CN114208405B - 具有lc谐振电路的多层配线基板以及利用具有lc谐振电路的多层配线基板的电子元件封装 - Google Patents

具有lc谐振电路的多层配线基板以及利用具有lc谐振电路的多层配线基板的电子元件封装 Download PDF

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Publication number
CN114208405B
CN114208405B CN202080044339.5A CN202080044339A CN114208405B CN 114208405 B CN114208405 B CN 114208405B CN 202080044339 A CN202080044339 A CN 202080044339A CN 114208405 B CN114208405 B CN 114208405B
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CN
China
Prior art keywords
conductive layer
resonant circuit
multilayer wiring
layer
wiring substrate
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CN202080044339.5A
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English (en)
Chinese (zh)
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CN114208405A (zh
Inventor
狩野典子
马庭进
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Toppan Inc
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Toppan Printing Co Ltd
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Publication of CN114208405A publication Critical patent/CN114208405A/zh
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/075—Ladder networks, e.g. electric wave filters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0078—Constructional details comprising spiral inductor on a substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/175—Series LC in series path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1758—Series LC in shunt or branch path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1766—Parallel LC in series path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1775—Parallel LC in shunt or branch path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1783—Combined LC in series path
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/17—Structural details of sub-circuits of frequency selective networks
    • H03H7/1741—Comprising typical LC combinations, irrespective of presence and location of additional resistors
    • H03H7/1791—Combined LC in shunt or branch path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202080044339.5A 2019-06-18 2020-06-09 具有lc谐振电路的多层配线基板以及利用具有lc谐振电路的多层配线基板的电子元件封装 Active CN114208405B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019112890 2019-06-18
JP2019-112890 2019-06-18
PCT/JP2020/022662 WO2020255791A1 (ja) 2019-06-18 2020-06-09 Ｌｃ共振回路を有する多層配線基板、およびｌｃ共振回路を有する多層配線基板を用いた電子部品パッケージ

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Publication Number Publication Date
CN114208405A CN114208405A (zh) 2022-03-18
CN114208405B true CN114208405B (zh) 2024-11-08

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US (1) US12101074B2 (https=)
EP (1) EP3989440A4 (https=)
JP (1) JP7609067B2 (https=)
CN (1) CN114208405B (https=)
WO (1) WO2020255791A1 (https=)

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Publication number Priority date Publication date Assignee Title
WO2024116490A1 (ja) * 2022-11-29 2024-06-06 株式会社村田製作所 電子部品
US20250096039A1 (en) * 2023-09-18 2025-03-20 Nxp Usa, Inc. Semiconductor wafer fabrication with exposure defined graphene features
CN121239168B (zh) * 2025-12-03 2026-03-24 电子科技大学 三维多层氮化铝与聚酰亚胺叠层的ipd小型化带通滤波器

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108476014A (zh) * 2015-12-28 2018-08-31 高通股份有限公司 使用与3d贯穿玻璃通孔滤波器集成的2d无源玻璃滤波器的多路复用器设计
JP2019083282A (ja) * 2017-10-31 2019-05-30 大日本印刷株式会社 貫通電極基板及び実装基板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08250962A (ja) * 1995-03-10 1996-09-27 Tdk Corp Ｌｃフィルタ
JP2005183646A (ja) * 2003-12-19 2005-07-07 Nec Corp 多層基板インダクタおよびその製造方法
JP2007142109A (ja) 2005-11-17 2007-06-07 Tdk Corp 電子部品
WO2009142068A1 (ja) * 2008-05-22 2009-11-26 株式会社村田製作所 無線ｉｃデバイス及びその製造方法
JP6857329B2 (ja) * 2016-10-24 2021-04-14 大日本印刷株式会社 高周波部品及びその製造方法
JP7080579B2 (ja) * 2016-12-02 2022-06-06 凸版印刷株式会社 電子部品製造方法
JP6845606B2 (ja) 2016-12-20 2021-03-17 ダイハツ工業株式会社 穴明け装置
JP6946745B2 (ja) * 2017-05-25 2021-10-06 凸版印刷株式会社 ガラス回路基板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108476014A (zh) * 2015-12-28 2018-08-31 高通股份有限公司 使用与3d贯穿玻璃通孔滤波器集成的2d无源玻璃滤波器的多路复用器设计
JP2019083282A (ja) * 2017-10-31 2019-05-30 大日本印刷株式会社 貫通電極基板及び実装基板

Also Published As

Publication number Publication date
JPWO2020255791A1 (https=) 2020-12-24
US20220109416A1 (en) 2022-04-07
WO2020255791A1 (ja) 2020-12-24
US12101074B2 (en) 2024-09-24
EP3989440A1 (en) 2022-04-27
EP3989440A4 (en) 2022-08-10
CN114208405A (zh) 2022-03-18
JP7609067B2 (ja) 2025-01-07

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