CN115223905A - 基板搬送装置和基板搬送方法 - Google Patents

基板搬送装置和基板搬送方法 Download PDF

Info

Publication number
CN115223905A
CN115223905A CN202210376413.4A CN202210376413A CN115223905A CN 115223905 A CN115223905 A CN 115223905A CN 202210376413 A CN202210376413 A CN 202210376413A CN 115223905 A CN115223905 A CN 115223905A
Authority
CN
China
Prior art keywords
substrate
substrate transfer
transfer module
correction
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202210376413.4A
Other languages
English (en)
Chinese (zh)
Inventor
新藤健弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN115223905A publication Critical patent/CN115223905A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67709Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08Control devices operated by article or material being fed, conveyed or discharged
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G54/00Non-mechanical conveyors not otherwise provided for
    • B65G54/02Non-mechanical conveyors not otherwise provided for electrostatic, electric, or magnetic
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D1/00Control of position, course, altitude or attitude of land, water, air or space vehicles, e.g. using automatic pilots
    • G05D1/02Control of position or course in two dimensions
    • G05D1/021Control of position or course in two dimensions specially adapted to land vehicles
    • G05D1/0212Control of position or course in two dimensions specially adapted to land vehicles with means for defining a desired trajectory
    • G05D1/0221Control of position or course in two dimensions specially adapted to land vehicles with means for defining a desired trajectory involving a learning process
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D1/00Control of position, course, altitude or attitude of land, water, air or space vehicles, e.g. using automatic pilots
    • G05D1/40Control within particular dimensions
    • G05D1/43Control of position or course in two dimensions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00Magnets
    • H01F7/02Permanent magnets [PM]
    • H01F7/0231Magnetic circuits with PM for power or force generation
    • H01F7/0236Magnetic suspension or levitation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00Magnets
    • H01F7/02Permanent magnets [PM]
    • H01F7/0231Magnetic circuits with PM for power or force generation
    • H01F7/0247Orientating, locating, transporting arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00Magnets
    • H01F7/06Electromagnets; Actuators including electromagnets
    • H01F7/20Electromagnets; Actuators including electromagnets without armatures
    • H01F7/206Electromagnets for lifting, handling or transporting of magnetic pieces or material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/02Control or detection
    • B65G2203/0266Control or detection relating to the load carrier(s)
    • B65G2203/0283Position of the load carrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F7/00Magnets
    • H01F7/06Electromagnets; Actuators including electromagnets
    • H01F7/20Electromagnets; Actuators including electromagnets without armatures
    • H01F7/206Electromagnets for lifting, handling or transporting of magnetic pieces or material
    • H01F2007/208Electromagnets for lifting, handling or transporting of magnetic pieces or material combined with permanent magnets

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Automation & Control Theory (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Remote Sensing (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Non-Mechanical Conveyors (AREA)
  • Control Of Linear Motors (AREA)
CN202210376413.4A 2021-04-19 2022-04-11 基板搬送装置和基板搬送方法 Pending CN115223905A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-070620 2021-04-19
JP2021070620A JP7683294B2 (ja) 2021-04-19 2021-04-19 基板を搬送する装置、及び基板を搬送する方法

Publications (1)

Publication Number Publication Date
CN115223905A true CN115223905A (zh) 2022-10-21

Family

ID=83602586

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210376413.4A Pending CN115223905A (zh) 2021-04-19 2022-04-11 基板搬送装置和基板搬送方法

Country Status (4)

Country Link
US (2) US12322642B2 (enExample)
JP (2) JP7683294B2 (enExample)
KR (1) KR102811550B1 (enExample)
CN (1) CN115223905A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117984334A (zh) * 2024-04-03 2024-05-07 泓浒(苏州)半导体科技有限公司 一种自适应晶圆机械臂力矩调整系统及方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11862502B2 (en) * 2020-04-21 2024-01-02 Chongqing Konka Photoelectric Technology Research Institute Co., Ltd. Device, apparatus, and method for semiconductor transfer
CN116498867A (zh) * 2022-01-19 2023-07-28 苏州佳世达电通有限公司 磁力可调的磁性模板及应用该磁性模板的显示装置
KR102817440B1 (ko) * 2022-10-26 2025-06-10 세메스 주식회사 기판 이송 시스템 및 방법
KR20240103471A (ko) * 2022-12-27 2024-07-04 주식회사 엘지에너지솔루션 배터리 트레이 및 배터리 이송 시스템
US20240363382A1 (en) * 2023-04-27 2024-10-31 Applied Materials, Inc. Methods and mechanisms for damping vibrations in substrate transfer systems
WO2025204240A1 (ja) * 2024-03-28 2025-10-02 東京エレクトロン株式会社 基板搬送システム

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100223349B1 (ko) * 1994-08-26 1999-10-15 가나이 쓰도무 반송장치, 반송처리장치, 피처리물 반송처리방법 및 자세전환장치
JP2004518204A (ja) * 2000-12-01 2004-06-17 アクティヴ コントロール エキスパーツ インコーポレイテッド 運動制御のための方法及び装置
JP2008288331A (ja) * 2007-05-16 2008-11-27 Yamaha Motor Co Ltd 表面実装装置
JP2010159167A (ja) * 2010-02-04 2010-07-22 Canon Anelva Corp 基板搬送装置及び真空処理装置
US20150214086A1 (en) * 2014-01-21 2015-07-30 Persimmon Technologies, Corp. Substrate Transport Vacuum Platform
US20160218029A1 (en) * 2015-01-23 2016-07-28 Applied Materials, Inc. Semiconductor process equipment
CN106024658A (zh) * 2015-03-31 2016-10-12 株式会社日立国际电气 半导体器件的制造方法及衬底处理装置
US20180141459A1 (en) * 2015-06-03 2018-05-24 Greg Henderson Magnetic levitation of vehicles
CN110488220A (zh) * 2018-05-14 2019-11-22 瑞昱半导体股份有限公司 测向芯片、测向方法及信标
CN111081599A (zh) * 2018-10-18 2020-04-28 东京毅力科创株式会社 基板处理装置和搬送位置校正方法
CN112236851A (zh) * 2018-06-14 2021-01-15 罗伯特·博世有限公司 用于运送至少一个晶片的运送装置

Family Cites Families (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4721424A (en) * 1985-04-03 1988-01-26 Thermco Systems, Inc. Semiconductor wafer boat loader releaseable mounting
US4692115A (en) * 1985-04-03 1987-09-08 Thermco Systems, Inc. Semiconductor wafer furnace door
JPH0691682B2 (ja) * 1985-04-03 1994-11-14 株式会社岡村製作所 磁気浮上制御方法
US4755746A (en) * 1985-04-24 1988-07-05 Prometrix Corporation Apparatus and methods for semiconductor wafer testing
US5529703A (en) * 1990-06-04 1996-06-25 Nordson Corporation Induction dryer and magnetic separator
KR940006241A (ko) * 1992-06-05 1994-03-23 이노우에 아키라 기판이재장치 및 이재방법
JPH0616239A (ja) * 1992-06-29 1994-01-25 Hitachi Ltd 磁気浮上搬送装置
EP0597637B1 (en) * 1992-11-12 2000-08-23 Applied Materials, Inc. System and method for automated positioning of a substrate in a processing chamber
JPH07107779A (ja) * 1993-09-30 1995-04-21 Ebara Corp 停止位置決め装置
US5647477A (en) * 1994-09-19 1997-07-15 Kabushiki Kaisha Toshiba Magnetic non-contact transport system
JPH0917848A (ja) * 1995-06-30 1997-01-17 Nikon Corp 磁気浮上型ステージ
JPH11168063A (ja) * 1997-09-19 1999-06-22 Nikon Corp ステージ装置、走査型露光装置及び露光方法
US6228773B1 (en) * 1998-04-14 2001-05-08 Matrix Integrated Systems, Inc. Synchronous multiplexed near zero overhead architecture for vacuum processes
JP2005101319A (ja) * 2003-09-25 2005-04-14 Dainippon Screen Mfg Co Ltd 基板搬送装置、基板回転装置および基板処理装置
KR20060088817A (ko) * 2005-01-28 2006-08-07 가부시키가이샤 이빔 기판처리장치 및 기판처리방법
KR100882883B1 (ko) * 2005-03-29 2009-02-10 가부시키가이샤 히다치 고쿠사이 덴키 반도체 제조장치
KR100946994B1 (ko) * 2005-10-04 2010-03-10 가부시키가이샤 히다치 고쿠사이 덴키 기판 처리 장치 및 반도체 장치의 제조 방법
JP4313824B2 (ja) * 2007-03-23 2009-08-12 東京エレクトロン株式会社 基板移載装置及び基板移載方法並びに記憶媒体
JP2010153769A (ja) * 2008-11-19 2010-07-08 Tokyo Electron Ltd 基板位置検出装置、基板位置検出方法、成膜装置、成膜方法、プログラム及びコンピュータ可読記憶媒体
JP5548430B2 (ja) * 2008-11-26 2014-07-16 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
JP5107285B2 (ja) * 2009-03-04 2012-12-26 東京エレクトロン株式会社 成膜装置、成膜方法、プログラム、およびコンピュータ可読記憶媒体
JP2010283334A (ja) * 2009-05-01 2010-12-16 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
KR20130001014A (ko) * 2011-06-24 2013-01-03 삼성전기주식회사 비접촉 웨트 처리 시스템 및 방법
JP5980551B2 (ja) * 2011-07-13 2016-08-31 株式会社日立国際電気 温度検出部、基板処理装置、及び半導体装置の製造方法
TWI524461B (zh) * 2012-02-14 2016-03-01 愛發科股份有限公司 離子束照射裝置
DE102013218402B4 (de) * 2013-09-13 2024-11-28 Krones Ag Vorrichtung und Verfahren zum Durchführen von Sonderfunktionen einer Transporteinrichtung in einer Behälterbehandlungsanlage
DE102013218391A1 (de) * 2013-09-13 2015-03-19 Krones Ag Vorrichtung und Verfahren zum Bewegen von Transportelementen in einer Behälterbehandlungsanlage
US20150250137A1 (en) * 2013-11-27 2015-09-10 Dansk Mink Papir A/S Motorized feeding vehicle and a method of operating an animal farming system
JP6760389B2 (ja) * 2016-09-30 2020-09-23 株式会社ニコン 移動体装置、移動方法、露光装置、露光方法、フラットパネルディスプレイの製造方法、並びにデバイス製造方法
JP6862163B2 (ja) * 2016-12-09 2021-04-21 東京エレクトロン株式会社 基板処理装置
US10906748B2 (en) * 2017-08-09 2021-02-02 Rockwell Automation Technologies, Inc. Method and apparatus for identifying a mover on a closed track
US10978322B2 (en) * 2017-08-30 2021-04-13 Tokyo Electron Limited Transfer device, substrate processing apparatus, and transfer method
US11327804B2 (en) * 2017-12-29 2022-05-10 Intel Corporation Systems, methods and apparatus for dynamic distribution in autonomous driving
US10620631B1 (en) * 2017-12-29 2020-04-14 Apex Artificial Intelligence Industries, Inc. Self-correcting controller systems and methods of limiting the operation of neural networks to be within one or more conditions
US10324467B1 (en) * 2017-12-29 2019-06-18 Apex Artificial Intelligence Industries, Inc. Controller systems and methods of limiting the operation of neural networks to be within one or more conditions
US10802489B1 (en) * 2017-12-29 2020-10-13 Apex Artificial Intelligence Industries, Inc. Apparatus and method for monitoring and controlling of a neural network using another neural network implemented on one or more solid-state chips
CN112106182A (zh) * 2018-03-20 2020-12-18 东京毅力科创株式会社 结合有集成半导体加工模块的自感知校正异构平台及其使用方法
US10717365B2 (en) * 2018-07-13 2020-07-21 Rockwell Automation Technologies, Inc. System and method for limiting motion in an independent cart system
JP7189013B2 (ja) * 2018-12-28 2022-12-13 東京エレクトロン株式会社 基板処理装置および基板処理装置の運転方法
US11625051B2 (en) * 2019-01-25 2023-04-11 Uber Technologies, Inc. Proactive generation of tuning data for autonomous vehicle dispatch
US11276179B2 (en) * 2019-12-18 2022-03-15 Zoox, Inc. Prediction on top-down scenes based on object motion
US20210284462A1 (en) * 2020-03-10 2021-09-16 The Procter & Gamble Company Track system for creating finished products with multi-dimensional warning system
US11862502B2 (en) * 2020-04-21 2024-01-02 Chongqing Konka Photoelectric Technology Research Institute Co., Ltd. Device, apparatus, and method for semiconductor transfer
CN113687574A (zh) * 2020-05-18 2021-11-23 长鑫存储技术有限公司 光刻设备及其光源位置监控方法
US20220135330A1 (en) * 2020-10-29 2022-05-05 Berkshire Grey, Inc. Systems and methods for automated packaging and processing for shipping with pack and place planning
JP7608898B2 (ja) * 2021-03-16 2025-01-07 東京エレクトロン株式会社 基板を処理する装置及び基板を搬送する方法
JP2024518025A (ja) * 2021-03-29 2024-04-24 ボード オブ リージェンツ,ザ ユニバーシティ オブ テキサス システム 触媒影響化学エッチングのためのプロセスおよび適用
JP7439789B2 (ja) * 2021-04-23 2024-02-28 株式会社ダイフク 物品搬送設備、搬送車配置方法、及び搬送車配置プログラム
CN218385154U (zh) * 2022-10-12 2023-01-24 台湾积体电路制造股份有限公司 晶圆输送系统

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100223349B1 (ko) * 1994-08-26 1999-10-15 가나이 쓰도무 반송장치, 반송처리장치, 피처리물 반송처리방법 및 자세전환장치
JP2004518204A (ja) * 2000-12-01 2004-06-17 アクティヴ コントロール エキスパーツ インコーポレイテッド 運動制御のための方法及び装置
JP2008288331A (ja) * 2007-05-16 2008-11-27 Yamaha Motor Co Ltd 表面実装装置
JP2010159167A (ja) * 2010-02-04 2010-07-22 Canon Anelva Corp 基板搬送装置及び真空処理装置
US20150214086A1 (en) * 2014-01-21 2015-07-30 Persimmon Technologies, Corp. Substrate Transport Vacuum Platform
US20160218029A1 (en) * 2015-01-23 2016-07-28 Applied Materials, Inc. Semiconductor process equipment
CN105826218A (zh) * 2015-01-23 2016-08-03 应用材料公司 半导体工艺设备
CN106024658A (zh) * 2015-03-31 2016-10-12 株式会社日立国际电气 半导体器件的制造方法及衬底处理装置
US20180141459A1 (en) * 2015-06-03 2018-05-24 Greg Henderson Magnetic levitation of vehicles
CN110488220A (zh) * 2018-05-14 2019-11-22 瑞昱半导体股份有限公司 测向芯片、测向方法及信标
CN112236851A (zh) * 2018-06-14 2021-01-15 罗伯特·博世有限公司 用于运送至少一个晶片的运送装置
CN111081599A (zh) * 2018-10-18 2020-04-28 东京毅力科创株式会社 基板处理装置和搬送位置校正方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
HUANG, B ET AL: "Coherent spin transport through a 350 micron thick silicon wafer", 《PHYSICAL REVIEW LETTERS》, vol. 99, no. 17, 26 October 2007 (2007-10-26), pages 1 - 4 *
王涛;杨玉贵;彭光正;: "半导体及平板显示制造业中的空气非接触搬运技术", 《液晶与显示》, no. 03, 15 June 2009 (2009-06-15), pages 404 - 408 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117984334A (zh) * 2024-04-03 2024-05-07 泓浒(苏州)半导体科技有限公司 一种自适应晶圆机械臂力矩调整系统及方法
CN117984334B (zh) * 2024-04-03 2024-05-28 泓浒(苏州)半导体科技有限公司 一种自适应晶圆机械臂力矩调整系统及方法

Also Published As

Publication number Publication date
KR20220144320A (ko) 2022-10-26
KR102811550B1 (ko) 2025-05-22
US20220336260A1 (en) 2022-10-20
JP7683294B2 (ja) 2025-05-27
JP2022165301A (ja) 2022-10-31
US12322642B2 (en) 2025-06-03
US20250191964A1 (en) 2025-06-12
JP2025107477A (ja) 2025-07-17

Similar Documents

Publication Publication Date Title
CN115223905A (zh) 基板搬送装置和基板搬送方法
US11862498B2 (en) Substrate processing apparatus
KR102479920B1 (ko) 반도체 프로세스 장비
KR101841753B1 (ko) 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템
KR102652598B1 (ko) 기판 반송 장치, 기판 반송 방법, 및 기판 처리 시스템
CN116190299A (zh) 基板搬送装置和基板搬送方法
KR20220100957A (ko) 기판 반송 장치 및 기판 처리 시스템
US12206342B2 (en) Substrate processing apparatus
JP2025107477A5 (enExample)
KR20090053915A (ko) 용량이 축소된 캐리어, 이송, 로드 포트, 버퍼 시스템

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination