CN1148268A - 芯片焊接装置 - Google Patents

芯片焊接装置 Download PDF

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Publication number
CN1148268A
CN1148268A CN96111548A CN96111548A CN1148268A CN 1148268 A CN1148268 A CN 1148268A CN 96111548 A CN96111548 A CN 96111548A CN 96111548 A CN96111548 A CN 96111548A CN 1148268 A CN1148268 A CN 1148268A
Authority
CN
China
Prior art keywords
collet
semiconductor chip
bonding
wafer
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN96111548A
Other languages
English (en)
Chinese (zh)
Inventor
南秀根
金国焕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanwha Aerospace Co Ltd
Original Assignee
Samsung Aerospace Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1019950030325A external-priority patent/KR0161436B1/ko
Priority claimed from KR1019960028611A external-priority patent/KR100195157B1/ko
Application filed by Samsung Aerospace Industries Ltd filed Critical Samsung Aerospace Industries Ltd
Publication of CN1148268A publication Critical patent/CN1148268A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53187—Multiple station assembly apparatus
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN96111548A 1995-09-16 1996-09-16 芯片焊接装置 Pending CN1148268A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1019950030325A KR0161436B1 (ko) 1995-09-16 1995-09-16 다이 본딩 장치
KR30325/95 1995-09-16
KR1019960028611A KR100195157B1 (ko) 1996-07-15 1996-07-15 자동 콜렛 교환기
KR28611/96 1996-07-15

Publications (1)

Publication Number Publication Date
CN1148268A true CN1148268A (zh) 1997-04-23

Family

ID=26631270

Family Applications (1)

Application Number Title Priority Date Filing Date
CN96111548A Pending CN1148268A (zh) 1995-09-16 1996-09-16 芯片焊接装置

Country Status (4)

Country Link
US (1) US5799858A (enExample)
JP (1) JPH09186180A (enExample)
CN (1) CN1148268A (enExample)
TW (1) TW309642B (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103531505A (zh) * 2013-10-12 2014-01-22 四川蓝彩电子科技有限公司 晶片装配系统
CN103681401A (zh) * 2013-10-25 2014-03-26 深圳市恒睿智达科技有限公司 固晶机检测机构及连续检测方法
CN115156774A (zh) * 2022-08-09 2022-10-11 德龙信息技术（苏州）有限公司 一种rfid多芯片同步焊接的复合运动吸焊臂及其同步焊接方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3402988B2 (ja) * 1997-01-31 2003-05-06 三洋電機株式会社 電子部品装着装置の上下動カム機構
JP3298810B2 (ja) * 1997-07-09 2002-07-08 株式会社新川 ダイボンディング装置
KR100481527B1 (ko) * 1998-04-02 2005-06-08 삼성전자주식회사 다이 본딩 장치
US6820792B2 (en) * 1998-09-30 2004-11-23 Samsung Electronics Co., Ltd. Die bonding equipment
US8196798B2 (en) 2010-10-08 2012-06-12 Kulicke And Soffa Industries, Inc. Solar substrate ribbon bonding system
CH705802B1 (de) * 2011-11-25 2016-04-15 Esec Ag Einrichtung für die Montage von Halbleiterchips.
KR101248313B1 (ko) * 2012-06-29 2013-03-27 세메스 주식회사 헤드 교체 장치 및 이를 포함하는 다이 본딩 시스템
KR101350550B1 (ko) * 2012-10-30 2014-01-10 세메스 주식회사 콜릿 제거 방법
KR101340831B1 (ko) * 2012-10-30 2013-12-11 세메스 주식회사 콜릿 교체 장치
KR102247033B1 (ko) * 2014-04-16 2021-05-03 삼성전자주식회사 다이 본딩 장치
CN107134422A (zh) * 2016-02-29 2017-09-05 上海微电子装备（集团）股份有限公司 芯片键合装置及方法
IT201600105300A1 (it) * 2016-10-19 2018-04-19 Manz Italy Srl Metodo e apparato di lavorazione
WO2018157937A1 (de) * 2017-03-02 2018-09-07 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zum bonden von chips
US10867822B1 (en) 2019-07-26 2020-12-15 Yaskawa America, Inc. Wafer pre-alignment apparatus and method

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4010885A (en) * 1974-09-30 1977-03-08 The Jade Corporation Apparatus for accurately bonding leads to a semi-conductor die or the like
US4797994A (en) * 1986-04-22 1989-01-17 Kulicke & Soffa Industries, Inc. Apparatus for and methods of die bonding
JPH0250440A (ja) * 1988-08-12 1990-02-20 Mitsubishi Electric Corp ダイボンド装置
US4935803A (en) * 1988-09-09 1990-06-19 Motorola, Inc. Self-centering electrode for power devices

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103531505A (zh) * 2013-10-12 2014-01-22 四川蓝彩电子科技有限公司 晶片装配系统
CN103531505B (zh) * 2013-10-12 2015-12-30 四川蓝彩电子科技有限公司 晶片装配系统
CN103681401A (zh) * 2013-10-25 2014-03-26 深圳市恒睿智达科技有限公司 固晶机检测机构及连续检测方法
CN115156774A (zh) * 2022-08-09 2022-10-11 德龙信息技术（苏州）有限公司 一种rfid多芯片同步焊接的复合运动吸焊臂及其同步焊接方法

Also Published As

Publication number Publication date
US5799858A (en) 1998-09-01
TW309642B (enExample) 1997-07-01
JPH09186180A (ja) 1997-07-15

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WD01 Invention patent application deemed withdrawn after publication