CN114945867B - 正型感光性树脂组合物、固化膜、层叠体、带导电图案的基板、层叠体的制造方法、触控面板及有机el显示装置 - Google Patents

正型感光性树脂组合物、固化膜、层叠体、带导电图案的基板、层叠体的制造方法、触控面板及有机el显示装置 Download PDF

Info

Publication number
CN114945867B
CN114945867B CN202080093425.5A CN202080093425A CN114945867B CN 114945867 B CN114945867 B CN 114945867B CN 202080093425 A CN202080093425 A CN 202080093425A CN 114945867 B CN114945867 B CN 114945867B
Authority
CN
China
Prior art keywords
resin composition
cured film
photosensitive resin
substrate
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080093425.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN114945867A (zh
Inventor
此岛阳平
三井博子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Publication of CN114945867A publication Critical patent/CN114945867A/zh
Application granted granted Critical
Publication of CN114945867B publication Critical patent/CN114945867B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Chimneys And Flues (AREA)
  • Electroluminescent Light Sources (AREA)
CN202080093425.5A 2020-01-21 2020-12-16 正型感光性树脂组合物、固化膜、层叠体、带导电图案的基板、层叠体的制造方法、触控面板及有机el显示装置 Active CN114945867B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-007333 2020-01-21
JP2020007333 2020-01-21
PCT/JP2020/046911 WO2021149410A1 (ja) 2020-01-21 2020-12-16 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置

Publications (2)

Publication Number Publication Date
CN114945867A CN114945867A (zh) 2022-08-26
CN114945867B true CN114945867B (zh) 2023-05-16

Family

ID=76992186

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080093425.5A Active CN114945867B (zh) 2020-01-21 2020-12-16 正型感光性树脂组合物、固化膜、层叠体、带导电图案的基板、层叠体的制造方法、触控面板及有机el显示装置

Country Status (5)

Country Link
JP (1) JP7081696B2 (https=)
KR (1) KR102624811B1 (https=)
CN (1) CN114945867B (https=)
TW (1) TWI826761B (https=)
WO (1) WO2021149410A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024135082A1 (ja) * 2022-12-20 2024-06-27 東レ株式会社 配線基板、遮光層形成用ポジ型感光性樹脂組成物、遮光層転写フィルムおよび配線基板の製造方法
KR20240120338A (ko) * 2023-01-31 2024-08-07 엘지디스플레이 주식회사 표시 장치

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5127245B2 (ja) * 2007-01-29 2013-01-23 株式会社Ａｄｅｋａ ポジ型感光性樹脂組成物
JP2009020246A (ja) * 2007-07-11 2009-01-29 Toray Ind Inc 感光性樹脂組成物、これを用いた絶縁性樹脂パターンの製造方法および有機電界発光素子
JP5181968B2 (ja) * 2007-09-28 2013-04-10 東レ株式会社 ポジ型感光性組成物、硬化膜の製造方法、硬化膜、および硬化膜を有する素子
JP5233526B2 (ja) * 2008-09-05 2013-07-10 東レ株式会社 感光性組成物、それから形成された硬化膜、および硬化膜を有する素子
JP5441542B2 (ja) * 2009-07-22 2014-03-12 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜、層間絶縁膜、有機ｅｌ表示装置、及び液晶表示装置
JP5821481B2 (ja) * 2011-09-30 2015-11-24 東レ株式会社 ネガ型感光性樹脂組成物およびそれを用いた保護膜およびタッチパネル部材
JP2014048607A (ja) * 2012-09-04 2014-03-17 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2014052401A (ja) * 2012-09-05 2014-03-20 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP2014091790A (ja) * 2012-11-05 2014-05-19 Toyo Ink Sc Holdings Co Ltd 樹脂組成物
JP6417669B2 (ja) * 2013-03-05 2018-11-07 東レ株式会社 感光性樹脂組成物、保護膜及び絶縁膜並びにタッチパネルの製造方法
JP2015193758A (ja) * 2014-03-31 2015-11-05 東洋インキＳｃホールディングス株式会社 オーバーコート用感光性樹脂組成物、ならびにそれを用いた塗膜
WO2016047483A1 (ja) * 2014-09-26 2016-03-31 東レ株式会社 有機ｅｌ表示装置
US10197915B2 (en) * 2014-11-27 2019-02-05 Toray Industries, Inc. Resin and photosensitive resin composition
KR101609234B1 (ko) * 2015-01-13 2016-04-05 동우 화인켐 주식회사 감광성 수지 조성물, 이로부터 형성된 광경화 패턴 및 이를 포함하는 화상 표시 장치
KR101611836B1 (ko) * 2015-01-13 2016-04-12 동우 화인켐 주식회사 감광성 수지 조성물, 이로부터 형성된 광경화 패턴 및 이를 포함하는 화상 표시 장치
CN107407876A (zh) * 2015-03-06 2017-11-28 东丽株式会社 感光性树脂组合物及电子部件
CN107430335B (zh) * 2015-04-01 2021-04-02 东丽株式会社 感光性着色树脂组合物
CN108475012B (zh) * 2015-12-24 2022-07-15 三菱化学株式会社 感光性着色组合物、固化物、着色间隔物、图像显示装置
JP6826325B2 (ja) * 2016-03-15 2021-02-03 東レ株式会社 感光性樹脂組成物、硬化膜、積層体、タッチパネル用部材及び硬化膜の製造方法
KR101979980B1 (ko) * 2016-03-23 2019-05-17 동우 화인켐 주식회사 감광성 수지 조성물
CN109563353B (zh) * 2016-07-27 2022-01-14 东丽株式会社 树脂组合物
EP3505545B1 (en) * 2016-08-25 2021-05-26 FUJIFILM Corporation Curable composition and production process therefor, cured film and production process therefor, color filter, solid-state imaging element, solid-state imaging device, and infrared sensor
WO2018066296A1 (ja) * 2016-10-04 2018-04-12 富士フイルム株式会社 分散組成物、硬化性組成物、硬化膜、カラーフィルタ、固体撮像素子、固体撮像装置、赤外線センサ、分散組成物の製造方法、硬化性組成物の製造方法、及び、硬化膜の製造方法
KR102216990B1 (ko) * 2017-03-29 2021-02-22 도레이 카부시키가이샤 감광성 조성물, 경화막 및 유기 el 표시 장치
CN111095044B (zh) * 2017-09-25 2022-08-12 东丽株式会社 着色树脂组合物、着色膜、滤色器及液晶显示装置
KR102382227B1 (ko) * 2017-09-28 2022-04-04 후지필름 가부시키가이샤 감광성 착색 조성물, 경화막, 패턴의 형성 방법, 컬러 필터, 고체 촬상 소자 및 화상 표시 장치
JP7012733B2 (ja) * 2017-09-29 2022-01-28 富士フイルム株式会社 光硬化性組成物、積層体、及び、固体撮像素子
JP6994044B2 (ja) * 2017-10-06 2022-01-14 富士フイルム株式会社 硬化膜の製造方法、固体撮像素子の製造方法、画像表示装置の製造方法
JP7720679B2 (ja) * 2018-03-26 2025-08-08 東レ株式会社 樹脂組成物、樹脂シート、硬化膜
JP2019185034A (ja) * 2018-03-30 2019-10-24 Jsr株式会社 着色組成物、着色硬化膜、カラーフィルタ、表示素子、受光素子及び発光素子

Also Published As

Publication number Publication date
JPWO2021149410A1 (https=) 2021-07-29
JP7081696B2 (ja) 2022-06-07
TWI826761B (zh) 2023-12-21
TW202132922A (zh) 2021-09-01
CN114945867A (zh) 2022-08-26
KR102624811B1 (ko) 2024-01-16
WO2021149410A1 (ja) 2021-07-29
KR20220131512A (ko) 2022-09-28

Similar Documents

Publication Publication Date Title
JP6738790B2 (ja) 感光性樹脂組成物、感光性樹脂積層体、樹脂パターンの製造方法、硬化膜の製造方法及び表示装置の製造方法
TWI659268B (zh) Transfer film for touch panel
CN107109131B (zh) 触摸面板电极保护膜形成用组合物及其应用
CN107406673B (zh) 着色树脂组合物、着色膜、装饰基板及触摸面板
JP2015068893A (ja) 樹脂ブラックマトリクス基板
KR102837019B1 (ko) 표시 장치용 기판 및 그 제조 방법, 및 그들에 사용하는 반사 방지층용 수지 조성물 용액
JP6365298B2 (ja) 樹脂ブラックマトリクス基板およびタッチパネル
CN114945867B (zh) 正型感光性树脂组合物、固化膜、层叠体、带导电图案的基板、层叠体的制造方法、触控面板及有机el显示装置
TWI805927B (zh) 附有導電層之基板及觸控面板用構件
JP6330412B2 (ja) 遮光膜形成基板及びタッチパネル
JP2015001655A (ja) 積層樹脂ブラックマトリックス基板
JP4075243B2 (ja) カラーフィルタ用感放射線性組成物およびカラーフィルタ
CN101750886A (zh) 感光树脂组合物和彩色滤光片的制备方法
JPH10260310A (ja) カラーフィルター用着色組成物
JP7095803B2 (ja) 樹脂組成物、配線基板及び導電性パターンの製造方法
TWI797437B (zh) 附有導電層之基材及觸控面板
JPH11131013A (ja) カラーフィルタ保護膜用樹脂組成物およびこれを用いたカラーフィルタ保護膜並びにカラーフィルタ
JP2017185762A (ja) 転写フィルム、加飾材料、タッチパネルおよび加飾材料の製造方法
KR20230126967A (ko) 착색 경화성 수지 조성물, 이를 이용하여 제조된 컬러필터 및 표시장치
JPH07188383A (ja) エポキシ樹脂組成物およびこれを用いたカラーフィルタ保護膜用樹脂組成物
KR20240118460A (ko) 착색 감광성 수지 조성물, 컬러필터 및 화상표시장치
JPH04301603A (ja) カラーフィルタおよびその製造法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant