JP7214868B2 - ウエハ載置台 - Google Patents

ウエハ載置台 Download PDF

Info

Publication number
JP7214868B2
JP7214868B2 JP2021528135A JP2021528135A JP7214868B2 JP 7214868 B2 JP7214868 B2 JP 7214868B2 JP 2021528135 A JP2021528135 A JP 2021528135A JP 2021528135 A JP2021528135 A JP 2021528135A JP 7214868 B2 JP7214868 B2 JP 7214868B2
Authority
JP
Japan
Prior art keywords
power supply
supply terminal
wafer mounting
thin film
terminal hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2021528135A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2020261992A1 (https=
Inventor
賢一郎 相川
央史 竹林
達也 久野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2020261992A1 publication Critical patent/JPWO2020261992A1/ja
Application granted granted Critical
Publication of JP7214868B2 publication Critical patent/JP7214868B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
    • B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
JP2021528135A 2019-06-28 2020-06-10 ウエハ載置台 Active JP7214868B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019121490 2019-06-28
JP2019121490 2019-06-28
PCT/JP2020/022832 WO2020261992A1 (ja) 2019-06-28 2020-06-10 ウエハ載置台

Publications (2)

Publication Number Publication Date
JPWO2020261992A1 JPWO2020261992A1 (https=) 2020-12-30
JP7214868B2 true JP7214868B2 (ja) 2023-01-30

Family

ID=74061068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021528135A Active JP7214868B2 (ja) 2019-06-28 2020-06-10 ウエハ載置台

Country Status (5)

Country Link
US (1) US11948825B2 (https=)
JP (1) JP7214868B2 (https=)
KR (1) KR102632768B1 (https=)
CN (1) CN114026681A (https=)
WO (1) WO2020261992A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7719952B2 (ja) * 2023-06-07 2025-08-06 日本碍子株式会社 ウエハ載置台
WO2025079195A1 (ja) * 2023-10-12 2025-04-17 日本碍子株式会社 半導体製造装置用部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179127A (ja) 2001-12-11 2003-06-27 Taiheiyo Cement Corp 静電チャック用給電端子
JP2004095665A (ja) 2002-08-29 2004-03-25 Tokyo Electron Ltd 静電吸着装置および処理装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07297265A (ja) * 1994-04-26 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック
JP4034145B2 (ja) 2002-08-09 2008-01-16 住友大阪セメント株式会社 サセプタ装置
JP2006147834A (ja) * 2004-11-19 2006-06-08 Nec Schott Components Corp 気密端子およびそれを用いた薄型金属パッケージ
JP2007258615A (ja) 2006-03-24 2007-10-04 Ngk Insulators Ltd 静電チャック
US20080062609A1 (en) * 2006-08-10 2008-03-13 Shinji Himori Electrostatic chuck device
JP2008042137A (ja) * 2006-08-10 2008-02-21 Tokyo Electron Ltd 静電チャック装置
JP2008160093A (ja) * 2006-11-29 2008-07-10 Toto Ltd 静電チャック、静電チャックの製造方法および基板処理装置
JP5604888B2 (ja) * 2009-12-21 2014-10-15 住友大阪セメント株式会社 静電チャックの製造方法
US9330953B2 (en) * 2011-03-23 2016-05-03 Sumitomo Osaka Cement Co., Ltd. Electrostatic chuck device
JP6119430B2 (ja) * 2013-05-31 2017-04-26 住友大阪セメント株式会社 静電チャック装置
KR101994006B1 (ko) * 2014-06-23 2019-06-27 니혼도꾸슈도교 가부시키가이샤 정전 척
JP6463938B2 (ja) * 2014-10-08 2019-02-06 日本特殊陶業株式会社 静電チャック
KR102233925B1 (ko) * 2014-11-20 2021-03-30 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
JP6475031B2 (ja) * 2015-02-03 2019-02-27 日本特殊陶業株式会社 静電チャック
KR101950897B1 (ko) * 2015-09-25 2019-02-21 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치
KR102858060B1 (ko) * 2016-01-12 2025-09-12 스미토모 오사카 세멘토 가부시키가이샤 정전 척 장치 및 정전 척 장치의 제조 방법
CN108475658B (zh) * 2016-01-19 2023-12-22 住友大阪水泥股份有限公司 静电卡盘装置
JP6955407B2 (ja) * 2017-09-13 2021-10-27 日本特殊陶業株式会社 保持装置
KR102890947B1 (ko) * 2018-03-30 2025-11-25 스미토모 오사카 세멘토 가부시키가이샤 세라믹스 기체 및 서셉터

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003179127A (ja) 2001-12-11 2003-06-27 Taiheiyo Cement Corp 静電チャック用給電端子
JP2004095665A (ja) 2002-08-29 2004-03-25 Tokyo Electron Ltd 静電吸着装置および処理装置

Also Published As

Publication number Publication date
JPWO2020261992A1 (https=) 2020-12-30
US11948825B2 (en) 2024-04-02
KR20210141641A (ko) 2021-11-23
CN114026681A (zh) 2022-02-08
US20210398840A1 (en) 2021-12-23
WO2020261992A1 (ja) 2020-12-30
KR102632768B1 (ko) 2024-02-01

Similar Documents

Publication Publication Date Title
TWI653706B (zh) 靜電卡盤裝置
CN105074901B (zh) 静电吸盘
JP6380177B2 (ja) 静電チャック装置
JP6656153B2 (ja) より小さいウエハおよびウエハ片向けのウエハキャリア
JP7376594B2 (ja) シャフト付きセラミックヒータ
JP7430489B2 (ja) 静電チャック、静電チャック装置
JP7214867B2 (ja) 静電チャック
JP2014236047A (ja) 静電チャック装置
US20180108555A1 (en) Electrostatic chuck device
US20220259727A1 (en) Substrate heating device, substrate heating method, and method of manufacturing substrate heater
JP7214868B2 (ja) ウエハ載置台
CN114709158A (zh) 静电吸盘和基板固定装置
JP7300069B2 (ja) 接合体、保持装置、および、静電チャック
JP7700302B1 (ja) 保持装置
JP7717026B2 (ja) 保持装置及び静電チャック
JP7303302B2 (ja) シャフト付きセラミックヒータ
JP7604872B2 (ja) 静電チャック装置
JP7697548B1 (ja) 静電チャック
WO2020171179A1 (ja) 試料保持具
JP2020025072A (ja) 静電チャック
JPH11191534A (ja) ウエハ支持部材
JP2025184614A (ja) 静電チャック部材、および静電チャック装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210831

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220816

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220921

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230110

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230118

R150 Certificate of patent or registration of utility model

Ref document number: 7214868

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150