JPWO2021153683A1 - - Google Patents
Info
- Publication number
- JPWO2021153683A1 JPWO2021153683A1 JP2021574114A JP2021574114A JPWO2021153683A1 JP WO2021153683 A1 JPWO2021153683 A1 JP WO2021153683A1 JP 2021574114 A JP2021574114 A JP 2021574114A JP 2021574114 A JP2021574114 A JP 2021574114A JP WO2021153683 A1 JPWO2021153683 A1 JP WO2021153683A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0836—Compounds with one or more Si-OH or Si-O-metal linkage
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Silicon Polymers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020011975 | 2020-01-28 | ||
| JP2020011975 | 2020-01-28 | ||
| PCT/JP2021/003072 WO2021153683A1 (ja) | 2020-01-28 | 2021-01-28 | シルセスキオキサン誘導体及びその利用 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2021153683A1 true JPWO2021153683A1 (https=) | 2021-08-05 |
| JP7401878B2 JP7401878B2 (ja) | 2023-12-20 |
Family
ID=77079369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021574114A Active JP7401878B2 (ja) | 2020-01-28 | 2021-01-28 | シルセスキオキサン誘導体及びその利用 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20230128852A1 (https=) |
| JP (1) | JP7401878B2 (https=) |
| KR (1) | KR102854970B1 (https=) |
| CN (1) | CN115103872B (https=) |
| WO (1) | WO2021153683A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7694417B2 (ja) | 2022-02-10 | 2025-06-18 | 信越化学工業株式会社 | 熱伝導性組成物およびその硬化物 |
| JPWO2023190863A1 (https=) * | 2022-03-30 | 2023-10-05 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017226746A (ja) * | 2016-06-22 | 2017-12-28 | 株式会社ダイセル | シルセスキオキサン |
| JP2019001961A (ja) * | 2017-06-19 | 2019-01-10 | 東亞合成株式会社 | 半導体装置及びその製造方法 |
| JP2019070071A (ja) * | 2017-10-06 | 2019-05-09 | 東亞合成株式会社 | 硬化性組成物及びその利用 |
| JP2019133851A (ja) * | 2018-01-31 | 2019-08-08 | 国立大学法人 名古屋工業大学 | 絶縁材組成物 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101512529B1 (ko) * | 2007-11-19 | 2015-04-15 | 도아고세이가부시키가이샤 | 폴리실록산 및 그의 제조 방법 및 경화물의 제조 방법 |
| EP2554601A4 (en) * | 2010-03-31 | 2013-10-09 | Sekisui Chemical Co Ltd | SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR ELEMENT |
| DE102010050900A1 (de) * | 2010-11-10 | 2012-05-10 | Esk Ceramics Gmbh & Co. Kg | Bornitrid-Agglomerate, Verfahren zu deren Herstellung und deren Verwendung |
| US20140175505A1 (en) * | 2011-07-14 | 2014-06-26 | Ryosuke Yamazaki | Sealing agent for optical semiconductor devices, and optical semiconductor device |
| WO2013031798A1 (ja) * | 2011-09-01 | 2013-03-07 | 東亞合成株式会社 | 耐熱衝撃性硬化物及びその製造方法 |
| JP5704256B2 (ja) * | 2011-12-26 | 2015-04-22 | 東亞合成株式会社 | 絶縁膜用組成物及び絶縁膜 |
| EP2816083B1 (de) * | 2013-06-19 | 2019-02-20 | 3M Innovative Properties Company | Bauteil hergestellt aus einem Polymer-Bornitrid-Compound, Polymer-Bornitrid-Compound zur Herstellung eines solchen Bauteils sowie dessen Verwendung |
| US9663598B2 (en) * | 2013-09-13 | 2017-05-30 | Toagosei Co., Ltd. | Organosilicon compound-containing thermosetting composition and cured product thereof |
| US10752755B2 (en) * | 2016-03-02 | 2020-08-25 | Jnc Corporation | Composition for heat-dissipating member, heat-dissipating member, electronic instrument, and method for producing heat-dissipating member |
| JP2019001901A (ja) * | 2017-06-15 | 2019-01-10 | 太平洋セメント株式会社 | 浚渫土の処理方法 |
-
2021
- 2021-01-28 JP JP2021574114A patent/JP7401878B2/ja active Active
- 2021-01-28 WO PCT/JP2021/003072 patent/WO2021153683A1/ja not_active Ceased
- 2021-01-28 CN CN202180011600.6A patent/CN115103872B/zh active Active
- 2021-01-28 US US17/796,128 patent/US20230128852A1/en active Pending
- 2021-01-28 KR KR1020227029735A patent/KR102854970B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017226746A (ja) * | 2016-06-22 | 2017-12-28 | 株式会社ダイセル | シルセスキオキサン |
| JP2019001961A (ja) * | 2017-06-19 | 2019-01-10 | 東亞合成株式会社 | 半導体装置及びその製造方法 |
| JP2019070071A (ja) * | 2017-10-06 | 2019-05-09 | 東亞合成株式会社 | 硬化性組成物及びその利用 |
| JP2019133851A (ja) * | 2018-01-31 | 2019-08-08 | 国立大学法人 名古屋工業大学 | 絶縁材組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20220133274A (ko) | 2022-10-04 |
| WO2021153683A1 (ja) | 2021-08-05 |
| KR102854970B1 (ko) | 2025-09-04 |
| CN115103872A (zh) | 2022-09-23 |
| JP7401878B2 (ja) | 2023-12-20 |
| CN115103872B (zh) | 2024-02-02 |
| US20230128852A1 (en) | 2023-04-27 |
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