CN115223905A - 基板搬送装置和基板搬送方法 - Google Patents
基板搬送装置和基板搬送方法 Download PDFInfo
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- CN115223905A CN115223905A CN202210376413.4A CN202210376413A CN115223905A CN 115223905 A CN115223905 A CN 115223905A CN 202210376413 A CN202210376413 A CN 202210376413A CN 115223905 A CN115223905 A CN 115223905A
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- Prior art keywords
- substrate
- substrate transfer
- transfer module
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
- B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G54/00—Non-mechanical conveyors not otherwise provided for
- B65G54/02—Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D1/00—Control of position, course, altitude or attitude of land, water, air or space vehicles, e.g. using automatic pilots
- G05D1/02—Control of position or course in two dimensions
- G05D1/021—Control of position or course in two dimensions specially adapted to land vehicles
- G05D1/0212—Control of position or course in two dimensions specially adapted to land vehicles with means for defining a desired trajectory
- G05D1/0221—Control of position or course in two dimensions specially adapted to land vehicles with means for defining a desired trajectory involving a learning process
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D1/00—Control of position, course, altitude or attitude of land, water, air or space vehicles, e.g. using automatic pilots
- G05D1/40—Control within particular dimensions
- G05D1/43—Control of position or course in two dimensions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
- H01F7/0231—Magnetic circuits with PM for power or force generation
- H01F7/0236—Magnetic suspension or levitation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/02—Permanent magnets [PM]
- H01F7/0231—Magnetic circuits with PM for power or force generation
- H01F7/0247—Orientating, locating, transporting arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/06—Electromagnets; Actuators including electromagnets
- H01F7/20—Electromagnets; Actuators including electromagnets without armatures
- H01F7/206—Electromagnets for lifting, handling or transporting of magnetic pieces or material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
- B65G2203/02—Control or detection
- B65G2203/0266—Control or detection relating to the load carrier(s)
- B65G2203/0283—Position of the load carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F7/00—Magnets
- H01F7/06—Electromagnets; Actuators including electromagnets
- H01F7/20—Electromagnets; Actuators including electromagnets without armatures
- H01F7/206—Electromagnets for lifting, handling or transporting of magnetic pieces or material
- H01F2007/208—Electromagnets for lifting, handling or transporting of magnetic pieces or material combined with permanent magnets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Radar, Positioning & Navigation (AREA)
- Automation & Control Theory (AREA)
- Aviation & Aerospace Engineering (AREA)
- Remote Sensing (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Non-Mechanical Conveyors (AREA)
- Control Of Linear Motors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-070620 | 2021-04-19 | ||
| JP2021070620A JP7683294B2 (ja) | 2021-04-19 | 2021-04-19 | 基板を搬送する装置、及び基板を搬送する方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115223905A true CN115223905A (zh) | 2022-10-21 |
Family
ID=83602586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210376413.4A Pending CN115223905A (zh) | 2021-04-19 | 2022-04-11 | 基板搬送装置和基板搬送方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US12322642B2 (enExample) |
| JP (2) | JP7683294B2 (enExample) |
| KR (1) | KR102811550B1 (enExample) |
| CN (1) | CN115223905A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117984334A (zh) * | 2024-04-03 | 2024-05-07 | 泓浒(苏州)半导体科技有限公司 | 一种自适应晶圆机械臂力矩调整系统及方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11862502B2 (en) * | 2020-04-21 | 2024-01-02 | Chongqing Konka Photoelectric Technology Research Institute Co., Ltd. | Device, apparatus, and method for semiconductor transfer |
| CN116498867A (zh) * | 2022-01-19 | 2023-07-28 | 苏州佳世达电通有限公司 | 磁力可调的磁性模板及应用该磁性模板的显示装置 |
| KR102817440B1 (ko) * | 2022-10-26 | 2025-06-10 | 세메스 주식회사 | 기판 이송 시스템 및 방법 |
| KR20240103471A (ko) * | 2022-12-27 | 2024-07-04 | 주식회사 엘지에너지솔루션 | 배터리 트레이 및 배터리 이송 시스템 |
| US20240363382A1 (en) * | 2023-04-27 | 2024-10-31 | Applied Materials, Inc. | Methods and mechanisms for damping vibrations in substrate transfer systems |
| WO2025204240A1 (ja) * | 2024-03-28 | 2025-10-02 | 東京エレクトロン株式会社 | 基板搬送システム |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100223349B1 (ko) * | 1994-08-26 | 1999-10-15 | 가나이 쓰도무 | 반송장치, 반송처리장치, 피처리물 반송처리방법 및 자세전환장치 |
| JP2004518204A (ja) * | 2000-12-01 | 2004-06-17 | アクティヴ コントロール エキスパーツ インコーポレイテッド | 運動制御のための方法及び装置 |
| JP2008288331A (ja) * | 2007-05-16 | 2008-11-27 | Yamaha Motor Co Ltd | 表面実装装置 |
| JP2010159167A (ja) * | 2010-02-04 | 2010-07-22 | Canon Anelva Corp | 基板搬送装置及び真空処理装置 |
| US20150214086A1 (en) * | 2014-01-21 | 2015-07-30 | Persimmon Technologies, Corp. | Substrate Transport Vacuum Platform |
| US20160218029A1 (en) * | 2015-01-23 | 2016-07-28 | Applied Materials, Inc. | Semiconductor process equipment |
| CN106024658A (zh) * | 2015-03-31 | 2016-10-12 | 株式会社日立国际电气 | 半导体器件的制造方法及衬底处理装置 |
| US20180141459A1 (en) * | 2015-06-03 | 2018-05-24 | Greg Henderson | Magnetic levitation of vehicles |
| CN110488220A (zh) * | 2018-05-14 | 2019-11-22 | 瑞昱半导体股份有限公司 | 测向芯片、测向方法及信标 |
| CN111081599A (zh) * | 2018-10-18 | 2020-04-28 | 东京毅力科创株式会社 | 基板处理装置和搬送位置校正方法 |
| CN112236851A (zh) * | 2018-06-14 | 2021-01-15 | 罗伯特·博世有限公司 | 用于运送至少一个晶片的运送装置 |
Family Cites Families (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4721424A (en) * | 1985-04-03 | 1988-01-26 | Thermco Systems, Inc. | Semiconductor wafer boat loader releaseable mounting |
| US4692115A (en) * | 1985-04-03 | 1987-09-08 | Thermco Systems, Inc. | Semiconductor wafer furnace door |
| JPH0691682B2 (ja) * | 1985-04-03 | 1994-11-14 | 株式会社岡村製作所 | 磁気浮上制御方法 |
| US4755746A (en) * | 1985-04-24 | 1988-07-05 | Prometrix Corporation | Apparatus and methods for semiconductor wafer testing |
| US5529703A (en) * | 1990-06-04 | 1996-06-25 | Nordson Corporation | Induction dryer and magnetic separator |
| KR940006241A (ko) * | 1992-06-05 | 1994-03-23 | 이노우에 아키라 | 기판이재장치 및 이재방법 |
| JPH0616239A (ja) * | 1992-06-29 | 1994-01-25 | Hitachi Ltd | 磁気浮上搬送装置 |
| EP0597637B1 (en) * | 1992-11-12 | 2000-08-23 | Applied Materials, Inc. | System and method for automated positioning of a substrate in a processing chamber |
| JPH07107779A (ja) * | 1993-09-30 | 1995-04-21 | Ebara Corp | 停止位置決め装置 |
| US5647477A (en) * | 1994-09-19 | 1997-07-15 | Kabushiki Kaisha Toshiba | Magnetic non-contact transport system |
| JPH0917848A (ja) * | 1995-06-30 | 1997-01-17 | Nikon Corp | 磁気浮上型ステージ |
| JPH11168063A (ja) * | 1997-09-19 | 1999-06-22 | Nikon Corp | ステージ装置、走査型露光装置及び露光方法 |
| US6228773B1 (en) * | 1998-04-14 | 2001-05-08 | Matrix Integrated Systems, Inc. | Synchronous multiplexed near zero overhead architecture for vacuum processes |
