CN113985702B - 扫描曝光装置、扫描曝光方法以及物品制造方法 - Google Patents

扫描曝光装置、扫描曝光方法以及物品制造方法

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Publication number
CN113985702B
CN113985702B CN202110847346.5A CN202110847346A CN113985702B CN 113985702 B CN113985702 B CN 113985702B CN 202110847346 A CN202110847346 A CN 202110847346A CN 113985702 B CN113985702 B CN 113985702B
Authority
CN
China
Prior art keywords
scanning
substrate
exposure
region
scanning exposure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110847346.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN113985702A (zh
Inventor
上野卓郎
板桥宏明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to CN202511164139.4A priority Critical patent/CN120722674A/zh
Publication of CN113985702A publication Critical patent/CN113985702A/zh
Application granted granted Critical
Publication of CN113985702B publication Critical patent/CN113985702B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70308—Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558—Dose control, i.e. achievement of a desired dose
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085—Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN202110847346.5A 2020-07-27 2021-07-27 扫描曝光装置、扫描曝光方法以及物品制造方法 Active CN113985702B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202511164139.4A CN120722674A (zh) 2020-07-27 2021-07-27 扫描曝光装置、扫描曝光方法以及物品制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-126729 2020-07-27
JP2020126729A JP7550559B2 (ja) 2020-07-27 2020-07-27 走査露光装置、走査露光方法および物品製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202511164139.4A Division CN120722674A (zh) 2020-07-27 2021-07-27 扫描曝光装置、扫描曝光方法以及物品制造方法

Publications (2)

Publication Number Publication Date
CN113985702A CN113985702A (zh) 2022-01-28
CN113985702B true CN113985702B (zh) 2025-08-29

Family

ID=79735073

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202110847346.5A Active CN113985702B (zh) 2020-07-27 2021-07-27 扫描曝光装置、扫描曝光方法以及物品制造方法
CN202511164139.4A Pending CN120722674A (zh) 2020-07-27 2021-07-27 扫描曝光装置、扫描曝光方法以及物品制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202511164139.4A Pending CN120722674A (zh) 2020-07-27 2021-07-27 扫描曝光装置、扫描曝光方法以及物品制造方法

Country Status (3)

Country Link
JP (1) JP7550559B2 (enExample)
KR (1) KR102860264B1 (enExample)
CN (2) CN113985702B (enExample)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201102766A (en) * 2009-07-10 2011-01-16 Canon Kk Exposure apparatus and control method, and apparatus manufacturing method thereof
JP2017053888A (ja) * 2015-09-07 2017-03-16 キヤノン株式会社 露光方法および露光装置、ならびに物品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777724A (en) * 1994-08-24 1998-07-07 Suzuki; Kazuaki Exposure amount control device
KR100422887B1 (ko) 1995-03-16 2005-02-02 가부시키가이샤 니콘 노광장치및방법
JPH08255739A (ja) * 1995-03-16 1996-10-01 Nikon Corp 露光装置
TW463238B (en) * 1997-04-18 2001-11-11 Nippon Kogaku Kk Method and device for exposure control, method and device for exposure, and method of manufacturing the device
JP2000277408A (ja) * 1999-03-23 2000-10-06 Nikon Corp 露光装置および露光方法
US20090203320A1 (en) * 2008-02-07 2009-08-13 Qualcomm Incorporated Asynchronous interference management based on timeslot overlap
JP2013104934A (ja) * 2011-11-11 2013-05-30 Tokyo Electron Ltd 露光装置及び露光方法
JP6243616B2 (ja) 2013-03-26 2017-12-06 キヤノン株式会社 露光装置および物品の製造方法
JP2018010105A (ja) 2016-07-13 2018-01-18 キヤノン株式会社 露光装置、露光方法、および物品製造方法
JP6806236B2 (ja) * 2017-03-17 2021-01-06 株式会社ニコン 照明装置及び方法、露光装置及び方法、並びにデバイス製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201102766A (en) * 2009-07-10 2011-01-16 Canon Kk Exposure apparatus and control method, and apparatus manufacturing method thereof
JP2017053888A (ja) * 2015-09-07 2017-03-16 キヤノン株式会社 露光方法および露光装置、ならびに物品の製造方法

Also Published As

Publication number Publication date
KR20220013914A (ko) 2022-02-04
CN120722674A (zh) 2025-09-30
KR102860264B1 (ko) 2025-09-16
JP7550559B2 (ja) 2024-09-13
CN113985702A (zh) 2022-01-28
JP2022023646A (ja) 2022-02-08

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