CN103079797A - 层叠装置 - Google Patents
层叠装置 Download PDFInfo
- Publication number
- CN103079797A CN103079797A CN2011800401834A CN201180040183A CN103079797A CN 103079797 A CN103079797 A CN 103079797A CN 2011800401834 A CN2011800401834 A CN 2011800401834A CN 201180040183 A CN201180040183 A CN 201180040183A CN 103079797 A CN103079797 A CN 103079797A
- Authority
- CN
- China
- Prior art keywords
- duplexer
- mentioned
- membranaceous resin
- interim
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
- B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/56—Compression moulding under special conditions, e.g. vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B39/00—Layout of apparatus or plants, e.g. modular laminating systems
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/12—Pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/65—Dust free, e.g. clean room
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/60—In a particular environment
- B32B2309/68—Vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
- B32B37/003—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality to avoid air inclusion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1311—Foil encapsulation, e.g. of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010185418A JP5334135B2 (ja) | 2010-08-20 | 2010-08-20 | 積層装置 |
JP2010-185418 | 2010-08-20 | ||
PCT/JP2011/066304 WO2012023373A1 (ja) | 2010-08-20 | 2011-07-19 | 積層装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103079797A true CN103079797A (zh) | 2013-05-01 |
CN103079797B CN103079797B (zh) | 2016-01-20 |
Family
ID=45605034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180040183.4A Active CN103079797B (zh) | 2010-08-20 | 2011-07-19 | 层叠装置 |
Country Status (9)
Country | Link |
---|---|
US (2) | US8899291B2 (zh) |
EP (1) | EP2607054B1 (zh) |
JP (1) | JP5334135B2 (zh) |
KR (1) | KR101303384B1 (zh) |
CN (1) | CN103079797B (zh) |
MY (1) | MY162680A (zh) |
SG (1) | SG187640A1 (zh) |
TW (1) | TWI460063B (zh) |
WO (1) | WO2012023373A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112004660A (zh) * | 2018-10-05 | 2020-11-27 | 福井县 | 薄层带自动层叠方法和装置 |
CN114193901A (zh) * | 2020-09-18 | 2022-03-18 | 日机装株式会社 | 真空层叠装置及层叠体的制造方法 |
CN114683673A (zh) * | 2020-12-28 | 2022-07-01 | 日机装株式会社 | 剥离机构及使用该剥离机构的层叠装置 |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5334135B2 (ja) * | 2010-08-20 | 2013-11-06 | ニチゴー・モートン株式会社 | 積層装置 |
JP5591859B2 (ja) * | 2012-03-23 | 2014-09-17 | 株式会社東芝 | 基板の分離方法及び分離装置 |
JP2014204034A (ja) * | 2013-04-08 | 2014-10-27 | 日東電工株式会社 | 封止シート貼付け方法および封止シート貼付け装置 |
TWI618131B (zh) * | 2013-08-30 | 2018-03-11 | 半導體能源研究所股份有限公司 | 剝離起點形成裝置及形成方法、疊層體製造裝置 |
JP2015097231A (ja) * | 2013-11-15 | 2015-05-21 | 日東電工株式会社 | 電子部品パッケージの製造方法 |
JP2015115346A (ja) * | 2013-12-09 | 2015-06-22 | 日東電工株式会社 | 封止シート貼付け方法 |
JP2015115347A (ja) * | 2013-12-09 | 2015-06-22 | 日東電工株式会社 | 封止シート貼付け方法 |
KR20160101962A (ko) * | 2013-12-26 | 2016-08-26 | 닛토덴코 가부시키가이샤 | 반도체 장치의 제조 방법 및 열경화성 수지 시트 |
WO2015098842A1 (ja) * | 2013-12-26 | 2015-07-02 | 日東電工株式会社 | 半導体装置の製造方法 |
JP2016023993A (ja) * | 2014-07-17 | 2016-02-08 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
JP2016023971A (ja) * | 2014-07-17 | 2016-02-08 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
US10153409B2 (en) * | 2014-10-24 | 2018-12-11 | Dow Silicones Corporation | Vacuum lamination method for forming a conformally coated article and associated conformally coated articles formed therefrom |
WO2016139687A1 (en) * | 2015-03-05 | 2016-09-09 | Automatic Lamination Technologies S.R.L. | Apparatus and method for making a photosensitive film adhere to a multilayer sheet in order to obtain a printed circuit board |
JP2016215532A (ja) * | 2015-05-22 | 2016-12-22 | ニッコー・マテリアルズ株式会社 | 積層装置および積層方法 |
CN105584186B (zh) * | 2016-03-08 | 2017-05-24 | 苏州永丰装饰材料有限公司 | 一种镀锌板复pvc膜的自动化生产线 |
JP6810584B2 (ja) | 2016-11-30 | 2021-01-06 | タツモ株式会社 | 貼合装置 |
US11014216B2 (en) * | 2017-10-27 | 2021-05-25 | Aida Engineering, Ltd. | Workpiece holding tool changing system for a workpiece conveying apparatus of a transfer press machine |
CN108860743A (zh) * | 2018-07-30 | 2018-11-23 | 深圳市强瑞电子有限公司 | 手机半自动贴膜设备及其操作方法 |
US11653484B2 (en) | 2019-11-08 | 2023-05-16 | Raytheon Company | Printed circuit board automated layup system |
US11606865B2 (en) | 2019-11-08 | 2023-03-14 | Raytheon Company | Method for forming channels in printed circuit boards by stacking slotted layers |
CN111993673B (zh) * | 2020-08-24 | 2022-05-06 | 广州智灵动技术有限公司 | 一种用于平面口罩机的耳线焊接设备 |
CN112776454B (zh) * | 2021-02-01 | 2023-01-10 | 中山市睿科智能电子有限公司 | 一种挠性覆铜板压合机 |
CN113427750B (zh) * | 2021-06-30 | 2023-02-03 | 德阳凯达门业有限公司 | 一种门板覆膜防擦伤存放架 |
KR102542148B1 (ko) * | 2021-12-17 | 2023-06-13 | 주식회사 정인플라스틱 | 프레스 성형장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0538796A (ja) * | 1991-08-05 | 1993-02-19 | Yoshimura Kikai:Kk | 真空ラミネート方法 |
CN1301994A (zh) * | 1999-08-25 | 2001-07-04 | 希普雷公司 | 传送带式真空施加器及将抗蚀干膜施加于一印刷线路板上的方法 |
JP2004058349A (ja) * | 2002-07-26 | 2004-02-26 | Meiki Co Ltd | 積層装置および積層方法 |
JP2004249639A (ja) * | 2003-02-21 | 2004-09-09 | Nichigo Morton Co Ltd | 真空積層装置及び積層方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62297136A (ja) * | 1986-06-17 | 1987-12-24 | Asahi Glass Co Ltd | 積層体の製造方法 |
US5078820A (en) * | 1988-03-25 | 1992-01-07 | Somar Corporation | Method and apparatus for pressure sticking a thin film to a base plate |
JP3098003B2 (ja) * | 1998-09-24 | 2000-10-10 | 日清紡績株式会社 | 太陽電池におけるラミネート装置 |
JP4107316B2 (ja) * | 2005-09-02 | 2008-06-25 | 株式会社日立プラントテクノロジー | 基板貼合装置 |
DE502006004008D1 (de) * | 2006-08-29 | 2009-07-30 | Buerkle Gmbh Robert | Presse und Verfahren zum Laminieren plattenförmiger Werkstücke mittels Druck und Wärme |
JP2009166487A (ja) * | 2007-12-18 | 2009-07-30 | Nichigo Morton Co Ltd | 平面プレス装置および積層装置ならびにそれらを用いた積層方法 |
JP4979611B2 (ja) * | 2008-02-18 | 2012-07-18 | 株式会社名機製作所 | 真空積層装置による積層成形方法 |
JP5334135B2 (ja) * | 2010-08-20 | 2013-11-06 | ニチゴー・モートン株式会社 | 積層装置 |
-
2010
- 2010-08-20 JP JP2010185418A patent/JP5334135B2/ja active Active
-
2011
- 2011-07-19 US US13/816,540 patent/US8899291B2/en active Active
- 2011-07-19 TW TW100125467A patent/TWI460063B/zh active
- 2011-07-19 KR KR1020137004183A patent/KR101303384B1/ko active IP Right Grant
- 2011-07-19 EP EP11818017.3A patent/EP2607054B1/en active Active
- 2011-07-19 MY MYPI2013700206A patent/MY162680A/en unknown
- 2011-07-19 WO PCT/JP2011/066304 patent/WO2012023373A1/ja active Application Filing
- 2011-07-19 SG SG2013007182A patent/SG187640A1/en unknown
- 2011-07-19 CN CN201180040183.4A patent/CN103079797B/zh active Active
-
2014
- 2014-08-19 US US14/462,893 patent/US10081170B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0538796A (ja) * | 1991-08-05 | 1993-02-19 | Yoshimura Kikai:Kk | 真空ラミネート方法 |
CN1301994A (zh) * | 1999-08-25 | 2001-07-04 | 希普雷公司 | 传送带式真空施加器及将抗蚀干膜施加于一印刷线路板上的方法 |
JP2004058349A (ja) * | 2002-07-26 | 2004-02-26 | Meiki Co Ltd | 積層装置および積層方法 |
JP2004249639A (ja) * | 2003-02-21 | 2004-09-09 | Nichigo Morton Co Ltd | 真空積層装置及び積層方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112004660A (zh) * | 2018-10-05 | 2020-11-27 | 福井县 | 薄层带自动层叠方法和装置 |
CN112004660B (zh) * | 2018-10-05 | 2023-06-06 | 福井县 | 薄层带自动层叠方法和装置 |
CN114193901A (zh) * | 2020-09-18 | 2022-03-18 | 日机装株式会社 | 真空层叠装置及层叠体的制造方法 |
CN114683673A (zh) * | 2020-12-28 | 2022-07-01 | 日机装株式会社 | 剥离机构及使用该剥离机构的层叠装置 |
Also Published As
Publication number | Publication date |
---|---|
MY162680A (en) | 2017-06-30 |
KR20130032399A (ko) | 2013-04-01 |
JP5334135B2 (ja) | 2013-11-06 |
EP2607054A1 (en) | 2013-06-26 |
EP2607054B1 (en) | 2016-03-30 |
TW201210813A (en) | 2012-03-16 |
US20130133836A1 (en) | 2013-05-30 |
EP2607054A4 (en) | 2014-07-02 |
JP2012040812A (ja) | 2012-03-01 |
US8899291B2 (en) | 2014-12-02 |
US10081170B2 (en) | 2018-09-25 |
TWI460063B (zh) | 2014-11-11 |
US20150027640A1 (en) | 2015-01-29 |
WO2012023373A1 (ja) | 2012-02-23 |
CN103079797B (zh) | 2016-01-20 |
KR101303384B1 (ko) | 2013-09-03 |
SG187640A1 (en) | 2013-03-28 |
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C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan, Japan Applicant after: Nichigo Morton Co., Ltd. Applicant after: Shin-Etsu Chemical Industry Co., Ltd. Address before: Osaka Japan Applicant before: Nichigo Morton Co., Ltd. Applicant before: Shin-Etsu Chemical Industry Co., Ltd. |
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C53 | Correction of patent of invention or patent application | ||
CB02 | Change of applicant information |
Address after: Tokyo, Japan, Japan Applicant after: Nikko Material Co., Ltd. Applicant after: Shin-Etsu Chemical Industry Co., Ltd. Address before: Tokyo, Japan, Japan Applicant before: Nichigo Morton Co., Ltd. Applicant before: Shin-Etsu Chemical Industry Co., Ltd. |
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COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: NICHIGO MORTON CO., LTD. TO: NIKKO MATERIAL CO., LTD. Free format text: CORRECT: ADDRESS; FROM: |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant |