CN113678257A - 显示面板、显示装置及显示面板的制作方法 - Google Patents
显示面板、显示装置及显示面板的制作方法 Download PDFInfo
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- CN113678257A CN113678257A CN202080000111.6A CN202080000111A CN113678257A CN 113678257 A CN113678257 A CN 113678257A CN 202080000111 A CN202080000111 A CN 202080000111A CN 113678257 A CN113678257 A CN 113678257A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 239000010410 layer Substances 0.000 claims abstract description 480
- 239000002184 metal Substances 0.000 claims abstract description 195
- 239000000758 substrate Substances 0.000 claims abstract description 104
- 239000012044 organic layer Substances 0.000 claims abstract description 102
- 239000004065 semiconductor Substances 0.000 claims abstract description 25
- 239000002346 layers by function Substances 0.000 claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 17
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 description 20
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- 239000011347 resin Substances 0.000 description 2
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- 230000008054 signal transmission Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
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- 238000003698 laser cutting Methods 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
一种显示面板(1)、显示装置及显示面板(1)的制作方法。显示面板(1)包括显示区域(10)和围绕显示区域(10)的非显示区域(20);显示面板(1)的结构包括基板(41),以及位于基板(41)的一侧且沿远离基板(41)的方向依次设置的缓冲层(42)、半导体层(43)、第一无机绝缘层(44)、第一金属层(45)、第二无机绝缘层(46)、第二金属层(47)、第三无机绝缘层(48)、第三金属层(49)、第一有机层(50)、阳极层(51)、像素界定层(52)、有机功能层(53)和阴极层(54);非显示区域(20)包括电路板绑定区(201),在电路板绑定区(201),第一无机绝缘层(44)、第二无机绝缘层(46)和第三无机绝缘层(48)中的至少一个的边界与基板(41)的边界重合,第一有机层(50)的边界和像素界定层(52)的边界均与基板(41)的边界之间具有间距。
Description
PCT国内申请,说明书已公开。
Claims (24)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2020/074815 WO2021159293A1 (zh) | 2020-02-12 | 2020-02-12 | 显示面板、显示装置及显示面板的制作方法 |
Publications (1)
Publication Number | Publication Date |
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CN113678257A true CN113678257A (zh) | 2021-11-19 |
Family
ID=77291989
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202080000111.6A Pending CN113678257A (zh) | 2020-02-12 | 2020-02-12 | 显示面板、显示装置及显示面板的制作方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20220344418A1 (zh) |
CN (1) | CN113678257A (zh) |
WO (1) | WO2021159293A1 (zh) |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100709255B1 (ko) * | 2005-08-11 | 2007-04-19 | 삼성에스디아이 주식회사 | 평판 표시 장치 및 그 제조 방법 |
KR101677266B1 (ko) * | 2010-02-12 | 2016-11-18 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이의 제조 방법 |
US9666814B2 (en) * | 2014-03-07 | 2017-05-30 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
CN107799538B (zh) * | 2017-10-26 | 2020-06-19 | 上海天马微电子有限公司 | 一种显示面板和显示装置 |
KR102483236B1 (ko) * | 2017-11-09 | 2022-12-30 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
CN108389868A (zh) * | 2018-02-26 | 2018-08-10 | 武汉华星光电技术有限公司 | 阵列基板及显示面板 |
CN108807227B (zh) * | 2018-05-24 | 2021-06-04 | 武汉华星光电半导体显示技术有限公司 | 用于切割显示面板的切割装置和切割方法、显示面板 |
KR102605335B1 (ko) * | 2018-06-27 | 2023-11-27 | 삼성디스플레이 주식회사 | 발광 표시 장치 및 그의 제조 방법 |
CN109659444B (zh) * | 2018-11-29 | 2021-04-23 | 昆山国显光电有限公司 | 显示面板及显示装置 |
CN109659324B (zh) * | 2018-12-18 | 2021-01-15 | 武汉华星光电半导体显示技术有限公司 | 一种显示面板及其制作方法 |
CN109713019A (zh) * | 2019-01-17 | 2019-05-03 | 深圳市华星光电技术有限公司 | Oled显示面板及其制作方法 |
CN110196656B (zh) * | 2019-05-16 | 2023-01-20 | 云谷(固安)科技有限公司 | 显示面板和显示装置 |
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2020
- 2020-02-12 WO PCT/CN2020/074815 patent/WO2021159293A1/zh active Application Filing
- 2020-02-12 US US17/421,227 patent/US20220344418A1/en active Pending
- 2020-02-12 CN CN202080000111.6A patent/CN113678257A/zh active Pending
Also Published As
Publication number | Publication date |
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US20220344418A1 (en) | 2022-10-27 |
WO2021159293A1 (zh) | 2021-08-19 |
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