JP7550559B2 - 走査露光装置、走査露光方法および物品製造方法 - Google Patents

走査露光装置、走査露光方法および物品製造方法 Download PDF

Info

Publication number
JP7550559B2
JP7550559B2 JP2020126729A JP2020126729A JP7550559B2 JP 7550559 B2 JP7550559 B2 JP 7550559B2 JP 2020126729 A JP2020126729 A JP 2020126729A JP 2020126729 A JP2020126729 A JP 2020126729A JP 7550559 B2 JP7550559 B2 JP 7550559B2
Authority
JP
Japan
Prior art keywords
scanning
substrate
exposure
region
adjustment mechanism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020126729A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022023646A (ja
JP2022023646A5 (enExample
Inventor
卓郎 上野
宏明 板橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2020126729A priority Critical patent/JP7550559B2/ja
Priority to KR1020210094010A priority patent/KR102860264B1/ko
Priority to CN202511164139.4A priority patent/CN120722674A/zh
Priority to CN202110847346.5A priority patent/CN113985702B/zh
Publication of JP2022023646A publication Critical patent/JP2022023646A/ja
Publication of JP2022023646A5 publication Critical patent/JP2022023646A5/ja
Application granted granted Critical
Publication of JP7550559B2 publication Critical patent/JP7550559B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058Mask illumination systems
    • G03F7/70075Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70308Optical correction elements, filters or phase plates for manipulating imaging light, e.g. intensity, wavelength, polarisation, phase or image shift
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70358Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G03F7/70558Dose control, i.e. achievement of a desired dose
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/7085Detection arrangement, e.g. detectors of apparatus alignment possibly mounted on wafers, exposure dose, photo-cleaning flux, stray light, thermal load
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Public Health (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2020126729A 2020-07-27 2020-07-27 走査露光装置、走査露光方法および物品製造方法 Active JP7550559B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2020126729A JP7550559B2 (ja) 2020-07-27 2020-07-27 走査露光装置、走査露光方法および物品製造方法
KR1020210094010A KR102860264B1 (ko) 2020-07-27 2021-07-19 주사 노광장치, 주사 노광방법 및 물품 제조 방법
CN202511164139.4A CN120722674A (zh) 2020-07-27 2021-07-27 扫描曝光装置、扫描曝光方法以及物品制造方法
CN202110847346.5A CN113985702B (zh) 2020-07-27 2021-07-27 扫描曝光装置、扫描曝光方法以及物品制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020126729A JP7550559B2 (ja) 2020-07-27 2020-07-27 走査露光装置、走査露光方法および物品製造方法

Publications (3)

Publication Number Publication Date
JP2022023646A JP2022023646A (ja) 2022-02-08
JP2022023646A5 JP2022023646A5 (enExample) 2023-08-03
JP7550559B2 true JP7550559B2 (ja) 2024-09-13

Family

ID=79735073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020126729A Active JP7550559B2 (ja) 2020-07-27 2020-07-27 走査露光装置、走査露光方法および物品製造方法

Country Status (3)

Country Link
JP (1) JP7550559B2 (enExample)
KR (1) KR102860264B1 (enExample)
CN (2) CN113985702B (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192255A (ja) 2013-03-26 2014-10-06 Canon Inc 露光装置および物品の製造方法
JP2017053888A (ja) 2015-09-07 2017-03-16 キヤノン株式会社 露光方法および露光装置、ならびに物品の製造方法
JP2018010105A (ja) 2016-07-13 2018-01-18 キヤノン株式会社 露光装置、露光方法、および物品製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5777724A (en) * 1994-08-24 1998-07-07 Suzuki; Kazuaki Exposure amount control device
JPH08255739A (ja) * 1995-03-16 1996-10-01 Nikon Corp 露光装置
KR100422887B1 (ko) 1995-03-16 2005-02-02 가부시키가이샤 니콘 노광장치및방법
AU6853698A (en) * 1997-04-18 1998-11-13 Nikon Corporation Method and device for exposure control, method and device for exposure, and method of manufacture of device
JP2000277408A (ja) * 1999-03-23 2000-10-06 Nikon Corp 露光装置および露光方法
US20090203320A1 (en) * 2008-02-07 2009-08-13 Qualcomm Incorporated Asynchronous interference management based on timeslot overlap
JP5451222B2 (ja) * 2009-07-10 2014-03-26 キヤノン株式会社 露光装置及びその制御方法、デバイス製造方法
JP2013104934A (ja) * 2011-11-11 2013-05-30 Tokyo Electron Ltd 露光装置及び露光方法
CN110431487B (zh) * 2017-03-17 2021-08-10 株式会社尼康 照明装置及方法、曝光装置及方法、以及元件制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014192255A (ja) 2013-03-26 2014-10-06 Canon Inc 露光装置および物品の製造方法
JP2017053888A (ja) 2015-09-07 2017-03-16 キヤノン株式会社 露光方法および露光装置、ならびに物品の製造方法
JP2018010105A (ja) 2016-07-13 2018-01-18 キヤノン株式会社 露光装置、露光方法、および物品製造方法

Also Published As

Publication number Publication date
CN113985702A (zh) 2022-01-28
KR20220013914A (ko) 2022-02-04
KR102860264B1 (ko) 2025-09-16
CN113985702B (zh) 2025-08-29
CN120722674A (zh) 2025-09-30
JP2022023646A (ja) 2022-02-08

Similar Documents

Publication Publication Date Title
JP3943280B2 (ja) リソグラフィック投影装置
KR100551209B1 (ko) 리소그래피장치 및 디바이스 제조방법
US20060181692A1 (en) Method and apparatus for controlling radiation beam intensity directed to microlithograhic substrates
KR101626644B1 (ko) 노광 장치, 노광 방법, 디바이스의 제조 방법 및 개구판
CN103293873A (zh) 曝光装置和使用曝光装置的器件制造方法
JP2007335849A (ja) 遮光装置および露光装置
TWI388938B (zh) 曝光設備及裝置製造方法
JP7550559B2 (ja) 走査露光装置、走査露光方法および物品製造方法
US7477357B2 (en) Exposure apparatus and device manufacturing method
KR101662882B1 (ko) 노광 장치 및 물품의 제조 방법
US7397537B2 (en) Exposure apparatus and exposure method
JP3175059B2 (ja) 周辺露光装置及び方法
TW527638B (en) Evaluating method of lithography system, adjusting method for substrate-processing apparatus, lithography system and exposure apparatus
TWI480705B (zh) 照明光學系統、曝光裝置以及元件製造方法
JP2000299273A (ja) 周辺露光装置及び方法
JP7145620B2 (ja) 投影露光装置
JPH01175730A (ja) 露光装置
KR102902254B1 (ko) 노광 장치, 노광 방법 및 물품의 제조 방법
JP7635029B2 (ja) 露光装置、露光方法、及び物品の製造方法
JP6581417B2 (ja) 露光装置、露光方法及び物品の製造方法
JP7399813B2 (ja) フォトマスク
JP7283893B2 (ja) フォトマスクの製造方法
KR20250076387A (ko) 노광 장치, 물품의 제조 방법 및 노광 방법
KR20230168138A (ko) 노광 장치 및 물품의 제조 방법
US20050287446A1 (en) Method for the photolithographic projection of a pattern onto a semiconductor wafer with an alternating phase mask

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20210103

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20210113

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230726

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20230726

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20240325

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20240412

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240606

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240805

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240903

R150 Certificate of patent or registration of utility model

Ref document number: 7550559

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150