JPWO2021149410A1 - - Google Patents

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Publication number
JPWO2021149410A1
JPWO2021149410A1 JP2020570579A JP2020570579A JPWO2021149410A1 JP WO2021149410 A1 JPWO2021149410 A1 JP WO2021149410A1 JP 2020570579 A JP2020570579 A JP 2020570579A JP 2020570579 A JP2020570579 A JP 2020570579A JP WO2021149410 A1 JPWO2021149410 A1 JP WO2021149410A1
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JP
Japan
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JP2020570579A
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Japanese (ja)
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JPWO2021149410A5 (https=
JP7081696B2 (ja
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Materials For Photolithography (AREA)
  • Chimneys And Flues (AREA)
  • Electroluminescent Light Sources (AREA)
JP2020570579A 2020-01-21 2020-12-16 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置 Active JP7081696B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020007333 2020-01-21
JP2020007333 2020-01-21
PCT/JP2020/046911 WO2021149410A1 (ja) 2020-01-21 2020-12-16 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置

Publications (3)

Publication Number Publication Date
JPWO2021149410A1 true JPWO2021149410A1 (https=) 2021-07-29
JPWO2021149410A5 JPWO2021149410A5 (https=) 2022-02-22
JP7081696B2 JP7081696B2 (ja) 2022-06-07

Family

ID=76992186

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020570579A Active JP7081696B2 (ja) 2020-01-21 2020-12-16 ポジ型感光性樹脂組成物、硬化膜、積層体、導電パターン付き基板、積層体の製造方法、タッチパネル及び有機ｅｌ表示装置

Country Status (5)

Country Link
JP (1) JP7081696B2 (https=)
KR (1) KR102624811B1 (https=)
CN (1) CN114945867B (https=)
TW (1) TWI826761B (https=)
WO (1) WO2021149410A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024135082A1 (ja) * 2022-12-20 2024-06-27 東レ株式会社 配線基板、遮光層形成用ポジ型感光性樹脂組成物、遮光層転写フィルムおよび配線基板の製造方法
KR20240120338A (ko) * 2023-01-31 2024-08-07 엘지디스플레이 주식회사 표시 장치

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JP2008185692A (ja) * 2007-01-29 2008-08-14 Adeka Corp ポジ型感光性樹脂組成物
WO2016158863A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 感光性着色樹脂組成物
WO2018180548A1 (ja) * 2017-03-29 2018-10-04 東レ株式会社 感光性組成物、硬化膜および有機ｅｌ表示装置
WO2019059359A1 (ja) * 2017-09-25 2019-03-28 東レ株式会社 着色樹脂組成物、着色膜、カラーフィルターおよび液晶表示装置

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JP5181968B2 (ja) * 2007-09-28 2013-04-10 東レ株式会社 ポジ型感光性組成物、硬化膜の製造方法、硬化膜、および硬化膜を有する素子
JP5233526B2 (ja) * 2008-09-05 2013-07-10 東レ株式会社 感光性組成物、それから形成された硬化膜、および硬化膜を有する素子
JP5441542B2 (ja) * 2009-07-22 2014-03-12 富士フイルム株式会社 ポジ型感光性樹脂組成物、硬化膜、層間絶縁膜、有機ｅｌ表示装置、及び液晶表示装置
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JP6826325B2 (ja) * 2016-03-15 2021-02-03 東レ株式会社 感光性樹脂組成物、硬化膜、積層体、タッチパネル用部材及び硬化膜の製造方法
KR101979980B1 (ko) * 2016-03-23 2019-05-17 동우 화인켐 주식회사 감광성 수지 조성물
CN109563353B (zh) * 2016-07-27 2022-01-14 东丽株式会社 树脂组合物
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KR102382227B1 (ko) * 2017-09-28 2022-04-04 후지필름 가부시키가이샤 감광성 착색 조성물, 경화막, 패턴의 형성 방법, 컬러 필터, 고체 촬상 소자 및 화상 표시 장치
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JP2019185034A (ja) * 2018-03-30 2019-10-24 Jsr株式会社 着色組成物、着色硬化膜、カラーフィルタ、表示素子、受光素子及び発光素子

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Publication number Priority date Publication date Assignee Title
JP2008185692A (ja) * 2007-01-29 2008-08-14 Adeka Corp ポジ型感光性樹脂組成物
WO2016158863A1 (ja) * 2015-04-01 2016-10-06 東レ株式会社 感光性着色樹脂組成物
WO2018180548A1 (ja) * 2017-03-29 2018-10-04 東レ株式会社 感光性組成物、硬化膜および有機ｅｌ表示装置
WO2019059359A1 (ja) * 2017-09-25 2019-03-28 東レ株式会社 着色樹脂組成物、着色膜、カラーフィルターおよび液晶表示装置

Also Published As

Publication number Publication date
JP7081696B2 (ja) 2022-06-07
TWI826761B (zh) 2023-12-21
TW202132922A (zh) 2021-09-01
CN114945867A (zh) 2022-08-26
KR102624811B1 (ko) 2024-01-16
CN114945867B (zh) 2023-05-16
WO2021149410A1 (ja) 2021-07-29
KR20220131512A (ko) 2022-09-28

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