CN113906676B - 布线电极 - Google Patents

布线电极

Info

Publication number
CN113906676B
CN113906676B CN202080039487.8A CN202080039487A CN113906676B CN 113906676 B CN113906676 B CN 113906676B CN 202080039487 A CN202080039487 A CN 202080039487A CN 113906676 B CN113906676 B CN 113906676B
Authority
CN
China
Prior art keywords
layer
outer periphery
low
wiring electrode
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202080039487.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN113906676A (zh
Inventor
豊田祐二
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN113906676A publication Critical patent/CN113906676A/zh
Application granted granted Critical
Publication of CN113906676B publication Critical patent/CN113906676B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/877—Conductive materials
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/125—Driving means, e.g. electrodes, coils
    • H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
    • H03H9/14538—Formation
    • H03H9/14541—Multilayer finger or busbar electrode
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
CN202080039487.8A 2019-05-30 2020-05-29 布线电极 Active CN113906676B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019-100853 2019-05-30
JP2019100853 2019-05-30
PCT/JP2020/021307 WO2020241820A1 (ja) 2019-05-30 2020-05-29 配線電極

Publications (2)

Publication Number Publication Date
CN113906676A CN113906676A (zh) 2022-01-07
CN113906676B true CN113906676B (zh) 2025-07-25

Family

ID=73553184

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202080039487.8A Active CN113906676B (zh) 2019-05-30 2020-05-29 布线电极

Country Status (5)

Country Link
US (1) US11985903B2 (https=)
JP (1) JP7268730B2 (https=)
KR (1) KR102711174B1 (https=)
CN (1) CN113906676B (https=)
WO (1) WO2020241820A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12308818B2 (en) 2023-01-03 2025-05-20 Win Semiconductors Corp. Surface acoustic wave device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0318031A (ja) 1989-06-14 1991-01-25 Fujitsu Ltd 半導体装置の製造方法
JPH07307549A (ja) * 1994-05-11 1995-11-21 Toshiba Corp 薄膜配線パターンの形成方法および薄膜配線基板の製造方法
AU2690400A (en) * 1999-02-24 2000-09-14 Hitachi Maxell, Ltd. Ic device and its production method, and information carrier mounted with ic device and its production method
JP2001305996A (ja) * 2000-02-18 2001-11-02 Seiko Epson Corp 表示装置用基板及びその製造方法、並びに液晶装置及び電子機器
AU2002361093A1 (en) * 2001-12-28 2003-07-24 Matsushita Electric Industrial Co., Ltd. Surface acoustic wave device, electronic component using the device, and composite module
TWI232991B (en) * 2002-11-15 2005-05-21 Nec Lcd Technologies Ltd Method for manufacturing an LCD device
JP5561057B2 (ja) 2010-09-15 2014-07-30 株式会社村田製作所 電子部品及びその製造方法
WO2012176392A1 (ja) * 2011-06-24 2012-12-27 パナソニック株式会社 半導体装置及びその製造方法
JP6011108B2 (ja) * 2011-09-27 2016-10-19 日亜化学工業株式会社 半導体素子
US10536132B2 (en) 2014-11-18 2020-01-14 Kyocera Corporation Elastic wave element, filter element, and communication device
JP2017073630A (ja) * 2015-10-06 2017-04-13 株式会社村田製作所 弾性波装置の製造方法及び弾性波装置
JP6884062B2 (ja) * 2017-07-25 2021-06-09 京セラ株式会社 配線基板
JP2019060819A (ja) * 2017-09-28 2019-04-18 日本特殊陶業株式会社 電子部品検査装置用配線基板

Also Published As

Publication number Publication date
WO2020241820A1 (ja) 2020-12-03
CN113906676A (zh) 2022-01-07
JP7268730B2 (ja) 2023-05-08
JPWO2020241820A1 (https=) 2020-12-03
KR20220002537A (ko) 2022-01-06
US20220077377A1 (en) 2022-03-10
US11985903B2 (en) 2024-05-14
KR102711174B1 (ko) 2024-09-30

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