CN114730144A - 抗蚀图案间的置换液、以及使用其的抗蚀图案的制造方法 - Google Patents

抗蚀图案间的置换液、以及使用其的抗蚀图案的制造方法 Download PDF

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Publication number
CN114730144A
CN114730144A CN202080079209.5A CN202080079209A CN114730144A CN 114730144 A CN114730144 A CN 114730144A CN 202080079209 A CN202080079209 A CN 202080079209A CN 114730144 A CN114730144 A CN 114730144A
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CN
China
Prior art keywords
resist
resist pattern
replacement liquid
resist patterns
mass
Prior art date
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Pending
Application number
CN202080079209.5A
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English (en)
Chinese (zh)
Inventor
山本和磨
绢田贵史
长原达郎
石井牧
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Merck Patent GmbH
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Merck Patent GmbH
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Publication date
Application filed by Merck Patent GmbH filed Critical Merck Patent GmbH
Publication of CN114730144A publication Critical patent/CN114730144A/zh
Pending legal-status Critical Current

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/42Stripping or agents therefor
    • G03F7/422Stripping or agents therefor using liquids only
    • G03F7/425Stripping or agents therefor using liquids only containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN202080079209.5A 2019-11-18 2020-11-16 抗蚀图案间的置换液、以及使用其的抗蚀图案的制造方法 Pending CN114730144A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-207844 2019-11-18
JP2019207844A JP2021081545A (ja) 2019-11-18 2019-11-18 レジストパターン間置換液、およびそれを用いたレジストパターンの製造方法
PCT/EP2020/082179 WO2021099235A1 (en) 2019-11-18 2020-11-16 Replacement liquid of liquid filling between resist patterns, and method for producing resist patterns using the same

Publications (1)

Publication Number Publication Date
CN114730144A true CN114730144A (zh) 2022-07-08

Family

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Family Applications (1)

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CN202080079209.5A Pending CN114730144A (zh) 2019-11-18 2020-11-16 抗蚀图案间的置换液、以及使用其的抗蚀图案的制造方法

Country Status (7)

Country Link
US (1) US20230045307A1 (https=)
EP (1) EP4062235A1 (https=)
JP (3) JP2021081545A (https=)
KR (2) KR20260028049A (https=)
CN (1) CN114730144A (https=)
TW (2) TWI887299B (https=)
WO (1) WO2021099235A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022175281A (ja) 2021-05-13 2022-11-25 トヨタ自動車株式会社 提案システムおよび提案方法
WO2024141355A1 (en) * 2022-12-26 2024-07-04 Merck Patent Gmbh Electronic device manufacturing aqueous solution, method for manufacturing resist pattern and method for manufacturing device
EP4649359A1 (en) * 2023-01-13 2025-11-19 Merck Patent GmbH Electronic device manufacturing aqueous solution, method for manufacturing resist pattern and method for manufacturing device
KR20240170272A (ko) * 2023-05-26 2024-12-03 삼성에스디아이 주식회사 금속 함유 포토레지스트 현상액 조성물, 및 이를 이용한 현상 단계를 포함하는 패턴 형성 방법
TW202538046A (zh) * 2023-10-25 2025-10-01 德商默克專利有限公司 電子機器製造水溶液、光阻圖案之製造方法及裝置之製造方法
WO2026046920A1 (en) 2024-08-28 2026-03-05 Merck Patent Gmbh Electronic device manufacturing aqueous solution, method for producing resist pattern, and method for manufacturing device
WO2026046961A1 (en) 2024-08-28 2026-03-05 Merck Patent Gmbh Electronic device manufacturing aqueous solution, method for producing resist pattern, and method for manufacturing device

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CN1947065A (zh) * 2004-04-23 2007-04-11 东京应化工业株式会社 抗蚀图案的形成方法及复合冲洗液
CN101010640A (zh) * 2004-09-01 2007-08-01 东京应化工业株式会社 光蚀刻用显影液组合物与抗蚀图案的形成方法
US20130280913A1 (en) * 2010-12-09 2013-10-24 Nissan Chemical Industries, Ltd. Composition for forming a resist underlayer film including hydroxyl group-containing carbazole novolac resin

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JP4493393B2 (ja) * 2004-04-23 2010-06-30 東京応化工業株式会社 リソグラフィー用リンス液
WO2007080726A1 (ja) * 2006-01-11 2007-07-19 Tokyo Ohka Kogyo Co., Ltd. リソグラフィー用洗浄剤及びそれを用いたレジストパターン形成方法
US20100028803A1 (en) * 2008-08-01 2010-02-04 Fujifilm Corporation Surface treating agent for resist pattern formation, resist composition, method of treating surface of resist pattern therewith and method of forming resist pattern
JP5624753B2 (ja) * 2009-03-31 2014-11-12 東京応化工業株式会社 リソグラフィー用洗浄液及びこれを用いたレジストパターンの形成方法
JP5705607B2 (ja) * 2011-03-23 2015-04-22 メルクパフォーマンスマテリアルズIp合同会社 リソグラフィー用リンス液およびそれを用いたパターン形成方法
EP3208659A1 (en) 2014-10-14 2017-08-23 AZ Electronic Materials (Luxembourg) S.à.r.l. Composition for resist patterning and method for forming pattern using same
JP6455397B2 (ja) * 2014-11-27 2019-01-23 信越化学工業株式会社 パターン形成用リンス溶液及びパターン形成方法
JP6428568B2 (ja) * 2014-11-27 2018-11-28 信越化学工業株式会社 パターン形成用リンス溶液及びパターン形成方法
JP6646073B2 (ja) * 2016-01-22 2020-02-14 富士フイルム株式会社 処理液
TWI717526B (zh) * 2016-06-20 2021-02-01 盧森堡商Az電子材料盧森堡有限公司 清洗組成物、形成光阻圖案之方法及製造半導體裝置之方法
JP6759174B2 (ja) * 2016-11-07 2020-09-23 富士フイルム株式会社 処理液及びパターン形成方法
CN110023841B (zh) 2016-11-25 2023-05-30 默克专利有限公司 光刻组合物、形成抗蚀图案的方法和制造半导体器件的方法
JP2018127513A (ja) * 2017-02-06 2018-08-16 メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH 半導体水溶性組成物、およびその使用

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CN1947065A (zh) * 2004-04-23 2007-04-11 东京应化工业株式会社 抗蚀图案的形成方法及复合冲洗液
US20050284502A1 (en) * 2004-06-25 2005-12-29 Shin-Etsu Chemical Co., Ltd. Rinse and resist patterning process using the same
CN101010640A (zh) * 2004-09-01 2007-08-01 东京应化工业株式会社 光蚀刻用显影液组合物与抗蚀图案的形成方法
US20130280913A1 (en) * 2010-12-09 2013-10-24 Nissan Chemical Industries, Ltd. Composition for forming a resist underlayer film including hydroxyl group-containing carbazole novolac resin

Also Published As

Publication number Publication date
JP2021081545A (ja) 2021-05-27
TW202600801A (zh) 2026-01-01
US20230045307A1 (en) 2023-02-09
KR102917530B1 (ko) 2026-01-23
WO2021099235A1 (en) 2021-05-27
JP7732976B2 (ja) 2025-09-02
KR20220104768A (ko) 2022-07-26
TW202124692A (zh) 2021-07-01
KR20260028049A (ko) 2026-03-03
TWI887299B (zh) 2025-06-21
JP2025114656A (ja) 2025-08-05
EP4062235A1 (en) 2022-09-28
JP2023502837A (ja) 2023-01-26

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