CN115141569A - 工件加工用片 - Google Patents
工件加工用片 Download PDFInfo
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- CN115141569A CN115141569A CN202210122678.1A CN202210122678A CN115141569A CN 115141569 A CN115141569 A CN 115141569A CN 202210122678 A CN202210122678 A CN 202210122678A CN 115141569 A CN115141569 A CN 115141569A
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- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68354—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to support diced chips prior to mounting
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021-060043 | 2021-03-31 | ||
JP2021060043 | 2021-03-31 | ||
JP2022006073A JP2022158902A (ja) | 2021-03-31 | 2022-01-19 | ワーク加工用シート |
JP2022-006073 | 2022-01-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN115141569A true CN115141569A (zh) | 2022-10-04 |
Family
ID=83405128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202210122678.1A Pending CN115141569A (zh) | 2021-03-31 | 2022-02-09 | 工件加工用片 |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR20220136091A (ko) |
CN (1) | CN115141569A (ko) |
TW (1) | TW202239586A (ko) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6146616B2 (ja) | 2013-10-31 | 2017-06-14 | 住友ベークライト株式会社 | ダイシング用基体フィルム、ダイシングフィルム、及び半導体チップの製造方法 |
-
2022
- 2022-01-22 TW TW111102733A patent/TW202239586A/zh unknown
- 2022-02-08 KR KR1020220016144A patent/KR20220136091A/ko unknown
- 2022-02-09 CN CN202210122678.1A patent/CN115141569A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20220136091A (ko) | 2022-10-07 |
TW202239586A (zh) | 2022-10-16 |
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