CN114026681A - 晶片载置台 - Google Patents

晶片载置台 Download PDF

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Publication number
CN114026681A
CN114026681A CN202080047772.4A CN202080047772A CN114026681A CN 114026681 A CN114026681 A CN 114026681A CN 202080047772 A CN202080047772 A CN 202080047772A CN 114026681 A CN114026681 A CN 114026681A
Authority
CN
China
Prior art keywords
power supply
supply terminal
hole
electrostatic chuck
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202080047772.4A
Other languages
English (en)
Chinese (zh)
Inventor
相川贤一郎
竹林央史
久野达也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of CN114026681A publication Critical patent/CN114026681A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
CN202080047772.4A 2019-06-28 2020-06-10 晶片载置台 Pending CN114026681A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019121490 2019-06-28
JP2019-121490 2019-06-28
PCT/JP2020/022832 WO2020261992A1 (ja) 2019-06-28 2020-06-10 ウエハ載置台

Publications (1)

Publication Number Publication Date
CN114026681A true CN114026681A (zh) 2022-02-08

Family

ID=74061068

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080047772.4A Pending CN114026681A (zh) 2019-06-28 2020-06-10 晶片载置台

Country Status (5)

Country Link
US (1) US11948825B2 (https=)
JP (1) JP7214868B2 (https=)
KR (1) KR102632768B1 (https=)
CN (1) CN114026681A (https=)
WO (1) WO2020261992A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121241428A (zh) * 2023-06-07 2025-12-30 日本碍子株式会社 晶片载放台
WO2025079195A1 (ja) * 2023-10-12 2025-04-17 日本碍子株式会社 半導体製造装置用部材

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179127A (ja) * 2001-12-11 2003-06-27 Taiheiyo Cement Corp 静電チャック用給電端子
JP2006147834A (ja) * 2004-11-19 2006-06-08 Nec Schott Components Corp 気密端子およびそれを用いた薄型金属パッケージ
CN101043017A (zh) * 2006-03-24 2007-09-26 日本碍子株式会社 静电吸盘
JP4034145B2 (ja) * 2002-08-09 2008-01-16 住友大阪セメント株式会社 サセプタ装置
JP2008042137A (ja) * 2006-08-10 2008-02-21 Tokyo Electron Ltd 静電チャック装置
JP2008160097A (ja) * 2006-11-29 2008-07-10 Toto Ltd 静電チャック、静電チャックの製造方法および基板処理装置
CN103443914A (zh) * 2011-03-23 2013-12-11 住友大阪水泥股份有限公司 静电卡盘装置
CN105514014A (zh) * 2014-10-08 2016-04-20 日本特殊陶业株式会社 静电卡盘
JP2016143795A (ja) * 2015-02-03 2016-08-08 日本特殊陶業株式会社 静電チャック
JP2019054041A (ja) * 2017-09-13 2019-04-04 日本特殊陶業株式会社 保持装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297265A (ja) * 1994-04-26 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック
JP4346877B2 (ja) * 2002-08-29 2009-10-21 東京エレクトロン株式会社 静電吸着装置および処理装置
US20080062609A1 (en) * 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
JP5604888B2 (ja) * 2009-12-21 2014-10-15 住友大阪セメント株式会社 静電チャックの製造方法
JP6119430B2 (ja) * 2013-05-31 2017-04-26 住友大阪セメント株式会社 静電チャック装置
WO2015198942A1 (ja) * 2014-06-23 2015-12-30 日本特殊陶業株式会社 静電チャック
CN107004626B (zh) * 2014-11-20 2019-02-05 住友大阪水泥股份有限公司 静电卡盘装置
KR101950897B1 (ko) * 2015-09-25 2019-02-21 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
KR102858060B1 (ko) * 2016-01-12 2025-09-12 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치 및 정전 척 장치의 제조 방법
JP6493518B2 (ja) * 2016-01-19 2019-04-03 住友大阪セメント株式会社 静電チャック装置
KR102890947B1 (ko) * 2018-03-30 2025-11-25 스미토모 오사카 세멘토 가부시키가이샤 세라믹스 기체 및 서셉터

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179127A (ja) * 2001-12-11 2003-06-27 Taiheiyo Cement Corp 静電チャック用給電端子
JP4034145B2 (ja) * 2002-08-09 2008-01-16 住友大阪セメント株式会社 サセプタ装置
JP2006147834A (ja) * 2004-11-19 2006-06-08 Nec Schott Components Corp 気密端子およびそれを用いた薄型金属パッケージ
CN101043017A (zh) * 2006-03-24 2007-09-26 日本碍子株式会社 静电吸盘
JP2008042137A (ja) * 2006-08-10 2008-02-21 Tokyo Electron Ltd 静電チャック装置
JP2008160097A (ja) * 2006-11-29 2008-07-10 Toto Ltd 静電チャック、静電チャックの製造方法および基板処理装置
CN103443914A (zh) * 2011-03-23 2013-12-11 住友大阪水泥股份有限公司 静电卡盘装置
CN105514014A (zh) * 2014-10-08 2016-04-20 日本特殊陶业株式会社 静电卡盘
JP2016143795A (ja) * 2015-02-03 2016-08-08 日本特殊陶業株式会社 静電チャック
JP2019054041A (ja) * 2017-09-13 2019-04-04 日本特殊陶業株式会社 保持装置

Also Published As

Publication number Publication date
US11948825B2 (en) 2024-04-02
JPWO2020261992A1 (https=) 2020-12-30
KR102632768B1 (ko) 2024-02-01
KR20210141641A (ko) 2021-11-23
US20210398840A1 (en) 2021-12-23
WO2020261992A1 (ja) 2020-12-30
JP7214868B2 (ja) 2023-01-30

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SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20220208

RJ01 Rejection of invention patent application after publication