| JP2005101319A (ja) * | 2003-09-25 | 2005-04-14 | Dainippon Screen Mfg Co Ltd | 基板搬送装置、基板回転装置および基板処理装置 |
| KR20060088817A (ko) * | 2005-01-28 | 2006-08-07 | 가부시키가이샤 이빔 | 기판처리장치 및 기판처리방법 |
| KR100882883B1 (ko) * | 2005-03-29 | 2009-02-10 | 가부시키가이샤 히다치 고쿠사이 덴키 | 반도체 제조장치 |
| KR100946994B1 (ko) * | 2005-10-04 | 2010-03-10 | 가부시키가이샤 히다치 고쿠사이 덴키 | 기판 처리 장치 및 반도체 장치의 제조 방법 |
| JP4313824B2 (ja) * | 2007-03-23 | 2009-08-12 | 東京エレクトロン株式会社 | 基板移載装置及び基板移載方法並びに記憶媒体 |
| JP2010153769A (ja) * | 2008-11-19 | 2010-07-08 | Tokyo Electron Ltd | 基板位置検出装置、基板位置検出方法、成膜装置、成膜方法、プログラム及びコンピュータ可読記憶媒体 |
| JP5548430B2 (ja) * | 2008-11-26 | 2014-07-16 | 株式会社日立国際電気 | 基板処理装置及び半導体装置の製造方法 |
| JP5107285B2 (ja) * | 2009-03-04 | 2012-12-26 | 東京エレクトロン株式会社 | 成膜装置、成膜方法、プログラム、およびコンピュータ可読記憶媒体 |
| JP2010283334A (ja) * | 2009-05-01 | 2010-12-16 | Hitachi Kokusai Electric Inc | 基板処理装置及び半導体装置の製造方法 |
| KR20130001014A (ko) * | 2011-06-24 | 2013-01-03 | 삼성전기주식회사 | 비접촉 웨트 처리 시스템 및 방법 |
| JP5980551B2 (ja) * | 2011-07-13 | 2016-08-31 | 株式会社日立国際電気 | 温度検出部、基板処理装置、及び半導体装置の製造方法 |
| TWI524461B (zh) * | 2012-02-14 | 2016-03-01 | 愛發科股份有限公司 | 離子束照射裝置 |
| DE102013218402B4 (de) * | 2013-09-13 | 2024-11-28 | Krones Ag | Vorrichtung und Verfahren zum Durchführen von Sonderfunktionen einer Transporteinrichtung in einer Behälterbehandlungsanlage |
| DE102013218391A1 (de) * | 2013-09-13 | 2015-03-19 | Krones Ag | Vorrichtung und Verfahren zum Bewegen von Transportelementen in einer Behälterbehandlungsanlage |
| US20150250137A1 (en) * | 2013-11-27 | 2015-09-10 | Dansk Mink Papir A/S | Motorized feeding vehicle and a method of operating an animal farming system |
| JP6760389B2 (ja) * | 2016-09-30 | 2020-09-23 | 株式会社ニコン | 移動体装置、移動方法、露光装置、露光方法、フラットパネルディスプレイの製造方法、並びにデバイス製造方法 |
| JP6862163B2 (ja) * | 2016-12-09 | 2021-04-21 | 東京エレクトロン株式会社 | 基板処理装置 |
| US10906748B2 (en) * | 2017-08-09 | 2021-02-02 | Rockwell Automation Technologies, Inc. | Method and apparatus for identifying a mover on a closed track |
| US10978322B2 (en) * | 2017-08-30 | 2021-04-13 | Tokyo Electron Limited | Transfer device, substrate processing apparatus, and transfer method |
| US11327804B2 (en) * | 2017-12-29 | 2022-05-10 | Intel Corporation | Systems, methods and apparatus for dynamic distribution in autonomous driving |
| US10620631B1 (en) * | 2017-12-29 | 2020-04-14 | Apex Artificial Intelligence Industries, Inc. | Self-correcting controller systems and methods of limiting the operation of neural networks to be within one or more conditions |
| US10324467B1 (en) * | 2017-12-29 | 2019-06-18 | Apex Artificial Intelligence Industries, Inc. | Controller systems and methods of limiting the operation of neural networks to be within one or more conditions |
| US10802489B1 (en) * | 2017-12-29 | 2020-10-13 | Apex Artificial Intelligence Industries, Inc. | Apparatus and method for monitoring and controlling of a neural network using another neural network implemented on one or more solid-state chips |
| CN112106182A (zh) * | 2018-03-20 | 2020-12-18 | 东京毅力科创株式会社 | 结合有集成半导体加工模块的自感知校正异构平台及其使用方法 |
| US10717365B2 (en) * | 2018-07-13 | 2020-07-21 | Rockwell Automation Technologies, Inc. | System and method for limiting motion in an independent cart system |
| JP7189013B2 (ja) * | 2018-12-28 | 2022-12-13 | 東京エレクトロン株式会社 | 基板処理装置および基板処理装置の運転方法 |
| US11625051B2 (en) * | 2019-01-25 | 2023-04-11 | Uber Technologies, Inc. | Proactive generation of tuning data for autonomous vehicle dispatch |
| US11276179B2 (en) * | 2019-12-18 | 2022-03-15 | Zoox, Inc. | Prediction on top-down scenes based on object motion |
| US20210284462A1 (en) * | 2020-03-10 | 2021-09-16 | The Procter & Gamble Company | Track system for creating finished products with multi-dimensional warning system |
| US11862502B2 (en) * | 2020-04-21 | 2024-01-02 | Chongqing Konka Photoelectric Technology Research Institute Co., Ltd. | Device, apparatus, and method for semiconductor transfer |
| CN113687574A (zh) * | 2020-05-18 | 2021-11-23 | 长鑫存储技术有限公司 | 光刻设备及其光源位置监控方法 |
| US20220135330A1 (en) * | 2020-10-29 | 2022-05-05 | Berkshire Grey, Inc. | Systems and methods for automated packaging and processing for shipping with pack and place planning |
| JP7608898B2 (ja) * | 2021-03-16 | 2025-01-07 | 東京エレクトロン株式会社 | 基板を処理する装置及び基板を搬送する方法 |
| JP2024518025A (ja) * | 2021-03-29 | 2024-04-24 | ボード オブ リージェンツ,ザ ユニバーシティ オブ テキサス システム | 触媒影響化学エッチングのためのプロセスおよび適用 |
| JP7439789B2 (ja) * | 2021-04-23 | 2024-02-28 | 株式会社ダイフク | 物品搬送設備、搬送車配置方法、及び搬送車配置プログラム |
| CN218385154U (zh) * | 2022-10-12 | 2023-01-24 | 台湾积体电路制造股份有限公司 | 晶圆输送系统 |
-
2021
- 2021-04-19 JP JP2021070620A patent/JP7683294B2/ja active Active
-
2022
- 2022-04-11 CN CN202210376413.4A patent/CN115223905A/zh active Pending
- 2022-04-12 KR KR1020220045219A patent/KR102811550B1/ko active Active
- 2022-04-13 US US17/659,019 patent/US12322642B2/en active Active
-
2025
- 2025-02-19 US US19/056,965 patent/US20250191964A1/en active Pending
- 2025-05-14 JP JP2025081421A patent/JP2025107477A/ja active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100223349B1 (ko) * | 1994-08-26 | 1999-10-15 | 가나이 쓰도무 | 반송장치, 반송처리장치, 피처리물 반송처리방법 및 자세전환장치 |
| JP2004518204A (ja) * | 2000-12-01 | 2004-06-17 | アクティヴ コントロール エキスパーツ インコーポレイテッド | 運動制御のための方法及び装置 |
| JP2008288331A (ja) * | 2007-05-16 | 2008-11-27 | Yamaha Motor Co Ltd | 表面実装装置 |
| JP2010159167A (ja) * | 2010-02-04 | 2010-07-22 | Canon Anelva Corp | 基板搬送装置及び真空処理装置 |
| US20150214086A1 (en) * | 2014-01-21 | 2015-07-30 | Persimmon Technologies, Corp. | Substrate Transport Vacuum Platform |
| US20160218029A1 (en) * | 2015-01-23 | 2016-07-28 | Applied Materials, Inc. | Semiconductor process equipment |
| CN105826218A (zh) * | 2015-01-23 | 2016-08-03 | 应用材料公司 | 半导体工艺设备 |
| CN106024658A (zh) * | 2015-03-31 | 2016-10-12 | 株式会社日立国际电气 | 半导体器件的制造方法及衬底处理装置 |
| US20180141459A1 (en) * | 2015-06-03 | 2018-05-24 | Greg Henderson | Magnetic levitation of vehicles |
| CN110488220A (zh) * | 2018-05-14 | 2019-11-22 | 瑞昱半导体股份有限公司 | 测向芯片、测向方法及信标 |
| CN112236851A (zh) * | 2018-06-14 | 2021-01-15 | 罗伯特·博世有限公司 | 用于运送至少一个晶片的运送装置 |
| CN111081599A (zh) * | 2018-10-18 | 2020-04-28 | 东京毅力科创株式会社 | 基板处理装置和搬送位置校正方法 |
Non-Patent Citations (2)
| Title |
|---|
| HUANG, B ET AL: "Coherent spin transport through a 350 micron thick silicon wafer", 《PHYSICAL REVIEW LETTERS》, vol. 99, no. 17, 26 October 2007 (2007-10-26), pages 1 - 4 * |
| 王涛;杨玉贵;彭光正;: "半导体及平板显示制造业中的空气非接触搬运技术", 《液晶与显示》, no. 03, 15 June 2009 (2009-06-15), pages 404 - 408 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117984334A (zh) * | 2024-04-03 | 2024-05-07 | 泓浒(苏州)半导体科技有限公司 | 一种自适应晶圆机械臂力矩调整系统及方法 |
| CN117984334B (zh) * | 2024-04-03 | 2024-05-28 | 泓浒(苏州)半导体科技有限公司 | 一种自适应晶圆机械臂力矩调整系统及方法 |
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| KR20220144320A (ko) | 2022-10-26 |
| KR102811550B1 (ko) | 2025-05-22 |
| US20220336260A1 (en) | 2022-10-20 |
| JP7683294B2 (ja) | 2025-05-27 |
| JP2022165301A (ja) | 2022-10-31 |
| US12322642B2 (en) | 2025-06-03 |
| US20250191964A1 (en) | 2025-06-12 |
| JP2025107477A (ja) | 2025-07-17 |
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