CN114286832A - 电子器件用光固化性树脂组合物 - Google Patents

电子器件用光固化性树脂组合物 Download PDF

Info

Publication number
CN114286832A
CN114286832A CN201980096299.6A CN201980096299A CN114286832A CN 114286832 A CN114286832 A CN 114286832A CN 201980096299 A CN201980096299 A CN 201980096299A CN 114286832 A CN114286832 A CN 114286832A
Authority
CN
China
Prior art keywords
group
compound represented
compound
formula
polymerizable compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980096299.6A
Other languages
English (en)
Chinese (zh)
Inventor
山本拓也
增井良平
笹野美香
金千鹤
西海由季
七里德重
下岛健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of CN114286832A publication Critical patent/CN114286832A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Emergency Medicine (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Polyethers (AREA)
CN201980096299.6A 2019-09-26 2019-09-26 电子器件用光固化性树脂组合物 Pending CN114286832A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/037769 WO2021059420A1 (ja) 2019-09-26 2019-09-26 電子デバイス用光硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
CN114286832A true CN114286832A (zh) 2022-04-05

Family

ID=75165643

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980096299.6A Pending CN114286832A (zh) 2019-09-26 2019-09-26 电子器件用光固化性树脂组合物

Country Status (3)

Country Link
KR (1) KR20220068953A (ko)
CN (1) CN114286832A (ko)
WO (1) WO2021059420A1 (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012020688A1 (ja) * 2010-08-12 2012-02-16 ダイセル化学工業株式会社 低透湿性樹脂組成物及びその硬化物
JP2015172132A (ja) * 2014-03-11 2015-10-01 東洋インキＳｃホールディングス株式会社 活性エネルギー線重合性樹脂組成物及び積層体
CN109071776A (zh) * 2016-03-23 2018-12-21 Jxtg能源株式会社 固化性组合物以及使其固化而成的固化物
WO2019117298A1 (ja) * 2017-12-15 2019-06-20 積水化学工業株式会社 電子デバイス用封止剤及び有機ｅｌ表示素子用封止剤

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3543409B2 (ja) 1995-03-24 2004-07-14 大日本インキ化学工業株式会社 活性エネルギ−線硬化型エポキシアクリレ−ト樹脂組成物
JP5526511B2 (ja) * 2008-09-04 2014-06-18 Ｄｉｃ株式会社 エポキシ樹脂組成物、その硬化物、硬化物の製造方法、光半導体封止用樹脂組成物、及び光半導体装置
JP6057600B2 (ja) 2012-08-09 2017-01-11 日東電工株式会社 粘着剤、粘着剤層、および粘着シート
JP6545968B2 (ja) * 2015-01-29 2019-07-17 岡本化学工業株式会社 レジンアクセサリー用の感光性樹脂組成物及びこれを用いたレジンアクセサリー
JP6696117B2 (ja) * 2015-04-28 2020-05-20 東洋インキＳｃホールディングス株式会社 活性エネルギー線硬化性樹脂組成物。
JP6616201B2 (ja) * 2016-01-27 2019-12-04 京セラ株式会社 半導体接着用樹脂組成物及び半導体装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012020688A1 (ja) * 2010-08-12 2012-02-16 ダイセル化学工業株式会社 低透湿性樹脂組成物及びその硬化物
JP2015172132A (ja) * 2014-03-11 2015-10-01 東洋インキＳｃホールディングス株式会社 活性エネルギー線重合性樹脂組成物及び積層体
CN109071776A (zh) * 2016-03-23 2018-12-21 Jxtg能源株式会社 固化性组合物以及使其固化而成的固化物
WO2019117298A1 (ja) * 2017-12-15 2019-06-20 積水化学工業株式会社 電子デバイス用封止剤及び有機ｅｌ表示素子用封止剤

Also Published As

Publication number Publication date
WO2021059420A1 (ja) 2021-04-01
KR20220068953A (ko) 2022-05-26

Similar Documents

Publication Publication Date Title
CN107109190B (zh) 电子器件用密封剂及电子器件的制造方法
JP7227016B2 (ja) 電子デバイス用光硬化性樹脂組成物
CN111567143B (zh) 电子设备用密封剂及有机el显示元件用密封剂
JP2023181439A (ja) 電子デバイス用光硬化性樹脂組成物
CN111837457A (zh) 有机el显示元件用密封剂
CN113811558A (zh) 电子器件用光固化性树脂组合物
WO2021085241A1 (ja) 電子デバイス用光硬化性樹脂組成物
JP2022172071A (ja) 電子デバイス用封止剤
CN113166306B (zh) 固化性树脂组合物、固化物及有机el显示元件
CN114286832A (zh) 电子器件用光固化性树脂组合物
CN112912407A (zh) 固化性树脂组合物、固化物及有机el显示元件
TWI833812B (zh) 電子裝置用光硬化性樹脂組成物
CN114365303A (zh) 有机el显示元件用密封剂套件及有机el显示元件
WO2023112982A1 (ja) 電子デバイス用硬化性樹脂組成物
WO2024010059A1 (ja) 硬化性樹脂組成物及び有機ｅｌ表示素子用封止剤
WO2022168707A1 (ja) 電子デバイス用光硬化性樹脂組成物
CN111937493A (zh) 有机el显示元件用密封剂和顶部发射型有机el显示元件
CN112955488A (zh) 固化性树脂组合物、固化物及有机el显示元件
CN111972046A (zh) 有机el显示元件用密封剂

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination