CN114683673B - 剥离机构及使用该剥离机构的层叠装置 - Google Patents

剥离机构及使用该剥离机构的层叠装置 Download PDF

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Publication number
CN114683673B
CN114683673B CN202111344872.6A CN202111344872A CN114683673B CN 114683673 B CN114683673 B CN 114683673B CN 202111344872 A CN202111344872 A CN 202111344872A CN 114683673 B CN114683673 B CN 114683673B
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China
Prior art keywords
peeling
sheet
film
stage
head
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CN202111344872.6A
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Chinese (zh)
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CN114683673A (zh
Inventor
牧野由
泽田智世
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Nikkiso Co Ltd
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Nikkiso Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202111344872.6A 2020-12-28 2021-11-15 剥离机构及使用该剥离机构的层叠装置 Active CN114683673B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020218719A JP7558058B2 (ja) 2020-12-28 2020-12-28 剥離機構及びこれを用いた積層装置
JP2020-218719 2020-12-28

Publications (2)

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CN114683673A CN114683673A (zh) 2022-07-01
CN114683673B true CN114683673B (zh) 2024-09-03

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ID=82135882

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CN202111344872.6A Active CN114683673B (zh) 2020-12-28 2021-11-15 剥离机构及使用该剥离机构的层叠装置

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JP (1) JP7558058B2 (https=)
CN (1) CN114683673B (https=)
TW (1) TWI807484B (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024214641A1 (ja) * 2023-04-12 2024-10-17 テイコクテーピングシステム株式会社 マウンター装置、テープ剥離装置、基板転写装置、テープ剥離方法、及び基板転写方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103079797A (zh) * 2010-08-20 2013-05-01 日合墨东株式会社 层叠装置
JP2014088255A (ja) * 2012-10-31 2014-05-15 Hitachi Plant Mechanics Co Ltd フィルム剥離方法及びそのためのフィルム剥離装置
CN110364417A (zh) * 2018-04-11 2019-10-22 日东电工株式会社 粘合带剥离方法和粘合带剥离装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08244019A (ja) * 1995-03-13 1996-09-24 Taiyo Yuden Co Ltd セラミックグリーンシートの積層方法
JP5060402B2 (ja) * 2008-06-18 2012-10-31 クライムプロダクツ株式会社 保護フィルムの剥離装置
JP2010037009A (ja) * 2008-07-31 2010-02-18 Sharp Corp フィルム剥離装置
JP2011077098A (ja) * 2009-09-29 2011-04-14 Disco Abrasive Syst Ltd ダイボンダ装置
JP2011171530A (ja) * 2010-02-19 2011-09-01 Mitsubishi Electric Corp 保護テープの剥離方法および剥離装置、ならびに半導体装置の製造方法
WO2018173764A1 (ja) * 2017-03-21 2018-09-27 富士フイルム株式会社 積層デバイス、積層体および積層デバイスの製造方法
JP6916223B2 (ja) * 2019-01-30 2021-08-11 日機装株式会社 剥離装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103079797A (zh) * 2010-08-20 2013-05-01 日合墨东株式会社 层叠装置
JP2014088255A (ja) * 2012-10-31 2014-05-15 Hitachi Plant Mechanics Co Ltd フィルム剥離方法及びそのためのフィルム剥離装置
CN110364417A (zh) * 2018-04-11 2019-10-22 日东电工株式会社 粘合带剥离方法和粘合带剥离装置

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Publication number Publication date
JP2022103834A (ja) 2022-07-08
TW202226441A (zh) 2022-07-01
JP7558058B2 (ja) 2024-09-30
TWI807484B (zh) 2023-07-01
CN114683673A (zh) 2022-07-01

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