JPWO2020241820A1 - - Google Patents
Info
- Publication number
- JPWO2020241820A1 JPWO2020241820A1 JP2021522895A JP2021522895A JPWO2020241820A1 JP WO2020241820 A1 JPWO2020241820 A1 JP WO2020241820A1 JP 2021522895 A JP2021522895 A JP 2021522895A JP 2021522895 A JP2021522895 A JP 2021522895A JP WO2020241820 A1 JPWO2020241820 A1 JP WO2020241820A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/877—Conductive materials
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02992—Details of bus bars, contact pads or other electrical connections for finger electrodes
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14538—Formation
- H03H9/14541—Multilayer finger or busbar electrode
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019100853 | 2019-05-30 | ||
| JP2019100853 | 2019-05-30 | ||
| PCT/JP2020/021307 WO2020241820A1 (ja) | 2019-05-30 | 2020-05-29 | 配線電極 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2020241820A1 true JPWO2020241820A1 (https=) | 2020-12-03 |
| JPWO2020241820A5 JPWO2020241820A5 (https=) | 2022-01-18 |
| JP7268730B2 JP7268730B2 (ja) | 2023-05-08 |
Family
ID=73553184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021522895A Active JP7268730B2 (ja) | 2019-05-30 | 2020-05-29 | 配線電極 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US11985903B2 (https=) |
| JP (1) | JP7268730B2 (https=) |
| KR (1) | KR102711174B1 (https=) |
| CN (1) | CN113906676B (https=) |
| WO (1) | WO2020241820A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12308818B2 (en) | 2023-01-03 | 2025-05-20 | Win Semiconductors Corp. | Surface acoustic wave device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307549A (ja) * | 1994-05-11 | 1995-11-21 | Toshiba Corp | 薄膜配線パターンの形成方法および薄膜配線基板の製造方法 |
| WO2003058813A1 (en) * | 2001-12-28 | 2003-07-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device, electronic component using the device, and composite module |
| WO2012176392A1 (ja) * | 2011-06-24 | 2012-12-27 | パナソニック株式会社 | 半導体装置及びその製造方法 |
| JP2013084906A (ja) * | 2011-09-27 | 2013-05-09 | Nichia Chem Ind Ltd | 半導体素子 |
| WO2016080444A1 (ja) * | 2014-11-18 | 2016-05-26 | 京セラ株式会社 | 弾性波素子、フィルタ素子および通信装置 |
| JP2019024062A (ja) * | 2017-07-25 | 2019-02-14 | 京セラ株式会社 | 配線基板 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0318031A (ja) | 1989-06-14 | 1991-01-25 | Fujitsu Ltd | 半導体装置の製造方法 |
| AU2690400A (en) * | 1999-02-24 | 2000-09-14 | Hitachi Maxell, Ltd. | Ic device and its production method, and information carrier mounted with ic device and its production method |
| JP2001305996A (ja) * | 2000-02-18 | 2001-11-02 | Seiko Epson Corp | 表示装置用基板及びその製造方法、並びに液晶装置及び電子機器 |
| TWI232991B (en) * | 2002-11-15 | 2005-05-21 | Nec Lcd Technologies Ltd | Method for manufacturing an LCD device |
| JP5561057B2 (ja) | 2010-09-15 | 2014-07-30 | 株式会社村田製作所 | 電子部品及びその製造方法 |
| JP2017073630A (ja) * | 2015-10-06 | 2017-04-13 | 株式会社村田製作所 | 弾性波装置の製造方法及び弾性波装置 |
| JP2019060819A (ja) * | 2017-09-28 | 2019-04-18 | 日本特殊陶業株式会社 | 電子部品検査装置用配線基板 |
-
2020
- 2020-05-29 JP JP2021522895A patent/JP7268730B2/ja active Active
- 2020-05-29 CN CN202080039487.8A patent/CN113906676B/zh active Active
- 2020-05-29 KR KR1020217038803A patent/KR102711174B1/ko active Active
- 2020-05-29 WO PCT/JP2020/021307 patent/WO2020241820A1/ja not_active Ceased
-
2021
- 2021-11-17 US US17/528,227 patent/US11985903B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307549A (ja) * | 1994-05-11 | 1995-11-21 | Toshiba Corp | 薄膜配線パターンの形成方法および薄膜配線基板の製造方法 |
| WO2003058813A1 (en) * | 2001-12-28 | 2003-07-17 | Matsushita Electric Industrial Co., Ltd. | Surface acoustic wave device, electronic component using the device, and composite module |
| WO2012176392A1 (ja) * | 2011-06-24 | 2012-12-27 | パナソニック株式会社 | 半導体装置及びその製造方法 |
| JP2013084906A (ja) * | 2011-09-27 | 2013-05-09 | Nichia Chem Ind Ltd | 半導体素子 |
| WO2016080444A1 (ja) * | 2014-11-18 | 2016-05-26 | 京セラ株式会社 | 弾性波素子、フィルタ素子および通信装置 |
| JP2019024062A (ja) * | 2017-07-25 | 2019-02-14 | 京セラ株式会社 | 配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020241820A1 (ja) | 2020-12-03 |
| CN113906676A (zh) | 2022-01-07 |
| JP7268730B2 (ja) | 2023-05-08 |
| KR20220002537A (ko) | 2022-01-06 |
| US20220077377A1 (en) | 2022-03-10 |
| CN113906676B (zh) | 2025-07-25 |
| US11985903B2 (en) | 2024-05-14 |
| KR102711174B1 (ko) | 2024-09-30 |
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