CN1136649C - 电力组件 - Google Patents
电力组件 Download PDFInfo
- Publication number
- CN1136649C CN1136649C CNB001350579A CN00135057A CN1136649C CN 1136649 C CN1136649 C CN 1136649C CN B001350579 A CNB001350579 A CN B001350579A CN 00135057 A CN00135057 A CN 00135057A CN 1136649 C CN1136649 C CN 1136649C
- Authority
- CN
- China
- Prior art keywords
- power supply
- supply wiring
- column
- mentioned
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
- H02P25/00—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details
- H02P25/02—Arrangements or methods for the control of AC motors characterised by the kind of AC motor or by structural details characterised by the kind of motor
- H02P25/08—Reluctance motors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Dc-Dc Converters (AREA)
- Power Conversion In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000161599A JP4004715B2 (ja) | 2000-05-31 | 2000-05-31 | パワーモジュール |
| JP161599/2000 | 2000-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1326262A CN1326262A (zh) | 2001-12-12 |
| CN1136649C true CN1136649C (zh) | 2004-01-28 |
Family
ID=18665601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001350579A Expired - Fee Related CN1136649C (zh) | 2000-05-31 | 2000-12-07 | 电力组件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6541838B1 (https=) |
| JP (1) | JP4004715B2 (https=) |
| CN (1) | CN1136649C (https=) |
| DE (1) | DE10105086B4 (https=) |
| FR (1) | FR2809882B1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104247247A (zh) * | 2012-09-20 | 2014-12-24 | 富士电机株式会社 | 半导体模块 |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10024377B4 (de) * | 2000-05-17 | 2006-08-17 | Infineon Technologies Ag | Gehäuseeinrichtung und darin zu verwendendes Kontaktelement |
| JP2003060157A (ja) * | 2001-08-08 | 2003-02-28 | Mitsubishi Electric Corp | パワーモジュール |
| FR2829661B1 (fr) * | 2001-08-17 | 2004-12-03 | Valeo Equip Electr Moteur | Module de composants electroniques de puissance et procede d'assemblage d'un tel module |
| JP2005064479A (ja) * | 2003-07-31 | 2005-03-10 | Sanyo Electric Co Ltd | 回路モジュール |
| DE102004059313B3 (de) * | 2004-12-09 | 2006-05-04 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit verringerten parasitären Induktivitäten |
| JP5321124B2 (ja) | 2009-02-23 | 2013-10-23 | 三菱電機株式会社 | 半導体スイッチング装置 |
| JP5188653B2 (ja) * | 2010-07-06 | 2013-04-24 | 三菱電機株式会社 | インバータ |
| WO2012039114A1 (ja) * | 2010-09-24 | 2012-03-29 | オンセミコンダクター・トレーディング・リミテッド | 回路装置 |
| JP5558401B2 (ja) * | 2011-03-30 | 2014-07-23 | 三菱電機株式会社 | 電力変換装置 |
| JP5866792B2 (ja) * | 2011-04-08 | 2016-02-17 | 日産自動車株式会社 | 電力変換装置 |
| JP5808630B2 (ja) * | 2011-09-28 | 2015-11-10 | 株式会社ミツバ | Srモータ用制御装置 |
| EP2858100B1 (en) * | 2012-05-29 | 2020-06-10 | NSK Ltd. | Semiconductor module and production method for same |
| JP6107949B2 (ja) * | 2013-06-20 | 2017-04-05 | 富士電機株式会社 | 半導体モジュール |
| JP6207460B2 (ja) * | 2014-05-19 | 2017-10-04 | 三菱電機株式会社 | 半導体装置 |
| JP2017077102A (ja) * | 2015-10-15 | 2017-04-20 | 株式会社Ihi | 半導体パワーモジュール |
| US11515253B2 (en) * | 2018-01-26 | 2022-11-29 | Shindengen Electric Manufacturing Co., Ltd. | Electronic module |
| KR102850381B1 (ko) * | 2021-09-16 | 2025-08-27 | 현대모비스 주식회사 | 파워 모듈 |
| WO2025094349A1 (ja) * | 2023-11-02 | 2025-05-08 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3274926D1 (en) | 1981-05-12 | 1987-02-05 | Lucas Ind Plc | A multi-phase bridge arrangement |
| US5025360A (en) | 1989-12-20 | 1991-06-18 | Sundstrand Corporation | Inverter switch with parallel free-wheel diodes |
| JP2725952B2 (ja) | 1992-06-30 | 1998-03-11 | 三菱電機株式会社 | 半導体パワーモジュール |
| DE59304797D1 (de) | 1992-08-26 | 1997-01-30 | Eupec Gmbh & Co Kg | Leistungshalbleiter-Modul |
| JP3193827B2 (ja) * | 1994-04-28 | 2001-07-30 | 三菱電機株式会社 | 半導体パワーモジュールおよび電力変換装置 |
| JPH1169840A (ja) * | 1997-08-22 | 1999-03-09 | Aisin Seiki Co Ltd | スイッチングアセンブリ |
| US6249024B1 (en) * | 1998-12-09 | 2001-06-19 | International Rectifier Corp. | Power module with repositioned positive and reduced inductance and capacitance |
| JP4220094B2 (ja) * | 1999-04-05 | 2009-02-04 | 三菱電機株式会社 | パワー半導体モジュール |
| JP3501685B2 (ja) * | 1999-06-04 | 2004-03-02 | 三菱電機株式会社 | 電力変換装置 |
-
2000
- 2000-05-31 JP JP2000161599A patent/JP4004715B2/ja not_active Expired - Fee Related
- 2000-11-06 US US09/705,770 patent/US6541838B1/en not_active Expired - Fee Related
- 2000-12-07 CN CNB001350579A patent/CN1136649C/zh not_active Expired - Fee Related
-
2001
- 2001-01-11 FR FR0100320A patent/FR2809882B1/fr not_active Expired - Fee Related
- 2001-02-05 DE DE10105086A patent/DE10105086B4/de not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104247247A (zh) * | 2012-09-20 | 2014-12-24 | 富士电机株式会社 | 半导体模块 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE10105086A1 (de) | 2001-12-13 |
| JP4004715B2 (ja) | 2007-11-07 |
| JP2001346384A (ja) | 2001-12-14 |
| DE10105086B4 (de) | 2009-04-23 |
| FR2809882B1 (fr) | 2003-10-31 |
| FR2809882A1 (fr) | 2001-12-07 |
| CN1326262A (zh) | 2001-12-12 |
| US6541838B1 (en) | 2003-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20040128 Termination date: 20131207 |