JPWO2020261992A1 - - Google Patents
Info
- Publication number
- JPWO2020261992A1 JPWO2020261992A1 JP2021528135A JP2021528135A JPWO2020261992A1 JP WO2020261992 A1 JPWO2020261992 A1 JP WO2020261992A1 JP 2021528135 A JP2021528135 A JP 2021528135A JP 2021528135 A JP2021528135 A JP 2021528135A JP WO2020261992 A1 JPWO2020261992 A1 JP WO2020261992A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/15—Devices for holding work using magnetic or electric force acting directly on the work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019121490 | 2019-06-28 | ||
JP2019121490 | 2019-06-28 | ||
PCT/JP2020/022832 WO2020261992A1 (ja) | 2019-06-28 | 2020-06-10 | ウエハ載置台 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2020261992A1 true JPWO2020261992A1 (ja) | 2020-12-30 |
JP7214868B2 JP7214868B2 (ja) | 2023-01-30 |
Family
ID=74061068
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021528135A Active JP7214868B2 (ja) | 2019-06-28 | 2020-06-10 | ウエハ載置台 |
Country Status (5)
Country | Link |
---|---|
US (1) | US11948825B2 (ja) |
JP (1) | JP7214868B2 (ja) |
KR (1) | KR102632768B1 (ja) |
CN (1) | CN114026681A (ja) |
WO (1) | WO2020261992A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297265A (ja) * | 1994-04-26 | 1995-11-10 | Shin Etsu Chem Co Ltd | 静電チャック |
JP2003179127A (ja) * | 2001-12-11 | 2003-06-27 | Taiheiyo Cement Corp | 静電チャック用給電端子 |
JP2004095665A (ja) * | 2002-08-29 | 2004-03-25 | Tokyo Electron Ltd | 静電吸着装置および処理装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4034145B2 (ja) | 2002-08-09 | 2008-01-16 | 住友大阪セメント株式会社 | サセプタ装置 |
JP2007258615A (ja) * | 2006-03-24 | 2007-10-04 | Ngk Insulators Ltd | 静電チャック |
US20080062609A1 (en) * | 2006-08-10 | 2008-03-13 | Shinji Himori | Electrostatic chuck device |
JP2008160093A (ja) | 2006-11-29 | 2008-07-10 | Toto Ltd | 静電チャック、静電チャックの製造方法および基板処理装置 |
JP5604888B2 (ja) * | 2009-12-21 | 2014-10-15 | 住友大阪セメント株式会社 | 静電チャックの製造方法 |
JP6119430B2 (ja) * | 2013-05-31 | 2017-04-26 | 住友大阪セメント株式会社 | 静電チャック装置 |
KR20190010748A (ko) * | 2014-06-23 | 2019-01-30 | 니혼도꾸슈도교 가부시키가이샤 | 정전 척 |
US10475687B2 (en) * | 2014-11-20 | 2019-11-12 | Sumitomo Osaka Cement Co., Ltd. | Electrostatic chuck device |
KR101950897B1 (ko) * | 2015-09-25 | 2019-02-21 | 스미토모 오사카 세멘토 가부시키가이샤 | 정전 척 장치 |
CN108475657B (zh) * | 2016-01-12 | 2023-12-22 | 住友大阪水泥股份有限公司 | 静电卡盘装置及静电卡盘装置的制造方法 |
CN108475658B (zh) * | 2016-01-19 | 2023-12-22 | 住友大阪水泥股份有限公司 | 静电卡盘装置 |
US11551962B2 (en) * | 2018-03-30 | 2023-01-10 | Sumitomo Osaka Cement Co., Ltd. | Ceramic substrate and susceptor |
-
2020
- 2020-06-10 KR KR1020217033957A patent/KR102632768B1/ko active IP Right Grant
- 2020-06-10 JP JP2021528135A patent/JP7214868B2/ja active Active
- 2020-06-10 CN CN202080047772.4A patent/CN114026681A/zh active Pending
- 2020-06-10 WO PCT/JP2020/022832 patent/WO2020261992A1/ja active Application Filing
-
2021
- 2021-09-03 US US17/465,943 patent/US11948825B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07297265A (ja) * | 1994-04-26 | 1995-11-10 | Shin Etsu Chem Co Ltd | 静電チャック |
JP2003179127A (ja) * | 2001-12-11 | 2003-06-27 | Taiheiyo Cement Corp | 静電チャック用給電端子 |
JP2004095665A (ja) * | 2002-08-29 | 2004-03-25 | Tokyo Electron Ltd | 静電吸着装置および処理装置 |
Also Published As
Publication number | Publication date |
---|---|
CN114026681A (zh) | 2022-02-08 |
KR20210141641A (ko) | 2021-11-23 |
JP7214868B2 (ja) | 2023-01-30 |
US20210398840A1 (en) | 2021-12-23 |
KR102632768B1 (ko) | 2024-02-01 |
WO2020261992A1 (ja) | 2020-12-30 |
US11948825B2 (en) | 2024-04-02 |
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