芯片110是否以与上述类 似的方式绕其边缘弯曲。如果确定芯片110弯曲，意味着分层没有完全发 生，则给予额外的延迟让分层完成。
一旦分层已经发生，则在步骤S70，如图3C所示，下一最外面的一对 板L2、R2将会向下移动到下方位置E。而且，每次降低板时，利用光学传 感器120、130就是否发生了成功的分层进行评估。板将会以编程的速度向 下移动。如果在步骤S80检测到对于任何板都没有发生成功的分层，则如 上所述发生延迟，并且可以利用步骤S90中以类似于图5和图6所描述的 剥离增强方式进行加强，以帮助剥离。
芯片移除
在步骤S95中，一旦评估得出芯片剥离已经完成并且芯片仅由中心板C 支撑，如图3C所示，拾取臂30的夹头20就定位在芯片110上方并向下移 动到芯片110上方的目标水平，为夹头20的下表面和芯片110的上表面之 间留下气隙D。气隙D的高度在约10微米和100微米之间。此时，由于夹 头20不会落在芯片110上，所以夹头20不会对芯片110产生不需要的压 缩力。
在夹头20到达芯片上方的正确高度之后，接着在步骤S100，令增压室 90内的气流反向，以向顶出帽100在胶带100下方的区域提供吹气。由于 胶带100鼓起，胶带100与芯片110一起被提起，从而关闭芯片110和夹 头20之间的气隙D。夹头20将会接收芯片110并通过孔60的真空抽吸将 其保持在适当位置，如图3D所示。在步骤S110，通过增加孔60内的真空来检测芯片110是否抵靠夹头20。这使得步骤S120的吹气关闭。
一旦夹头20接收到芯片110，在步骤S130，令增压室90内的气流反 向，使得向增压室90内施加真空抽吸，从而将胶带100从芯片110拉到顶 出帽40的表面上，如图3E所示。现在，夹头20保持从胶带100完全分离 的芯片110。在步骤S140，最终板C接着在顶出帽40内降低，为下一拾取 循环做准备。现在，芯片110的顶出顺序完成，并且拾取臂30可以移动从 而将芯片110放置在需要的位置(步骤S150)。
因此，可以看出，本文描述的本发明的实施例通过添加光学检查反馈 系统检测不成功的分层并实施补救措施来提高芯片拾取成功率。在芯片分 离过程中去除对在芯片110顶部存在拾取臂30的需要允许利用光学装置检 测被拾取的芯片110正上方的不完全分层。通过在胶带100上增加循环剪 切负载以降低芯片110和胶带100之间的界面粘合力，增加了预剥离工艺 成功的可能性。同时，由于在芯片分离过程中不需要拾取臂30保留在芯片 110的位置处，拾取臂30可以进行其它并行操作，从而增加了拾取设备10 的吞吐量。通过采用新的芯片接收工艺，也减小了拾取臂30作用在芯片110 上的压缩力，该新的芯片接收工艺是从胶带100下方吹气以在胶带100中 形成鼓起。
尽管本发明已经对于相关的一些实施例做了相当详细地描述，但可能 还有其它未尽描述的实施例，因此，所附权利要求的精神和范围不限于本 文所包含的实施例的描述。

Claims (20)

1.一种从胶带拾取芯片的方法，所述方法包括：
将拾取臂的夹头定位在所述芯片上方一定距离处，所述芯片安装在所述胶带的第一表面上；
在所述胶带的与所述第一表面相对的第二表面上产生气流吹动所述胶带，以将所述芯片移向所述夹头的芯片保持表面；及
当所述胶带从所述芯片分离时，将所述芯片保留在所述夹头的所述芯片保持表面上。
2.根据权利要求1所述的方法，其中借助具有胶带保持吸附表面的顶出帽，将所述胶带的所述第二表面保留在保留位置，并且所述吹动包括从所述顶出帽产生所述气流，以推动所述胶带离开所述保留位置而朝向所述夹头的所述芯片保持表面。
3.根据权利要求2所述的方法，其中所述胶带从所述芯片分离进一步包括使通过所述胶带保持吸附表面的气流反向而从所述顶出帽产生吸力。
4.根据权利要求1所述的方法，其中所述定位包括将所述拾取臂定位在所述芯片上方相对固定的位置，以使所述拾取臂的所述夹头和所述芯片之间维持空间间隙。
5.根据权利要求2所述的方法，进一步包括在将所述夹头定位在所述芯片上之前，通过提升所述芯片和所述胶带进行预剥离以施加剥离力来启动所述胶带从所述芯片的外边缘分层。
6.根据权利要求5所述的方法，其中所述预剥离进一步包括在将所述胶带保留在所述顶出帽上的所述保留位置的同时反复升降所述芯片，以使所述胶带从所述芯片的外边缘分层。
7.根据权利要求5所述的方法，其中所述预剥离进一步包括通过所述胶带保持吸附表面交替施加吹力和吸力而反复升降所述胶带，以使所述胶带从所述芯片的外边缘分层。
8.根据权利要求2所述的方法，其中所述芯片由内置在所述顶出帽中的顶出板可释放地支撑，所述顶出板可相对于所述胶带保持吸附表面移动，用于将所述芯片提离所述胶带保持吸附表面。
9.根据权利要求8所述的方法，进一步包括在将所述夹头定位在所述芯片上之前，利用所述顶出板提升所述芯片进行预剥离以启动所述胶带从所述芯片的外边缘分层。
10.根据权利要求9所述的方法，其中通过相对于所述顶出帽的所述胶带保持吸附面交替升降所述顶出板，所述芯片由所述顶出板反复升降。
11.根据权利要求9所述的方法，其中所述预剥离包括在所述顶出板偏压在所述胶带上的同时通过所述胶带保持吸附表面交替产生吹力和吸力来提升所述芯片。
12.根据权利要求9所述的方法，其中所述顶出板包括与所述芯片的外边缘相邻的最外面的顶出板，及与所述芯片的中心相邻的至少一个最里面的顶出板，所述方法进一步包括在预剥离之后，通过依次降低所述最外面升高的顶出板以在所述胶带和所述芯片之间施加剥离力来进行剥离，以使所述胶带从所述芯片的外边缘逐渐朝所述芯片的中心分层。
13.根据权利要求12所述的方法，其中所述剥离包括依次降低除所述最里面的顶出板之外的所有最外面的顶出板，以使所述胶带从所述芯片的外边缘逐渐朝所述至少一个最里面的顶出板分层。
14.根据权利要求5所述的方法，包括在预剥离期间或之后对所述芯片进行成像，以检测所述胶带从所述芯片上分层的程度。
15.根据权利要求14所述的方法，其中在施加所述剥离力之后，所述成像通过所述芯片的成像弯曲程度来检测分层程度。
16.根据权利要求14所述的方法，其中在施加所述预剥离力之后，所述成像利用成像装置捕捉所述芯片的侧视图来检测分层程度。
17.根据权利要求14所述的方法，包括重复所述预剥离步骤，直到从所述芯片的所述成像中检测到成功的分层。
18.根据权利要求5所述的方法，包括在所述夹头没有定位在所述芯片上方的情况下进行所述预剥离。
19.一种从胶带拾取芯片的设备，包括：
拾取臂的夹头，具有配置成定位在所述芯片上方一定距离处的芯片保持表面，所述芯片安装在所述胶带的第一表面上；及
气流发生器，配置成在所述胶带的与所述第一表面相对的第二表面上产生空气流，以吹动所述胶带将所述芯片移向所述夹头的所述芯片保持表面，从而在所述胶带从所述芯片分离时将所述芯片保留在所述夹头的所述芯片保持表面上。
20.一种配置成执行根据权利要求1所述的方法的设备。
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