JPWO2020261992A1 - - Google Patents

Info

Publication number
JPWO2020261992A1
JPWO2020261992A1 JP2021528135A JP2021528135A JPWO2020261992A1 JP WO2020261992 A1 JPWO2020261992 A1 JP WO2020261992A1 JP 2021528135 A JP2021528135 A JP 2021528135A JP 2021528135 A JP2021528135 A JP 2021528135A JP WO2020261992 A1 JPWO2020261992 A1 JP WO2020261992A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021528135A
Other languages
Japanese (ja)
Other versions
JP7214868B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020261992A1 publication Critical patent/JPWO2020261992A1/ja
Application granted granted Critical
Publication of JP7214868B2 publication Critical patent/JP7214868B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2021528135A 2019-06-28 2020-06-10 ウエハ載置台 Active JP7214868B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019121490 2019-06-28
JP2019121490 2019-06-28
PCT/JP2020/022832 WO2020261992A1 (ja) 2019-06-28 2020-06-10 ウエハ載置台

Publications (2)

Publication Number Publication Date
JPWO2020261992A1 true JPWO2020261992A1 (https=) 2020-12-30
JP7214868B2 JP7214868B2 (ja) 2023-01-30

Family

ID=74061068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021528135A Active JP7214868B2 (ja) 2019-06-28 2020-06-10 ウエハ載置台

Country Status (5)

Country Link
US (1) US11948825B2 (https=)
JP (1) JP7214868B2 (https=)
KR (1) KR102632768B1 (https=)
CN (1) CN114026681A (https=)
WO (1) WO2020261992A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121241428A (zh) * 2023-06-07 2025-12-30 日本碍子株式会社 晶片载放台
WO2025079195A1 (ja) * 2023-10-12 2025-04-17 日本碍子株式会社 半導体製造装置用部材

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297265A (ja) * 1994-04-26 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック
JP2003179127A (ja) * 2001-12-11 2003-06-27 Taiheiyo Cement Corp 静電チャック用給電端子
JP2004095665A (ja) * 2002-08-29 2004-03-25 Tokyo Electron Ltd 静電吸着装置および処理装置

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4034145B2 (ja) * 2002-08-09 2008-01-16 住友大阪セメント株式会社 サセプタ装置
JP2006147834A (ja) * 2004-11-19 2006-06-08 Nec Schott Components Corp 気密端子およびそれを用いた薄型金属パッケージ
JP2007258615A (ja) * 2006-03-24 2007-10-04 Ngk Insulators Ltd 静電チャック
JP2008042137A (ja) * 2006-08-10 2008-02-21 Tokyo Electron Ltd 静電チャック装置
US20080062609A1 (en) * 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
JP2008160093A (ja) * 2006-11-29 2008-07-10 Toto Ltd 静電チャック、静電チャックの製造方法および基板処理装置
JP5604888B2 (ja) * 2009-12-21 2014-10-15 住友大阪セメント株式会社 静電チャックの製造方法
WO2012128348A1 (ja) * 2011-03-23 2012-09-27 住友大阪セメント株式会社 静電チャック装置
JP6119430B2 (ja) * 2013-05-31 2017-04-26 住友大阪セメント株式会社 静電チャック装置
WO2015198942A1 (ja) * 2014-06-23 2015-12-30 日本特殊陶業株式会社 静電チャック
JP6463938B2 (ja) * 2014-10-08 2019-02-06 日本特殊陶業株式会社 静電チャック
CN107004626B (zh) * 2014-11-20 2019-02-05 住友大阪水泥股份有限公司 静电卡盘装置
JP6475031B2 (ja) * 2015-02-03 2019-02-27 日本特殊陶業株式会社 静電チャック
KR101950897B1 (ko) * 2015-09-25 2019-02-21 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
KR102858060B1 (ko) * 2016-01-12 2025-09-12 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치 및 정전 척 장치의 제조 방법
JP6493518B2 (ja) * 2016-01-19 2019-04-03 住友大阪セメント株式会社 静電チャック装置
JP6955407B2 (ja) * 2017-09-13 2021-10-27 日本特殊陶業株式会社 保持装置
KR102890947B1 (ko) * 2018-03-30 2025-11-25 스미토모 오사카 세멘토 가부시키가이샤 세라믹스 기체 및 서셉터

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297265A (ja) * 1994-04-26 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック
JP2003179127A (ja) * 2001-12-11 2003-06-27 Taiheiyo Cement Corp 静電チャック用給電端子
JP2004095665A (ja) * 2002-08-29 2004-03-25 Tokyo Electron Ltd 静電吸着装置および処理装置

Also Published As

Publication number Publication date
CN114026681A (zh) 2022-02-08
US11948825B2 (en) 2024-04-02
KR102632768B1 (ko) 2024-02-01
KR20210141641A (ko) 2021-11-23
US20210398840A1 (en) 2021-12-23
WO2020261992A1 (ja) 2020-12-30
JP7214868B2 (ja) 2023-01-30

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