CN115103872B - 倍半硅氧烷衍生物及其用途 - Google Patents

倍半硅氧烷衍生物及其用途 Download PDF

Info

Publication number
CN115103872B
CN115103872B CN202180011600.6A CN202180011600A CN115103872B CN 115103872 B CN115103872 B CN 115103872B CN 202180011600 A CN202180011600 A CN 202180011600A CN 115103872 B CN115103872 B CN 115103872B
Authority
CN
China
Prior art keywords
silsesquioxane derivative
silsesquioxane
less
sio
conductive filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180011600.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN115103872A (zh
Inventor
岩濑贤明
岩本雄二
本多泽雄
大幸裕介
角谷祐辅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toagosei Co Ltd
Nagoya Institute of Technology NUC
Original Assignee
Toagosei Co Ltd
Nagoya Institute of Technology NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toagosei Co Ltd, Nagoya Institute of Technology NUC filed Critical Toagosei Co Ltd
Publication of CN115103872A publication Critical patent/CN115103872A/zh
Application granted granted Critical
Publication of CN115103872B publication Critical patent/CN115103872B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0836—Compounds with one or more Si-OH or Si-O-metal linkage
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
CN202180011600.6A 2020-01-28 2021-01-28 倍半硅氧烷衍生物及其用途 Active CN115103872B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-011975 2020-01-28
JP2020011975 2020-01-28
PCT/JP2021/003072 WO2021153683A1 (ja) 2020-01-28 2021-01-28 シルセスキオキサン誘導体及びその利用

Publications (2)

Publication Number Publication Date
CN115103872A CN115103872A (zh) 2022-09-23
CN115103872B true CN115103872B (zh) 2024-02-02

Family

ID=77079369

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180011600.6A Active CN115103872B (zh) 2020-01-28 2021-01-28 倍半硅氧烷衍生物及其用途

Country Status (5)

Country Link
US (1) US20230128852A1 (https=)
JP (1) JP7401878B2 (https=)
KR (1) KR102854970B1 (https=)
CN (1) CN115103872B (https=)
WO (1) WO2021153683A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7694417B2 (ja) 2022-02-10 2025-06-18 信越化学工業株式会社 熱伝導性組成物およびその硬化物
JPWO2023190863A1 (https=) * 2022-03-30 2023-10-05

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101848957A (zh) * 2007-11-19 2010-09-29 东亚合成株式会社 聚硅氧烷及其制造方法以及固化物的制造方法
CN102639643A (zh) * 2010-03-31 2012-08-15 积水化学工业株式会社 光半导体装置用密封剂及光半导体装置
CN103249695A (zh) * 2010-11-10 2013-08-14 Esk陶瓷有限两合公司 氮化硼团聚体、其生产方法及其用途
CN103547632A (zh) * 2011-07-14 2014-01-29 积水化学工业株式会社 光半导体装置用密封剂及光半导体装置
CN103764702A (zh) * 2011-09-01 2014-04-30 东亚合成株式会社 耐热冲击性固化物及其制造方法
CN103828062A (zh) * 2011-12-26 2014-05-28 东亚合成株式会社 有机半导体绝缘膜用组合物及有机半导体绝缘膜
CN105579511A (zh) * 2013-06-19 2016-05-11 3M创新有限公司 由聚合物/氮化硼复合物制备的组成部件、用于制备此类组成部件的聚合物/氮化硼复合物及其用途
JP2017226746A (ja) * 2016-06-22 2017-12-28 株式会社ダイセル シルセスキオキサン
JP2019001961A (ja) * 2017-06-19 2019-01-10 東亞合成株式会社 半導体装置及びその製造方法
JP2019070071A (ja) * 2017-10-06 2019-05-09 東亞合成株式会社 硬化性組成物及びその利用
JP2019133851A (ja) * 2018-01-31 2019-08-08 国立大学法人 名古屋工業大学 絶縁材組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9663598B2 (en) * 2013-09-13 2017-05-30 Toagosei Co., Ltd. Organosilicon compound-containing thermosetting composition and cured product thereof
US10752755B2 (en) * 2016-03-02 2020-08-25 Jnc Corporation Composition for heat-dissipating member, heat-dissipating member, electronic instrument, and method for producing heat-dissipating member
JP2019001901A (ja) * 2017-06-15 2019-01-10 太平洋セメント株式会社 浚渫土の処理方法

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101848957A (zh) * 2007-11-19 2010-09-29 东亚合成株式会社 聚硅氧烷及其制造方法以及固化物的制造方法
CN102639643A (zh) * 2010-03-31 2012-08-15 积水化学工业株式会社 光半导体装置用密封剂及光半导体装置
CN103249695A (zh) * 2010-11-10 2013-08-14 Esk陶瓷有限两合公司 氮化硼团聚体、其生产方法及其用途
CN107253704A (zh) * 2010-11-10 2017-10-17 3M创新有限公司 氮化硼团聚体、其生产方法及其用途
CN103547632A (zh) * 2011-07-14 2014-01-29 积水化学工业株式会社 光半导体装置用密封剂及光半导体装置
CN103764702A (zh) * 2011-09-01 2014-04-30 东亚合成株式会社 耐热冲击性固化物及其制造方法
CN103828062A (zh) * 2011-12-26 2014-05-28 东亚合成株式会社 有机半导体绝缘膜用组合物及有机半导体绝缘膜
CN105579511A (zh) * 2013-06-19 2016-05-11 3M创新有限公司 由聚合物/氮化硼复合物制备的组成部件、用于制备此类组成部件的聚合物/氮化硼复合物及其用途
JP2017226746A (ja) * 2016-06-22 2017-12-28 株式会社ダイセル シルセスキオキサン
JP2019001961A (ja) * 2017-06-19 2019-01-10 東亞合成株式会社 半導体装置及びその製造方法
JP2019070071A (ja) * 2017-10-06 2019-05-09 東亞合成株式会社 硬化性組成物及びその利用
JP2019133851A (ja) * 2018-01-31 2019-08-08 国立大学法人 名古屋工業大学 絶縁材組成物

Also Published As

Publication number Publication date
KR20220133274A (ko) 2022-10-04
WO2021153683A1 (ja) 2021-08-05
JPWO2021153683A1 (https=) 2021-08-05
KR102854970B1 (ko) 2025-09-04
CN115103872A (zh) 2022-09-23
JP7401878B2 (ja) 2023-12-20
US20230128852A1 (en) 2023-04-27

Similar Documents

Publication Publication Date Title
TWI666267B (zh) 聚矽氧凝膠組合物
JP5853989B2 (ja) リアクトル用熱伝導性シリコーン接着剤組成物及びリアクトル
US8378004B2 (en) Process for the production of silicone coatings and silicone moldings from photocrosslinkable silicone mixtures
TWI457373B (zh) 有機聚碳矽烷矽氧烷組成物及其硬化物
WO2017203924A1 (ja) 熱伝導性シリコーン組成物及びその硬化物
CN105705599B (zh) 树脂-线性有机硅氧烷嵌段共聚物的组合物
KR20090130005A (ko) 실리콘 엘라스토머 조성물 및 실리콘 엘라스토머
TWI544665B (zh) Silicon oxide compositions for semiconductor encapsulation
US9150726B2 (en) Heat-stabilized silicone mixture
WO2023053760A1 (ja) 熱伝導性シリコーン組成物および該組成物を使用するギャップフィラーの製造方法
CN115612446B (zh) 灌封用导热加成型有机硅组合物
CN102471581B (zh) 半导体密封用固化性组合物
CN115103872B (zh) 倍半硅氧烷衍生物及其用途
CN113785003A (zh) 聚有机硅氧烷，含其的导热硅氧烷组合物
JP6930242B2 (ja) 半導体装置及びその製造方法
JP4553562B2 (ja) 接着性ポリオルガノシロキサン組成物
WO2015178475A1 (ja) 分岐鎖状ポリオルガノシロキシシルアルキレン、その製造方法、硬化性樹脂組成物、及び半導体装置
JP2018030977A (ja) シリコーン樹脂基板、金属層形成シリコーン樹脂基板、シリコーン樹脂硬化基板及び金属層形成シリコーン樹脂硬化基板
JP2024101552A (ja) 熱伝導性シリコーン組成物および該組成物の製造方法
JP7395163B2 (ja) セラミックス／樹脂複合材料、その製造方法及びその利用
WO2012073899A1 (ja) 硬化物製造用キット及び硬化物製造用組成物、並びにその使用
JP7763573B1 (ja) 熱伝導性シリコーンゴムシート
JP5762876B2 (ja) エポキシ樹脂用硬化剤、及び該エポキシ樹脂用硬化剤を含有するエポキシ樹脂組成物
JP7632468B2 (ja) 光硬化性組成物、その硬化物、及び硬化物の製造方法
TWI757112B (zh) 熱傳導性組成物及其製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant